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IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM 6-10J: Design Guidelines for IoT-Based Products Task Group Committee Chair: Savita Ganjigatti, Vice President, SiennaECAD Location: 207D
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM 7-25A: Automated Optical Inspection Process Control Standard Task Group Committee Chair: Feng Xue, IBM Infrastructure General Committee: Process Control Event Type: Standards Development Meeting Location: 207A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM 7-34T: IPC-7711 7721 Training Committee Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc. Committee Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems General Committee: Product Assurance Event Type: Standards Development Meeting Location: 210B
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM D-11: Flexible Printed Board Design Subcommittee Committee Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc. General Committee: Flexible and Rigid-Flex Printed Boards Event Type: Standards Development Meeting Location: 213D
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM D-23: High Speed High Frequency Base Materials Subcommittee General Committee: High Speed/High Frequency Interconnections Event Type: Standards Development Meeting Location: 209B
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:30 PM Design Community Townhall Event Type: Special Event Location: 304CD
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM ESDS Control Plan Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 207C
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM S19: Factory of the Future 3: Digital Twin and Automation Instructor/Speaker: Yu Xian Ang, Team Leader, camLine Sdn. Bhd. Instructor/Speaker: Mohan Rangan Govindaraj, R&D Manager, Siemens EDA Focus: Factory of the Future Event Type: Technical Conference Location: 303A Achieving Equipment Orchestration Through Equipment Integration Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM S20: Assembly Materials 1 Instructor/Speaker: Ukai Ryuji, Researcher, Senju Metal Industry Co., LTD Instructor/Speaker: Kazuya Kitazawa, Manager, Senju Metal Industry Co., LTD Instructor/Speaker: Gayle Towell, Content Marketing Specialist, AIM Solder Instructor/Speaker: Hongwen Zhang PhD, Principal Research Metallurgist, RnD Manager of Alloy Group, Indium Corporation Instructor/Speaker: Timothy O'Neill, Director of Product Management, AIM Solder Focus: Assembly Materials Event Type: Technical Conference Location: 303B Development and Enhancement of Low Temperature Soldering Solution for SMT Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Ass
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM S21: HDI, uHDI AND SUBSTRATES 2 Instructor/Speaker: Chris Ryder, Director of Business Development, MKS Instruments Instructor/Speaker: Henning Hübner, Global Product Manager PP, MKS Atotech Instructor/Speaker: Xin Huang PhD, Manager, DELTON TECHNOLOGY (GUANGZHOU)INC. Focus: HDI, uHDI and Substrates Event Type: Technical Conference Location: 304AB CO2 Laser-Direct Drilling of Blind Via in Brown Oxidized Copper Clad Laminate Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation New Solutions for Inclusion-Free Copper Filling of Through Vias for Latest Generation Substrate Desi

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