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Programs: 31 - 40 of 194
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Board Talk Part 1
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Bo
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards
Instructor/Speaker: Philippe Jaeckle PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Corina Stocker, Senior Expert, Continental
Instructor/Speaker: Heike Woldt, Head of Product Development Press-fit Technology, Diehl Metal Applications
Instructor/Speaker: Frank Uibel, CEO, Uibel Consulting
Instructor/Speaker: Hermann Eicher, Project Manager R&D, EPT GmbH
Instructor/Speaker: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303C
PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303D
PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN,
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD19: Chiplet Design and Heterogeneous Integration (SiP)
Instructor/Speaker: John Lau PhD, Sr. Special Project Assistant, Unimicron
Focus: Design
Event Type: Professional Development
Location: 304D
PD19: Chiplet Design and Heterogeneous Integration (SiP)
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD20: Flex Circuit ‘Design for Manufacturing Principles’ Circuit Design, Fabrication and SMT Assembly Processing
Instructor/Speaker: Vern Solberg, Design Engineer, STC
Focus: Design
Event Type: Professional Development
Location: 304C
PD20: Flex Circuit ‘Design for Manufacturing Principles’
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities
Instructor/Speaker: Jennie Hwang PhD, CEO, H-Technologies Group
Focus: Factory of the Future
Event Type: Professional Development
Location: 304AB
PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213A
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Committee Chair: Thomas Marktscheffel, Director of R&D, ASMPT GmbH & Co. KG
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 208A
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
5-23A: Printed Board Solderability
Committee Chair: Ernst Eggelaar, CEO, Microtronic
Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207A
IPC APEX EXPO 2024
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Committee Chair: Bhanu Sood PhD, Deputy Chief Technologist, Office of the Director, NASA Goddard Space Flight Center
Committee Chair: Raj Kumar, Northrop Grumman Space Systems
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 207D