Toggle navigation
Home
New Products
Product Showcase
New Products
Videos
Exhibitors
Floor Plan
Programs
Programs
Instructor/Speaker(s)
Register
Log In
Print List of Programs
Search
Date
Sat, Apr 6th, 2024
Sun, Apr 7th, 2024
Mon, Apr 8th, 2024
Tue, Apr 9th, 2024
Wed, Apr 10th, 2024
Thu, Apr 11th, 2024
Fri, Apr 12th, 2024
Event Type
Management
Poster Presentations
Professional Development
Special Event
Standards Development Meeting
Technical Conference
Focus
Assembly Materials
Assembly Process and Materials
Assembly Processes
Design
Emerging Technologies
Factory of the Future
HDI, uHDI and Substrates
High Reliability
PCB Fabrication
PCB Fabrication and Materials
Quality, Reliability, Test and Inspection
Sustainability for Electronics
General Committee
Assembly and Joining
Base Materials
Cleaning and Coating
Data Generation & Transfer/Documentation
Electronic Packaging Design
Electronic Product Data Description
Embedded Devices
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Materials and Supplier Declarations Committee
PCB Fabrication and Materials
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Terms and Definitions
Testing
Speaker
Aaron Kennedy, Summit Interconnect - Anaheim
Adam Klett PhD, KYZEN Corporation
Albert Block, National Instruments
Allen Keeney, Johns Hopkins University
Andreas Karch, Indium Advanced Material, Indium Corporation
Anthony Lentz, FCT Assembly, Inc.
Ara Parsekian PhD, PulseForge, Inc.
Benoit Dagenais, Innovative Vehicle Institute
Beverley Christian, HDP User Group
Bhanu Sood PhD, NASA Goddard Space Flight Center
Bob Neves, MicroTek
Botao Zhang
Brenda Baney, BCubed Consulting
Brian Chislea, Dow Corning
Britta Schafsteller PhD, MKS Instrumentsnts
Caleb Ancharski, AGC
CanJun Xiang, Delton Technology(GuangZhou) Inc.
Carlos Plaza, IPC
Catherine Hanlin, Precision Manufacturing Company, Inc.
Cecilia Rios, Hi-Tek Electronics
Chi-Ho Kuan PhD, Unimicron
Chiew Yee Ho, Intel Microelectronics Asia LLC
Chiou Kuo-Chan PhD, ITRI MCL
Chris Mitchell, IPC
Chris Ryder, MKS Instruments
Chris Shaw, Fujitsu Network Communications
Christina Landon, Naval Surface Warfare Ctr
Chuck LePard, DXC Technology
Chung Chih-Yeh PhD, Nanya PCB
Colin Poedtke, Uyemura International Corporation
Corina Stocker, Continental
Cory Blaylock, IPC
Dale Lee, Plexus Corporation
Dana Korf, Nano Dimension
Daniel Hamann, SMT Thermal Discoveries
Darren Hitchcock, Panasonic Industrial Devices Sales Company of America
Dave Sbiroli, Indium
David Caputa, Lockheed Martin Corporation
David Hollingsworth, Ascentron (an Emerald EMS company)
Debbie Wade, Advanced Rework Technology
Dieter Weiss, in4ma
Dr. John W. Mitchell, IPC
Dr. Kenneth Church, Sciperio Inc.
Dr. Stanton Rak, SF Rak Company
E. Jan Vardaman, TechSearch International, Inc.
Ed Kelley, Four Peaks Innovation
Eddie Hofer, Collins Aerospace
Edward Nauss, ITW/EAE
Eillie Chiang, Yuan Ze University
Emily Lamport, University of Massachusetts Lowell
Enold Pierre-Louis, Aerospace Corp
Eric Camden, Foresite, Inc.
Erik Bergum, Founder PCB USA
Erika Crandall PhD, TE Connectivity
Ernst Eggelaar, Microtronic
Evan Griffith, Indium Corporation
Feng Xue, IBM Infrastructure
Fil Arzola, Raytheon Intelligence & Space
Fonda Wu, Raytheon Company
Francis Mullany, iNEMI
Frank Honyotski, STI Electronics, Inc.
Frank Richter PhD, Greenectra
Frank Uibel, Uibel Consulting
Gang Liu, Shennan Circuits Co. Ltd.
Garry McGuire, NASA Marshall Space Flight Center
Gary Brist, HDP User Group
Gary Cheng, EMC
Gause Hu, Lenovo
Gayle Towell, AIM Solder
George Millman, Raytheon Missile Systems
George Tristan, Ball Aerospace & Technologies Corp.
Gerard O'Brien, Solderability Testing & Solutions, Inc.
Gerjan Diepstraten, ITWEAE
Gerry Partida, Summit Interconnect - Anaheim
Greg Ruscak, Telsonic
Hannes Voraberger PhD, AT&S
Hanui Kim PhD, Samsung Electro-Mechanics
Harmut Liebel
Harry Yang PhD, MacDermid Alpha Electronic Solutions
Heike Woldt, Diehl Metal Applications
Helena Pasquito, EPTAC Corporation
Henning Hübner, MKS Atotech
Henrik Blegvad Jensen, Gaasdal Bygningsindustri A/S
Herb Snogren, Bristlecone LLC
Hermann Eicher, EPT GmbH
Hidenori Abe, Resonac
Hiroyuki Watanabe, NEC Platforms Ltd.
Hongwen Zhang PhD, Indium Corporation
Ife Hsu, Intel Corporation
Ingrid Swenson, TTM Technologies, Inc.
Irene Hou, AOSHIKANG TECHNOLOGY / ASK PCB
JB Hollister, Apple Inc.
Jamie Noland, Blackfox Training Institute
Jan Pedersen, Elmatica AS
Jasbir Bath, Bath Consultancy
Jason Benoit, Sciperio
Jason Gooden, Anthesis
Jason Keeping, Celestica International L.P.
Jeff Schake, ASM Assembly Systems
Jeff Shubrooks, Raytheon Company
Jennie Hwang PhD, H-Technologies Group
Jennifer Fijalkowski, MacDermid Alpha Electronic Solutions
Jhih-Hong Cheng PhD, CHPT
Jim Hall, ITM Consulting
Jimmy Hsu, Intel Corporation
JingHui Peng, Delton Technology(GuangZhou) Inc.
Joe O'Neil
John Lau PhD, Unimicron
John Mastorides, Honeywell Aerospace
Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Jose Rios, Raytheon
Joseph Kane, BAE Systems
Julie Mouzan, Circuit Foil
Junji Yoshikawa, OKUNO CHEMICAL INDUSTRIES CO.,LTD
Kalyan Nukala, ZESTRON Americas
Karen McConnell, Northrop Grumman
Karl Sauter, Oracle America, Inc.
Kaspar Tsang, Lenovo
Kat Ermant, Peloton
Kathy Yan PhD, TSMC
Kazuko Andersen, JEITA
Kazuya Kitazawa, Senju Metal Industry Co., LTD
Kevin Bivona, AGC Multi Material America
Kevin Kusiak, Lockheed Martin Corporation
Kristopher S. Moyer, IPC and CSUS
Kuldip Johal, Atotech Group
Kunal Shah PhD, LILOTREE
Kyle Baker, MKS Instruments
KyoungSoo Kim, ISU Petasys
Lance Auer, Conductor Analysis Technologies, Inc.
Leo Lambert, EPTAC Corporation
Lothar Henneken PhD, Robert Bosch GmbH
Louis Ungar, A.T.E. Solutions, Inc.
Lu Xiao, Shengyi Electronics Co.,Ltd
Lucas Enright, National Institute of Standards and Technology (NIST)
Maarten Cauwe PhD, imec
Malgorzata Celuch PhD, QWED Sp. z o. o.
Mandy Krott, Robert Bosch GmbH
Manuel Galvez, MKS Instruments, Inc.
Marie Parliman, BAE Systems
Marius Tarnovetchi, VItesco Technologies
Mark Finstad, Flexible Circuit Technologies, Inc.
Mark Pollard, Astute
Mark Shields, Nan Ya Plastics Corporation
Mark Wolfe, IPC
Marzena Olszewska-Placha, QWED
Matt Gallaugher PhD, Momentive Technologies
Matt Kelly, IPC
Matthias Zapatka Dipl.-Ing. (FH), CIS, INGUN USA, Inc.
Meijuan Sarah Kuang, Kinwong Electronic Technology (Longchuan) Co., Ltd.
Michael Carano, IPC
Michael Creeden, Insulectro
Michael Dickey PhD, NC State University
Michael Orsini, MacDermid Alpha Electronics Solutions
Michael Schleicher, Semikron Danfoss
Michelle Gleason, Plexus Corp.
Mike Bixenman DBA, Magnalytix, LLC
Mike Feng, Founder PCB
Milea Kammer, Honeywell International
Miloš Lazic, Indium Corporation
Min Park PhD, Haesung DS
Minsu Lee, Korea Packaging Integration Association
Mohan Rangan Govindaraj, Siemens EDA
Mr. Jefferson Leach, Momentive Technologies
Neil Hubble, Akrometrix
Nicholas Kao, SPIL
Nichole Thilges, Raytheon Missile Systems
Nick Koop, TTM Technologies
Nikki Johnson, Source Intelligence
Olaf Schoenfeld PhD, Zestron
Outi Rusanen MSc, LicSc, DSc (Tech.), TactoTek
Patrick Stockbruegger, LPKF Laser & Electronics SE
Paul Cooke, Ventec
Paul Wang PhD, MBA, Tyan Computer (a MiTAC company)
Phil Zarrow, ITM Consulting
Philippe Jaeckle PhD, Robert Bosch GmbH
Pietro Vergine, Advanced Rework Technology
Raj Kumar, Northrop Grumman Space Systems
Ram Wissel, KYZEN Corporation
Randall Flinders, GreenSoft Technology Inc.
Randall Sherman, New Venture Research
Randy Wu PhD, ITRI EOSL
Ray Prasad, Ray Prasad Consultancy Group
Reginald Lai, Intel Corporation
Reinhardt Seidel PhD, Friedrich-Alexander-Universit
Reza Ghaffarian PhD, Jet Propulsion Laboratory
Richard R. Davis, TRUMPF
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Richard Wessel, DuPont Electronics & Imaging
Rick Nichols, Greensource
Rick Shanks, Pratt & Whitney
Rita Mohanty PhD, Henkel
Robert Cooke, NASA Johnson Space Center
Robert Kinyanjui, John Deere Electronic Solutions
Robert Rowland, Axiom Electronics, LLC
Russell Shepherd, NTS - Anaheim
Ryan Chang, Intel
Ryusuke Ueki, Qualtec Co., Ltd.
Sai Boyapati, AMD
Saminda Dharmarathna PhD, Macdermid Alpha Electronics Solutions
Samuel McMaster PhD, MInstP, MIMMM, MInstCT, Pillarhouse International
Samuel Oladji, Intel Corporation
Satoru Kuramochi, Dia Nippon Printing
Savita Ganjigatti, SiennaECAD
Scarlet Yi Wang, Shengyi Technology Co., LTD.
Scott Bowles, Lockheed Martin Corporation
Scott Chen, TPCA
Scott Meyer, Collins Aerospace
Scott Pinney, Grundfos Holding A/S
Sean Shi, Shennan Circuits Co., Ltd
Shawn Dubravac, IPC
Shekhar Chandrashekhar, iNEMI
Shuming Gao, Zhejiang University
Stan Heltzel, European Space Agency-ESA
Stephen Golemme, ITX Inc.
Steve Martell, Nordson ASYMTEK
Steven Bowles, Lockheed Martin Corporation
Sunny Agarwal, ITWEAE
Symon Franklin, Custom Interconnect Ltd
Takahiro Matsufuji, Senju Metal Industry Co., LTD
Tarja Rapala, EIPC
Terry Fischer, Showa Denko Materials (America), Inc.
Terry Hoffman, Cisco Systems Inc.
Terry Wright, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Thomas Gottwald, Schweizer Electronic AG
Thomas Keily, JPS Composite Materials Corp.
Thomas Marktscheffel, ASMPT GmbH & Co. KG
Thomas Sanders PhD, Jet Propulsion Laboratory
Tiberiu Baranyi, Flextronics
Tim Burke PhD, Arch Systems Inc
Timothy O'Neill, AIM Solder
Ting-Hao Lin, Kinsus
Todd Harris, Intel
Todd MacFadden, Bose Corporation
Tom Dory PhD, Fujifilm Electronic Materials USA
Tom Rovere, Lockheed Martin
Tomoaki Nakanishi, AGC Multi Material America
Tony Lentz, FCT Solder
Tony Senese, Panasonic
Torrey Clark, Dow Corporation
Troy Diaz, X2F
Tyler Siebert, Lockheed Martin Missiles & Fire Control
Udo Welzel PhD, Robert Bosch GmbH
Ukai Ryuji, Senju Metal Industry Co., LTD
Urmi Ray, iNEMI
Vern Solberg, STC
Victor Xu, Huawei Technologies Co. Ltdol
Victoria Hawkins, IPC
Walter Jager, ECD Compliance
Wei Ken Hee, Vitrox Technologies Sdn Bhd
William Capen, Honeywell FM&T
Xin Huang PhD, DELTON TECHNOLOGY (GUANGZHOU)INC.
Yang-Hung Cheng, MPI Corpoation
Yu Hsuan Chen, Intel Corporation
Yu Xian Ang, camLine Sdn. Bhd.
Yuntao Li PhD, SABIC
Zhi Chao Zhang, Delton Technology (Guang Zhou) Inc.
Zhiman Susann Chen, ZhuZhou CRRC Times Electric Co., Ltd.
Zhiqian Sang, Hangzhou Dianzi University
Zook Kim, Samsung Electro-Mechanics
Location
207A
207B
207C
207D
208A
208B
209A
209B
210A
210B
210CD
213A
213B
213C
213D
303A
303B
303C
303D
304AB
304C
304CD
304D
Ballroom A
Ballroom D
California Terrace
Exhibit Halls C & D
Exhibit Halls C & D-Aisle 700
Pacific Terrace
Programs: 191 - 194 of 194
Programs per Page
5
10
20
30
50
100
500
1000
All
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 11:30 AM to 2:00 PM
Special Technical Session:EV Electronics: Design, Manufacturing,and Reliability Challenges
Instructor/Speaker: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation
Instructor/Speaker: Zhiman Susann Chen, Senior Engineer, ZhuZhou CRRC Times Electric Co., Ltd.
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Bob Neves, Chairman and CTO, MicroTek
Instructor/Speaker: Dave Sbiroli, Principal Engineer, Indium
Instructor/Speaker: Michael Schleicher, PCB Designer, Semikron Danfoss
Instructor/Speaker: Olaf Schoenfeld PhD, European Sales Manager, Zestron
Instructor/Speaker: Thomas Gottwald, Vice President, Technology, Schweizer Electronic AG
Instructor/Speaker: Richard R. Davis, Head of North American Automotive Sales, TRUMPF
Committee Chair: Dr. Stanton Rak, SF Rak Company
Event Type: Technical Conference
Location: 304AB
Special Technical Session: EV Electronics: Design, Manufacturing, and Reliability Challenges
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Due Diligence Task Group Meeting
Committee Chair: Kazuko Andersen, Deputy Director, JEITA
Committee Chair: Nikki Johnson, Director Environmental Engineering, Source Intelligence
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 208A
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 2:00 PM to 3:00 PM
World Convention Closing Ceremony & Keynote: The Next Wave in Electronics: Trends Reshaping Our Industry
Instructor/Speaker: Shawn Dubravac, IPC Chief Economist, IPC
Event Type: Special Event
Location: Ballroom D
IPC APEX EXPO 2024
Fri, Apr 12, 2024 - 8:00 AM to 5:00 PM
PERM 56
Event Type: Standards Development Meeting
Location: 207D
«
1
2
3
4
...
17
18
19
20
Go to Page
