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Programs: 1 - 10 of 194
IPC APEX EXPO 2024
Sat, Apr 6, 2024 - 8:00 AM to 5:00 PM
Saturday: 5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 8:00 AM to 4:45 PM
7-31A/D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Committee Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210CD
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD01: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part 1
Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Focus: Design
Event Type: Professional Development
Location: 303A
PD01: Design for Excellence: Part 1
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD02: Developing a Qualified Manufacturing Package per IPC J-STD-001H ~ Section 8: Cleanliness - Part 1
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD02: Developing a Qualified Manufacturing Package per IPC J-STD-001H ~ Section 8: Cleanliness Part1
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD03: Develop a Robust Selective Soldering Process
Instructor/Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303C
PD03: Develop a Robust Selective Soldering Process
PD03: Develop a Robust Selective Soldering Process (2)
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD04: PWB Design Engineering – Let’s Get Constrained and Engineer That Board Design!
Instructor/Speaker: Fil Arzola, Senior Principal Electrical Engineer, Raytheon Intelligence & Space
Focus: Design
Event Type: Professional Development
Location: 303D
PD04: PWB Design Engineering – Let’s Get Constrained and Engineer That Board Design!
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD05: Material Compliance Reporting - Internal Needs and Customer Formats
Instructor/Speaker: Brenda Baney, CEO, BCubed Consulting
Focus: Sustainability for Electronics
Event Type: Professional Development
Location: 304D
PD05: Material Compliance Reporting - Internal Needs and Customer Formats
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD06: Intro to 3D Printing, Part 1: Harnessing the Language of Additive Manufacturing
Instructor/Speaker: Kat Ermant, Additive Manufacturing Consultant, Lead AM Prototype Engineer, Peloton
Focus: Emerging Technologies
Event Type: Professional Development
Location: 304C
PD06: Intro to 3D Printing, Part 1: Harnessing the Language of Additive Manufacturing
IPC APEX EXPO 2024
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD07: High Reliability Electronics for Harsh Environments
Instructor/Speaker: Jennie Hwang PhD, CEO, H-Technologies Group
Focus: High Reliability
Event Type: Professional Development
Location: 304AB
PD07: High Reliability Electronics for Harsh Environments