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Programs: 171 - 180 of 194
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Committee Chair: Michelle Gleason, Staff DFX Engineer, Plexus Corp.
General Committee: Electronic Packaging Design
Event Type: Standards Development Meeting
Location: 207D
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S23: Assembly Processes 3
Instructor/Speaker: Samuel McMaster PhD, MInstP, MIMMM, MInstCT, Research & Development Specialist, Pillarhouse International
Instructor/Speaker: Paul Wang PhD, MBA, VP of Global Quality and Technology Engineering, Tyan Computer (a MiTAC company)
Instructor/Speaker: Ara Parsekian PhD, Senior Applications Engineer, PulseForge, Inc.
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303A
Process Challenges for Selective Soldering: Examining Parameters for Optimal Processing
iNEMI 2023 Board Assembly-CPU Socket Interposer Technology Roadmap
Optimization of Photonic Soldering Processes for SIR Performance
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S24: Assembly Materials 2
Instructor/Speaker: Takahiro Matsufuji, Researcher, Senju Metal Industry Co., LTD
Instructor/Speaker: Tony Lentz, Chemist & Field Application, FCT Solder
Instructor/Speaker: Troy Diaz, Lead Mechanical Engineer, X2F
Focus: Assembly Materials
Event Type: Technical Conference
Location: 303B
Advanced Heat Removal, an Electronics Overmolding Advantage
Development and Enhancement for Low Temperature Wave Soldering Solution
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints.
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:30 PM
S25: HDI, uHDI AND SUBSTRATES 3
Instructor/Speaker: Enold Pierre-Louis, Technical Fellow, Aerospace Corp
Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd
Instructor/Speaker: Todd Harris, Packaging R&D Engineer, Intel
Instructor/Speaker: Caleb Ancharski, Research Chemist, AGC
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Microvia Fatigue Life Design Study Findings to Mitigate Functional Failures
Microvia Reliability Using a Simple Test Vehicle
Stacked Microvia Reliability and Test Methodology Evaluation
Research on Electroplating Capability of Multi-Layer Interconnected Deep Microvia PCB Based on Simul
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S26: PCB Fab 7: Printed Board Platings and Finishes 2
Instructor/Speaker: Colin Poedtke, Technical Service Engineer, Uyemura International Corporation
Instructor/Speaker: Michael Orsini, Application Chemist, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Junji Yoshikawa, Manager, OKUNO CHEMICAL INDUSTRIES CO.,LTD
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Next Generation Reduction Assisted Immersion Gold
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Achieving a Successful ENEPIG Finished PCB Under Revision A of IPC 4556
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
Strategic Workforce Development: Navigating Apprenticeships and Beyond – Tailored Insights for Universal Employers
Event Type: Special Event
Location: 209A
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 5:00 PM to 6:00 PM
2-40 Electronic Documentation Technology Committee
Location: 208A
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 7:00 AM to 2:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
2-10 Electronic Product Data Description Committee
Location: 207B
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Committee Chair: Beverley Christian, Project Facilitator, HDP User Group
Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207A