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Programs: 131 - 140 of 194
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 9:15 AM to 4:15 PM
Taiwan High-Tech Forum
Committee Chair: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Scott Chen, Vice Chairman, TPCA
Instructor/Speaker: Kathy Yan PhD, Director, TSMC
Instructor/Speaker: Nicholas Kao, Department Manager, SPIL
Committee Chair: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions
Instructor/Speaker: Matt Kelly, CTO & VP Technology Solutions, IPC
Instructor/Speaker: Chi-Ho Kuan PhD, Sr. Dir. Business Development, Unimicron
Instructor/Speaker: Ting-Hao Lin, Senior Director, Kinsus
Instructor/Speaker: Jhih-Hong Cheng PhD, Project Leader Engineer, CHPT
Instructor/Speaker: Randy Wu PhD, Manager, ITRI EOSL
Instructor/Speaker: Gary Cheng, Assistant Manager, EMC
Instructor/Speaker: Mark Shields, USA Marketing Director, Nan Ya Plastics Corporation
Instructor/Speaker: Chiou Kuo-Chan PhD, Deputy General Director, ITRI MCL
Instructor/Speaker: Chung Chih-Yeh PhD, Senior Specialist, Nanya PCB
Instructor/Speaker: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions
Event Type: Special Event
Location: Ballroom A
Taiwan High-Tech Forum1
Taiwan High-Tech Forum2
Taiwan High-Tech Forum3
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 9:30 AM to 11:30 AM
mmWave Material and Test Roadmap and Standard Development 
Instructor/Speaker: Urmi Ray, mmWave Project Lead, iNEMI
Instructor/Speaker: Lucas Enright, PhD Student, Professional Research Experience Program (PREP) Associate, National Institute of Standards and Technology (NIST)
Instructor/Speaker: Marzena Olszewska-Placha, Vice President for Research and Development, QWED
Instructor/Speaker: Shekhar Chandrashekhar, CEO, iNEMI
Event Type: Special Event
Location: 209B
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
1-14: DFX Standards Subcommittee
Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
Committee Chair: Pietro Vergine, President, Advanced Rework Technology
Committee Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc.
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 207C
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Committee Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213B
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Committee Chair: Minsu Lee, Manager, Korea Packaging Integration Association
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207A
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-12: Microsection Subcommittee
Committee Chair: Allen Keeney, Johns Hopkins University
General Committee: Testing
Event Type: Standards Development Meeting
Location: 213A
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31AT & D-33AT: IPC-A-600 and IPC-6012 Training Joint Meeting
Committee Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31K/7-31H: Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207D
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D