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Programs: 91 - 100 of 194
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 210A
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Michael Creeden, Technical Director Design Education, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213D
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
Committee Chair: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213C
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
D-67A, D-67B and D-67C: Joint Task Group Meeting
Committee Chair: Dana Korf, Nano Dimension
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 208B
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 4:00 PM
iNEMI Roadmap Workshop: Future Evolution of PCB Design-for-X
Instructor/Speaker: Francis Mullany, Director of Roadmapping, iNEMI
Instructor/Speaker: Jasbir Bath, Owner, Bath Consultancy
Instructor/Speaker: Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Event Type: Special Event
Location: 303C
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 6:00 PM
IPC Design Competition Finals
Event Type: Standards Development Meeting
Location: 213B
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S05: QRTI 1: Inspection and Test 1
Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions, Inc.
Instructor/Speaker: Yu Hsuan Chen, Hardware Engineer, Intel Corporation
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Matthias Zapatka Dipl.-Ing. (FH), CIS, CTO+FAE, INGUN USA, Inc.
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Modular RF Test Enclosure / Test Fixture Combinations: Design, Innovations and Characterization
Statistical Analysis of Full-scope In-board Electrical Characterization for Partial Plane-on-Outer-L
Automatic Testing of High-Speed I/O in Manufacturing
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S06: High Reliability for Extreme Requirements
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Thomas Sanders PhD, Parts Failure Engineer, Jet Propulsion Laboratory
Instructor/Speaker: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
Focus: High Reliability
Event Type: Technical Conference
Location: 304AB
Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist
QFN Assembly Reliability Under a New HALT Test Method
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S07: PCB Fab 2: Laminate Materials 1
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: Neil Hubble, President, Akrometrix
Instructor/Speaker: Mandy Krott, Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH
Instructor/Speaker: Tony Senese, Manager, R&D and Business Development, NA, Panasonic
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs
HDP Users Group Thermal Analysis Methodology Assessment
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage