Search

Programs: 81 - 90 of 194
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-25A: Design and Test Requirements for High Speed Connectors in High Reliability Applications
Committee Chair: Hermann Eicher, Project Manager R&D, EPT GmbH
Committee Chair: Robert Kinyanjui, John Deere Electronic Solutions
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 213A
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S01: Sustainability for Electronics 1: Materials
Instructor/Speaker: Scarlet Yi Wang, Technical Marketing Director, Shengyi Technology Co., LTD.
Instructor/Speaker: Andreas Karch, Technical Manager (Germany, Austria, Switzerland) / Technologist – Advanced Applications, Indium Advanced Material, Indium Corporation
Instructor/Speaker: Jennifer Fijalkowski, Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions
Instructor/Speaker: Yuntao Li PhD, Lead Scientist, SABIC
Instructor/Speaker: Daniel Hamann, Sales Manager Europe and Key Accounts, SMT Thermal Discoveries
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve Up
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S02: Design
Instructor/Speaker: Savita Ganjigatti, Vice President, SiennaECAD
Instructor/Speaker: Chiew Yee Ho, Hardware Engineer, Intel Microelectronics Asia LLC
Instructor/Speaker: Meijuan Sarah Kuang, Tech. Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd.
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Ryan Chang, Engineer, Intel
Focus: Design
Event Type: Technical Conference
Location: 303B
Innovative Hybrid Solder Mask for Coupling Reduction in High-Speed Application
Impact of CPU Pin Pattern Orientation to High-Speed Interconnect Data Center Board Designs With Inte
Latest PCIe Generation PCB Design and simulations: Overcoming Design, Cost, Yield, Technology Tradeo
Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S03: Factory of the Future 1: AI & Machine Learning
Instructor/Speaker: Wei Ken Hee, Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd
Instructor/Speaker: Ryusuke Ueki, Leader of the AI Research Lab, Qualtec Co., Ltd.
Instructor/Speaker: Reinhardt Seidel PhD, Research Assistant, Friedrich-Alexander-Universit
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Machine-Learning Based Solderability Check of THT Solder Joints
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S04: PCB Fab 1: Flex, Hybrid
Instructor/Speaker: Kaspar Tsang, Senior Development Manager of Infrastructure Solutions Group, Lenovo
Instructor/Speaker: Lu Xiao, Senior Chief Engineer, Shengyi Electronics Co.,Ltd
Instructor/Speaker: Terry Wright, CTO, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Gause Hu, Manager, Lenovo
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
The Improvement of Warp in Rigid-Flex Board
The Study of Resin Flow Indentation for Rigid-Flex PCB
Study on the Influencing Factors of Interlayer Reliability of Rigid-Flex Board with Multiple Air-Gap
Asymmetric Hybrid Printed Circuit Board Design and Flexibility Study for High-speed Data Center Plat
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Committee Chair: Michael Carano, VP Technology and Bus. Dev, IPC
Event Type: Standards Development Meeting
Location: 209A
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 12:00 PM to 1:30 PM
Tuesday Luncheon | IPC Annual Meeting and Awards
Event Type: Special Event
Location: Ballroom D
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
2-12D: Digital Sustainability Credentials Standard Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Committee Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace
Committee Chair: Scott Meyer, Collins Aerospace
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207B
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207D