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Programs: 121 - 130 of 194
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 304CD
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Committee Chair: Russell Shepherd, General Manager - Anaheim, NTS - Anaheim
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Committee Chair: Herb Snogren, Consultant, Bristlecone LLC
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 207A
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Committee Chair: Jason Gooden, Executive Director, Anthesis
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 207B
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S11: QRTI3 : Quality and Reliability 1
 
Instructor/Speaker: Zook Kim, Engineer, Package Solution Team, Samsung Electro-Mechanics
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Instructor/Speaker: Hanui Kim PhD, Senior Engineer, Samsung Electro-Mechanics
Instructor/Speaker: Irene Hou, Business Development & Marketing Director, AOSHIKANG TECHNOLOGY / ASK PCB
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303A
Research on High Potential Capability of Energy PCB
Does Functional Circuitry Drift as Leakage Currents Form?
Investigation of Factors Influencing SR/Cu Interface Adhesion
Substrate Warpage Incurred from Panel grab at PCB Manufacturing
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S12: Assembly Processes 1
Instructor/Speaker: Edward Nauss, Sr. Applications Engineer, ITW/EAE
Instructor/Speaker: Ram Wissel, Vice President of Global Technology, KYZEN Corporation
Instructor/Speaker: Evan Griffith, Product Specialist, Indium Corporation
Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation
Instructor/Speaker: Kalyan Nukala, Application Engineer, ZESTRON Americas
Instructor/Speaker: Patrick Stockbruegger, Product Manager, LPKF Laser & Electronics SE
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303B
Sealed Versus Exposed Atmosphere Solder Printing Comparison for Type-6 Powder Solder Paste
Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Prin
Strategies for Enhanced Reliability in the Cleaning of Vented Components
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S13: PCB Fab 4: RF Materials, Low Loss Materials
Instructor/Speaker: Tomoaki Nakanishi, Scientist, AGC Multi Material America
Instructor/Speaker: Eillie Chiang, Master's Degree Student, Yuan Ze University
Instructor/Speaker: Min Park PhD, Haesung DS, Haesung DS
Instructor/Speaker: Britta Schafsteller PhD, Global Product Manager, MKS Instrumentsnts
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
The Impact of Final Finishes and Thermal Aging on Insertion Loss at Frequencies Up to 150 GHz
The Formulating Technology of Extremely Low Loss PCB Material for 112/224 Gbps Without Sacrificing R
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graph
High-frequency Signal Characteristics of Differential Striplines with Different Cu-Foil Roughness
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S14: Factory of the Future 2: Additive Manufacturing
Instructor/Speaker: Emily Lamport, PhD Student, University of Massachusetts Lowell
Instructor/Speaker: Jason Benoit, Mechanical Engineer, Sciperio
Instructor/Speaker: Michael Dickey PhD, Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering, NC State University
Instructor/Speaker: Tom Rovere, Research Scientist, Associate Fellow, Lockheed Martin
Instructor/Speaker: Dr. Kenneth Church, CEO & Founder, Sciperio Inc.
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Liquid Metal Patterning for Electronic Circuits and Thermal Management
Reliability Validation of Direct-Write Printed RF Devices
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 9:00 AM to 11:00 AM
IPC Global Update
Event Type: Special Event
Location: 210A