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	Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM D-24B: Bereskin Test Method Task Group Presenter/Committee Chair: David Wynants, Taconic Advanced Dielectric Division Seminar Type: Standard Development Committee Track: Quality, Reliability and Test General Committee: High Spped/High Frequency Interconnections Location: 16B
	Tue, Jan 29, 2019 - 3:15 PM to 5:00 PM D-33AA: IPC-6012 Automotive Addendum Task Group Presenter/Committee Chair: Jan Pedersen, Elmatica AS Seminar Type: Standard Development Committee Location: 11A
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM BZ2: How IPC-2581 Enables Industry 4.0 Presenter/Committee Chair: Ed Acheson, Cadence Design Systems Inc. Presenter/Committee Chair: Terry Hoffman, Cisco Systems Inc. Presenter/Committee Chair: Hemant Shah, Cadence Design Systems Inc. Speaker: Michael Ford, Aegis Software Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC Seminar Type: Buzz Session Location: Room 4 BZ2: How IPC-2581 Enables Industry 4.0
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S10: PCB Surface Finishes I Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: 6D S10: PCB Surface Finishes I
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S06: Printed Electronics I Presenter/Committee Chair: Stanton Rak, Head of Materials Technology, Continental Automotive Speaker: Woonhong Yeo, Georgia Institute of Technology Presenter/Committee Chair: Benjamin Leever, Advanced Development Team Leader, Air Force Research Laboratory Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: ROOM 2 S06: Printed Electronics I
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S07: PCB/Microvia Reliability Jeff Schake, Senior Engineer, ASM Assembly Systems Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: 6C S07: PCB/Microvia Reliability
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM S09: Test/Inspection II Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: 1B S09: Test/Inspection II
	Tue, Jan 29, 2019 - 5:00 PM to 6:00 PM Complimentary Show Floor Reception Seminar Type: Special Event
	Wed, Jan 30, 2019 - 7:30 AM to 8:30 AM Technical Conference Speaker's Breakfast (By Invitation) Seminar Type: Special Event Location: Room 3
	Wed, Jan 30, 2019 - 7:30 AM to 9:00 AM 2-16D: :IPC-2581 User's Group Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC Presenter/Committee Chair: Kevin Kusiak, Lockheed Martin Space Systems Company Seminar Type: Standard Development Committee Track: PCB Fabrication, Materials and Design General Committee: Electronic Product Data Description Location: 10

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