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Programs: 161 - 170 of 204

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	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S21: High Speed/High Frequency Laminate Materials Used in Design Speaker: David Hoover, Sr Field Application Engineer, TTM Technologies Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Location: ROOM 2 S21: High Speed/High Frequency Laminate Materials Used in Design
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM Training Committee Orientation Meeting Seminar Type: Standard Development Committee Location: 17B
	Wed, Jan 30, 2019 - 2:30 PM to 3:30 PM Ice Cream Social On The Show Floor Seminar Type: Special Event
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM 5-31G: Stencil Cleaning Task Group Presenter/Committee Chair: Mike Bixenman, Kyzen Corporation Presenter/Committee Chair: Greg Wade, Indium Corporation Seminar Type: Standard Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 8
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM 8-41: Technology Roadmap Subcommittee Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Presenter/Committee Chair: John Fisher, Interconnect Technology Anlysis Inc. Seminar Type: Standard Development Committee Track: Supply Chain/Business Issues General Committee: Managemnet Location: 11A
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM B-11: 3-D Electronic Packages Subcommittee Presenter/Committee Chair: Dudi Amir, Intel Corporation Presenter/Committee Chair: Vern Solberg, Solberg Technical Consulting Seminar Type: Standard Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Packaged Electronic Components Location: 12
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM Certification Committee Orientation Meeting Seminar Type: Standard Development Committee Location: 17B
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM D-13: Flexible Circuits Base Materials Subcommittee Presenter/Committee Chair: Clark Webster, ALL Flex LLC Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 14B
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM D-21: High Speed/High Frequency Design Subcommittee Presenter/Committee Chair: Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: High Spped/High Frequency Interconnections Location: 17A
	Wed, Jan 30, 2019 - 3:15 PM to 5:00 PM IPC Solder Products Value Council Seminar Type: Management Track: PCB Fabrication and Materials Location: 11B

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