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	Wed, Jan 30, 2019 - 10:15 AM to 12:00 PM D-12: Flexible Circuits Specifications Subcommittee Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 12
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM BZ4: Impacts of Warpage on SMT Processes Presenter/Committee Chair: Brook Sandy-Smith, Technical Support Engineer, IPC Seminar Type: Buzz Session Location: Room 4 Impacts of Warpage on SMT Processes
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S12: Printed Electronics II Presenter/Committee Chair: Weifeng Liu, Flextronics International Seminar Type: Technical Conference Session Track: Printed Electronics Track Location: 6D S12: Printed Electronics II
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S13: PCB Fabrication and Plating II Speaker: Stanton Rak, Head of Materials Technology, Continental Automotive Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: 6C S13: PCB Fabrication and Plating II
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S14: Low Temperature Alloys II Presenter/Committee Chair: Milos Lazic, Indium Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: ROOM 1A S14: Low Temperature Alloys II
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S15: Adhesives/Silicone Greases Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 2 Location: ROOM 2 S15: Adhesives/Silicone Greases
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly Presenter/Committee Chair: Martin Goetz, Sr. Manager, Northrop Grumman Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 3 Design Location: 1B S16: Designing Additive Manufacturing/ 3D Printing into PCB Fabrication And Assembly
	Wed, Jan 30, 2019 - 12:00 PM to 1:30 PM Event Awards Luncheon Seminar Type: Special Event Location: 6A
	Wed, Jan 30, 2019 - 12:00 PM to 1:00 PM Tradeshow Committee Meeting(By Invitation) Seminar Type: Standard Development Committee Location: 17A
	Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM 2-18: Supplier Declaration Subcommittee Seminar Type: Standard Development Committee Location: 7A

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