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	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S20: Cleaning Speaker: Denis Jean, Kester Seminar Type: Technical Conference Session Track: Cleaning Location: ROOM 1B S20: Cleaning
	Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM 4-30: EHS Committee Seminar Type: Standard Development Committee Location: 6E
	Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM 5-21M: Cold Joining/Press-fit Task Group Presenter/Committee Chair: Hans-Peter Tranitz, Continental Automotive GmbH Presenter/Committee Chair: Udo Welzel, Development Engineer, Robert Bosch Co. Ltd. Seminar Type: Standard Development Committee Location: 14A
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM 5-24F: Underfill Materials Design, Selection and Process Task Group Presenter/Committee Chair: Brian Toleno, Principal Material Scientist, Microsoft Corporation Presenter/Committee Chair: Bill Vuono, Qorvo Seminar Type: Standard Development Committee Track: Assembly Processes for Lead Free and Tin-Lead General Committee: Assembly and Joining Location: 8
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM 7-12: Microsection Subcommittee Presenter/Committee Chair: Russell Sheperd Seminar Type: Standard Development Committee Track: Test General Committee: Testing Location: 12
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM D-11: Flexible Circuits Design Subcommittee Presenter/Committee Chair: William Ortloff, Raytheon Company Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Flexible and Rigid-Flex Printed Boards Location: 14B
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM D-23: High Speed/High Frequency Base Materials Subcommittee Presenter/Committee Chair: Edward Sandor, Taconic Advanced Dielectric Division Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: High Spped/High Frequency Interconnections Location: 11B
	Wed, Jan 30, 2019 - 1:30 PM to 5:00 PM D-60: Printed Electronics Committee Reporting Session Presenter/Committee Chair: Neil Bolding, MacDermid Enthone Electronics Solutions Presenter/Committee Chair: Daniel Gamota, Printovate Technologies Seminar Type: Standard Development Committee General Committee: Printed Electronics Location: 16B
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testing Presenter/Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track S18: Reliability / Embedded Components/ Power Electronics/ Thermal Modelling/ Mechanical Shock Testi
	Wed, Jan 30, 2019 - 1:30 PM to 3:00 PM S19: Solder Paste/ Reliability II Presenter/Committee Chair: Milos Lazic, Indium Corporation Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: ROOM 1A S19: Solder Paste/ Reliability II

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