Research & Development Specialist

Pillarhouse International

Sam McMaster completed his PhD in 2021 on the nanomechanical characterisation of diamond-like carbon coatings and how this affects the film tribological performance. He is a multi-disciplinary researcher with expertise in surface engineering, materials science and tribology....

Speaker Type: Speaker

Packaging RD Engineer

Intel Corporation

Samuel Oladji is a Packaging RD engineer at Intel Corporation with over 2 years of experience in the semiconductor industry.

Speaker Type: Speaker

Executive Chief Researcher

Dia Nippon Printing

Satoru Kuramochi received B.E. and M.E. degrees in image science engineering from Chiba University, in 1987 and 1989, respectively.,He joined the Research and Development Center, Dai Nippon Printing Co., Ltd., Japan, in 1989....

Speaker Type: Speaker, Instructor/Speaker

Vice President

SiennaECAD

Savita Ganjigatti is serving as Vice President of Engineering at Sienna ECAD Technologies, a subsidiary of Avalon group. Supported customers globally in the area of High speed Digital,RF, Power electronics and communications....

Speaker Type: Speaker

Technical Marketing Director

Shengyi Technology Co., LTD.

Scarlet has bachelor’s degree in Polymer material and engineering. She has 19 years laminate and PCB technical support experience in Shengyi Technology....

Speaker Type: Speaker, Instructor/Speaker

Electronic PMP Materials Engineer, Sr. Staff

Lockheed Martin Corporation

Bio Available Soon

Vice Chairman

TPCA

Speaker Type: Speaker, Instructor/Speaker

Collins Aerospace

Bio Available Soon

Grundfos Holding A/S

Speaker Type: Committee Chair

Global FAE Manager

Shennan Circuits Co., Ltd

Sean SHI has been working in ShennanCircuits for 17 years, he now is Global FAE Manager leading a team to provide technical support for customers on pre-simulation, product design, manufacturing techn...

Speaker Type: Speaker