Senior Engineer

Shennan Circuit Co., Ltd

Mr. Wang is engaged in the improvement of the printed circuit board process capabilities and the research and development of new proucts.

Speaker Type: Speaker

Northrop Grumman

Speaker Type: Committee Chair, Speaker

Principal Engineer

Oracle America, Inc.

Bio Available Soon

Senior Development Manager of Infrastructure Solutions Group

Lenovo

Kaspar Tsang is currently the Senior Development Manager of Infrastructure Solutions Group at Lenovo, responsible for PCBA Electronic Components, Interconnects and PCB advanced technology management and deployment in data center server systems....

Speaker Type: Speaker

Additive Manufacturing Consultant, Lead AM Prototype Engineer

Peloton

With a background in fine arts, Kat brings a unique perspective to manufacturing and prototyping. She specializes in digital fabrication and has provided her clients, employers, and teammates with invaluable rapid prototyping and hands-on experience....

Speaker Type: Speaker

Director

TSMC

Kathy Yan, currently Director of New Technology & System Integration, Advance Packaging and Test at TSMC. She is now in charge of new CoWoS-R organic interposer technology RD development for high speed HPC application, advanced packaging mechanical and thermal simulation & validation....

Speaker Type: Speaker

Deputy Director

JEITA

Bio Available Soon

Manager

Senju Metal Industry Co., LTD

Speaker Type: Speaker

R&D Lab Manager

AGC Multi Material America

Kevin Bivona has been in the electronics materials industry since 2020, but before that spent several years working on specialty materials for a major coatings company based in Pittsburgh, PA. Since j...

Speaker Type: Speaker

LM Associate Fellow

Lockheed Martin Corporation

Bio Available Soon