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IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM 7-25A: Automated Optical Inspection Process Control Standard Task Group Committee Chair: Feng Xue, IBM Infrastructure General Committee: Process Control Event Type: Standards Development Meeting Location: 207A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM 7-34T: IPC-7711 7721 Training Committee Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc. Committee Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems General Committee: Product Assurance Event Type: Standards Development Meeting Location: 210B
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM D-11: Flexible Printed Board Design Subcommittee Committee Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc. General Committee: Flexible and Rigid-Flex Printed Boards Event Type: Standards Development Meeting Location: 213D
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM D-23: High Speed High Frequency Base Materials Subcommittee General Committee: High Speed/High Frequency Interconnections Event Type: Standards Development Meeting Location: 209B
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM ESDS Control Plan Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 207C
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 3:00 PM to 5:00 PM 7-25B AOI Process Control for IC Substrates Standard Task Group Committee Chair: Botao Zhang General Committee: Process Control Event Type: Standards Development Meeting Location: 207A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM 7-31N: Manual Magnification Aides Task Group Committee Chair: Leo Lambert, Vice President, EPTAC Corporation Event Type: Standards Development Meeting Location: 210A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM B-10A: Plastic Chip Carrier Cracking Task Group Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr Committee Chair: Steve Martell, Nordson ASYMTEK General Committee: Packaged Electronic Components Event Type: Standards Development Meeting Location: 213A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM D-13: Flex Circuits Base Materials Committee Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging General Committee: Flexible and Rigid-Flex Printed Boards Event Type: Standards Development Meeting Location: 213D
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM D-21C: High Speed/High Frequency Controlled Impedance T.G General Committee: High Speed/High Frequency Interconnections Event Type: Standards Development Meeting Location: 207C

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