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IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 1:30 PM to 6:00 PM IPC Design Competition Finals Event Type: Standards Development Meeting Location: 213B
IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 3:00 PM to 5:00 PM 7-34: IPC-7711/21 Rework, Repair and Modification Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc. General Committee: Product Assurance Event Type: Standards Development Meeting Location: 208B
IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM 2-12B: Model Based Definition (MBD) for Digital Twins Task Group Committee Chair: Shuming Gao, Professor, Zhejiang University Committee Chair: Victor Xu, Huawei Technologies Co. Ltdol Committee Chair: Zhiqian Sang, Hangzhou Dianzi University General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 213A
IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM 5-24C: Solder Alloy Task Group Committee Chair: Milea Kammer, Engineering Manager, Honeywell International General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 207D
IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM 5-33F: Potting and Encapsulation Task Group Committee Chair: Brian Chislea, AETS, Dow Corning Committee Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation General Committee: Cleaning and Coating Event Type: Standards Development Meeting Location: 210CD
IPC APEX EXPO 2024	Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM EMS Steering Committee Event Type: Standards Development Meeting Location: 210A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM 2-12C: Cybersecurity Protection Standard Task Group Committee Chair: Hiroyuki Watanabe, CO, NEC Platforms Ltd. General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 213B
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM 2-16D: IPC-2581 Users Task Group Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 207C
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM 5-21E: Solder Stencil Task Group Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 213A
IPC APEX EXPO 2024	Wed, Apr 10, 2024 - 8:00 AM to 12:00 PM 5-21M: Cold Joining/Press-fit Task Group Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 213C

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