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IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM 4-14F: ENEPIG Task Group Committee Chair: Jose Rios, Senior Principal Quality Engineer/Supplier Quality Manage, Raytheon General Committee: Product Assurance Event Type: Standards Development Meeting Location: 207A
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM 5-21F: Ball Grid Array Task Group Committee Chair: Robert Rowland, Engineering Manager, Axiom Electronics, LLC General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 210A
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM 5-33A: Conformal Coating Task Group Committee Chair: Brian Chislea, AETS, Dow Corning General Committee: Cleaning and Coating Event Type: Standards Development Meeting Location: 210CD
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM 7-31FT: IPC/WHMA-A-620 Training Committee Committee Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technology General Committee: Product Assurance Event Type: Standards Development Meeting Location: 210B
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM D-61B/D-64B: Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification joint meeting Committee Chair: Jeff Shubrooks, Raytheon Company General Committee: Printed Electronics Event Type: Standards Development Meeting Location: 207C
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM 2-19A: Critical Components Traceability Task Group General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 207C
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM 3-12E:Base Materials Roundtable Task Group Committee Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc. General Committee: Base Materials Event Type: Standards Development Meeting Location: 213D
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM 4-14B: ENIG Task Group Committee Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc. General Committee: PCB Fabrication and Materials Event Type: Standards Development Meeting Location: 207A
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM 5-21G: Flip Chip Mounting Task Group Committee Chair: Ife Hsu, Technology & Standards Development Lead, Intel Corporation General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 210A
IPC APEX EXPO 2024	Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM D-35: Printed Board Storage and Handling Subcommittee Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems General Committee: Rigid Printed Boards Event Type: Standards Development Meeting Location: 207D

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