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Programs: 21 - 30 of 31
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S19: Factory of the Future 3: Digital Twin and Automation
Instructor/Speaker: Yu Xian Ang, Team Leader, camLine Sdn. Bhd.
Instructor/Speaker: Mohan Rangan Govindaraj, R&D Manager, Siemens EDA
Focus: Factory of the Future
Event Type: Technical Conference
Location: 303A
Achieving Equipment Orchestration Through Equipment Integration
Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S20: Assembly Materials 1
Instructor/Speaker: Ukai Ryuji, Researcher, Senju Metal Industry Co., LTD
Instructor/Speaker: Kazuya Kitazawa, Manager, Senju Metal Industry Co., LTD
Instructor/Speaker: Gayle Towell, Content Marketing Specialist, AIM Solder
Instructor/Speaker: Hongwen Zhang PhD, Principal Research Metallurgist, RnD Manager of Alloy Group, Indium Corporation
Instructor/Speaker: Timothy O'Neill, Director of Product Management, AIM Solder
Focus: Assembly Materials
Event Type: Technical Conference
Location: 303B
Development and Enhancement of Low Temperature Soldering Solution for SMT
Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Ass
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S21: HDI, uHDI AND SUBSTRATES 2
Instructor/Speaker: Chris Ryder, Director of Business Development, MKS Instruments
Instructor/Speaker: Henning Hübner, Global Product Manager PP, MKS Atotech
Instructor/Speaker: Xin Huang PhD, Manager, DELTON TECHNOLOGY (GUANGZHOU)INC.
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
CO2 Laser-Direct Drilling of Blind Via in Brown Oxidized Copper Clad Laminate
Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
New Solutions for Inclusion-Free Copper Filling of Through Vias for Latest Generation Substrate Desi
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S22: PCB Fab 6: Printed Board Platings and Finishes 1
Instructor/Speaker: Rick Nichols, Technical Marketing Director, Greensource
Instructor/Speaker: Mike Feng, Technical Expert, Founder PCB
Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Study of Hole Wall Cracking Defects in Power Module Heavy Copper Printed Circuit Boards
Study on Carbon Removal of Shadow Residue from Flexible Plate Surface in Rigid-Flex PCB
A Study of the Impacts of Physical Parameters on Electrolytic Panel Plating
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S23: Assembly Processes 3
Instructor/Speaker: Samuel McMaster PhD, MInstP, MIMMM, MInstCT, Research & Development Specialist, Pillarhouse International
Instructor/Speaker: Paul Wang PhD, MBA, VP of Global Quality and Technology Engineering, Tyan Computer (a MiTAC company)
Instructor/Speaker: Ara Parsekian PhD, Senior Applications Engineer, PulseForge, Inc.
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303A
Process Challenges for Selective Soldering: Examining Parameters for Optimal Processing
iNEMI 2023 Board Assembly-CPU Socket Interposer Technology Roadmap
Optimization of Photonic Soldering Processes for SIR Performance
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S24: Assembly Materials 2
Instructor/Speaker: Takahiro Matsufuji, Researcher, Senju Metal Industry Co., LTD
Instructor/Speaker: Tony Lentz, Chemist & Field Application, FCT Solder
Instructor/Speaker: Troy Diaz, Lead Mechanical Engineer, X2F
Focus: Assembly Materials
Event Type: Technical Conference
Location: 303B
Advanced Heat Removal, an Electronics Overmolding Advantage
Development and Enhancement for Low Temperature Wave Soldering Solution
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints.
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:30 PM
S25: HDI, uHDI AND SUBSTRATES 3
Instructor/Speaker: Enold Pierre-Louis, Technical Fellow, Aerospace Corp
Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd
Instructor/Speaker: Todd Harris, Packaging R&D Engineer, Intel
Instructor/Speaker: Caleb Ancharski, Research Chemist, AGC
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Microvia Fatigue Life Design Study Findings to Mitigate Functional Failures
Microvia Reliability Using a Simple Test Vehicle
Stacked Microvia Reliability and Test Methodology Evaluation
Research on Electroplating Capability of Multi-Layer Interconnected Deep Microvia PCB Based on Simul
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S26: PCB Fab 7: Printed Board Platings and Finishes 2
Instructor/Speaker: Colin Poedtke, Technical Service Engineer, Uyemura International Corporation
Instructor/Speaker: Michael Orsini, Application Chemist, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Junji Yoshikawa, Manager, OKUNO CHEMICAL INDUSTRIES CO.,LTD
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Next Generation Reduction Assisted Immersion Gold
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Achieving a Successful ENEPIG Finished PCB Under Revision A of IPC 4556
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 7:00 AM to 2:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
IPC APEX EXPO 2024
Thu, Apr 11, 2024 - 8:30 AM to 11:00 AM
Advanced Packaging Special Technical Session: Insights on NextGen Packaging: Needs for uHDI and IC Substrates
Instructor/Speaker: Hidenori Abe, Executive Director Electronics Business Headquarters, Resonac
Instructor/Speaker: Satoru Kuramochi, Executive Chief Researcher, Dia Nippon Printing
Instructor/Speaker: Hannes Voraberger PhD, Vice President Corporate R&D, AT&S
Instructor/Speaker: Matt Kelly, CTO & VP Technology Solutions, IPC
Instructor/Speaker: E. Jan Vardaman, President, TechSearch International, Inc.
Instructor/Speaker: Kuldip Johal, Global OEM Director, New Technology Pathfinding, Atotech Group
Instructor/Speaker: Sai Boyapati, Senior Director Advanced Packaging, AMD
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB