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Programs: 11 - 20 of 31
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S10: PCB Fab 3: Laminate Materials 2
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: JingHui Peng, Manager, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: CanJun Xiang, Senior Engineer, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: Kevin Bivona, R&D Lab Manager, AGC Multi Material America
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Managing Backdrill Stub Length Variations due to Innerlayer Core Deformation
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Research on High-Speed Material Insertion Loss in Server Platform
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 7:00 AM to 5:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S11: QRTI3 : Quality and Reliability 1
 
Instructor/Speaker: Zook Kim, Engineer, Package Solution Team, Samsung Electro-Mechanics
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Instructor/Speaker: Hanui Kim PhD, Senior Engineer, Samsung Electro-Mechanics
Instructor/Speaker: Irene Hou, Business Development & Marketing Director, AOSHIKANG TECHNOLOGY / ASK PCB
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303A
Research on High Potential Capability of Energy PCB
Does Functional Circuitry Drift as Leakage Currents Form?
Investigation of Factors Influencing SR/Cu Interface Adhesion
Substrate Warpage Incurred from Panel grab at PCB Manufacturing
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S12: Assembly Processes 1
Instructor/Speaker: Edward Nauss, Sr. Applications Engineer, ITW/EAE
Instructor/Speaker: Ram Wissel, Vice President of Global Technology, KYZEN Corporation
Instructor/Speaker: Evan Griffith, Product Specialist, Indium Corporation
Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation
Instructor/Speaker: Kalyan Nukala, Application Engineer, ZESTRON Americas
Instructor/Speaker: Patrick Stockbruegger, Product Manager, LPKF Laser & Electronics SE
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303B
Sealed Versus Exposed Atmosphere Solder Printing Comparison for Type-6 Powder Solder Paste
Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Prin
Strategies for Enhanced Reliability in the Cleaning of Vented Components
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S13: PCB Fab 4: RF Materials, Low Loss Materials
Instructor/Speaker: Tomoaki Nakanishi, Scientist, AGC Multi Material America
Instructor/Speaker: Eillie Chiang, Master's Degree Student, Yuan Ze University
Instructor/Speaker: Min Park PhD, Haesung DS, Haesung DS
Instructor/Speaker: Britta Schafsteller PhD, Global Product Manager, MKS Instrumentsnts
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
The Impact of Final Finishes and Thermal Aging on Insertion Loss at Frequencies Up to 150 GHz
The Formulating Technology of Extremely Low Loss PCB Material for 112/224 Gbps Without Sacrificing R
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graph
High-frequency Signal Characteristics of Differential Striplines with Different Cu-Foil Roughness
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S14: Factory of the Future 2: Additive Manufacturing
Instructor/Speaker: Emily Lamport, PhD Student, University of Massachusetts Lowell
Instructor/Speaker: Jason Benoit, Mechanical Engineer, Sciperio
Instructor/Speaker: Michael Dickey PhD, Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering, NC State University
Instructor/Speaker: Tom Rovere, Research Scientist, Associate Fellow, Lockheed Martin
Instructor/Speaker: Dr. Kenneth Church, CEO & Founder, Sciperio Inc.
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Liquid Metal Patterning for Electronic Circuits and Thermal Management
Reliability Validation of Direct-Write Printed RF Devices
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S15: QRTI 4: Quality and Reliability 2
Instructor/Speaker: KyoungSoo Kim, SI Engineer in ISU Petasys, ISU Petasys
Instructor/Speaker: Mr. Jefferson Leach, Application Development Engineer, Momentive Technologies
Instructor/Speaker: Matt Gallaugher PhD, Material Science Engineer, Momentive Technologies
Instructor/Speaker: Yang-Hung Cheng, Section Manager, MPI Corpoation
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303A
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for P
Experimental Verification of Optimized Signal Integrity Test Coupon to Achieve Accurate Measurements
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S16: Assembly Processes 2
Instructor/Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Instructor/Speaker: Miloš Lazic, Product Development Specialist, Indium Corporation
Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation
Instructor/Speaker: Sunny Agarwal, Sr. Applications Engineer, ITWEAE
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303B
Reflow Soldering of PCB Components With Mixed Thermal Mass
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S17: PCB Fab 5
Instructor/Speaker: Saminda Dharmarathna PhD, Principal Research Scientist, Macdermid Alpha Electronics Solutions
Instructor/Speaker: Zhi Chao Zhang, Senior engineer, Delton Technology (Guang Zhou) Inc.
Instructor/Speaker: Kunal Shah PhD, President, LILOTREE
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Advancing Copper Electroplating Processes: Innovative Solutions for Excellent Via Fill and V-Pit Res
A Novel Ni Free Surface Finish Capable of Resisting Copper Creep Corrosion for Better Solder Joint R
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
IPC APEX EXPO 2024
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S18: HDI, uHDI AND SUBSTRATES 1
Instructor/Speaker: Manuel Galvez, Product Marketing Manager, MKS Instruments, Inc.
Instructor/Speaker: Reginald Lai, Packaging R&D Engineer, Intel Corporation
Instructor/Speaker: Kyle Baker, Product Marketing Specialist, MKS Instruments
Instructor/Speaker: Samuel Oladji, Packaging RD Engineer, Intel Corporation
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Vacuum Etch Technology for Fine Line Width and Space in PCBs
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
Maximize Throughput With Innovative Laser/optics Configuration, Precision Pulse Shaping, and Steerin