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Programs: 1 - 10 of 31
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 7:00 AM to 5:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S01: Sustainability for Electronics 1: Materials
Instructor/Speaker: Scarlet Yi Wang, Technical Marketing Director, Shengyi Technology Co., LTD.
Instructor/Speaker: Andreas Karch, Technical Manager (Germany, Austria, Switzerland) / Technologist – Advanced Applications, Indium Advanced Material, Indium Corporation
Instructor/Speaker: Jennifer Fijalkowski, Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions
Instructor/Speaker: Yuntao Li PhD, Lead Scientist, SABIC
Instructor/Speaker: Daniel Hamann, Sales Manager Europe and Key Accounts, SMT Thermal Discoveries
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve Up
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S02: Design
Instructor/Speaker: Savita Ganjigatti, Vice President, SiennaECAD
Instructor/Speaker: Chiew Yee Ho, Hardware Engineer, Intel Microelectronics Asia LLC
Instructor/Speaker: Meijuan Sarah Kuang, Tech. Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd.
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Ryan Chang, Engineer, Intel
Focus: Design
Event Type: Technical Conference
Location: 303B
Innovative Hybrid Solder Mask for Coupling Reduction in High-Speed Application
Impact of CPU Pin Pattern Orientation to High-Speed Interconnect Data Center Board Designs With Inte
Latest PCIe Generation PCB Design and simulations: Overcoming Design, Cost, Yield, Technology Tradeo
Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S03: Factory of the Future 1: AI & Machine Learning
Instructor/Speaker: Wei Ken Hee, Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd
Instructor/Speaker: Ryusuke Ueki, Leader of the AI Research Lab, Qualtec Co., Ltd.
Instructor/Speaker: Reinhardt Seidel PhD, Research Assistant, Friedrich-Alexander-Universit
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Machine-Learning Based Solderability Check of THT Solder Joints
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S04: PCB Fab 1: Flex, Hybrid
Instructor/Speaker: Kaspar Tsang, Senior Development Manager of Infrastructure Solutions Group, Lenovo
Instructor/Speaker: Lu Xiao, Senior Chief Engineer, Shengyi Electronics Co.,Ltd
Instructor/Speaker: Terry Wright, CTO, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Gause Hu, Manager, Lenovo
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
The Improvement of Warp in Rigid-Flex Board
The Study of Resin Flow Indentation for Rigid-Flex PCB
Study on the Influencing Factors of Interlayer Reliability of Rigid-Flex Board with Multiple Air-Gap
Asymmetric Hybrid Printed Circuit Board Design and Flexibility Study for High-speed Data Center Plat
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S05: QRTI 1: Inspection and Test 1
Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions, Inc.
Instructor/Speaker: Yu Hsuan Chen, Hardware Engineer, Intel Corporation
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Matthias Zapatka Dipl.-Ing. (FH), CIS, CTO+FAE, INGUN USA, Inc.
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Modular RF Test Enclosure / Test Fixture Combinations: Design, Innovations and Characterization
Statistical Analysis of Full-scope In-board Electrical Characterization for Partial Plane-on-Outer-L
Automatic Testing of High-Speed I/O in Manufacturing
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S06: High Reliability for Extreme Requirements
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Thomas Sanders PhD, Parts Failure Engineer, Jet Propulsion Laboratory
Instructor/Speaker: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
Focus: High Reliability
Event Type: Technical Conference
Location: 304AB
Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist
QFN Assembly Reliability Under a New HALT Test Method
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S07: PCB Fab 2: Laminate Materials 1
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: Neil Hubble, President, Akrometrix
Instructor/Speaker: Mandy Krott, Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH
Instructor/Speaker: Tony Senese, Manager, R&D and Business Development, NA, Panasonic
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs
HDP Users Group Thermal Analysis Methodology Assessment
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S08: Sustainability for Electronics 2: Life Cycle Assessment
Instructor/Speaker: Outi Rusanen MSc, LicSc, DSc (Tech.), Principal Interconnection Specialist, TactoTek
Instructor/Speaker: Maarten Cauwe PhD, R&D Team Leader, imec
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Sustainable Smart Surfaces
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
IPC APEX EXPO 2024
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S09: QRTI 2: Inspection and Test 2
Instructor/Speaker: Marius Tarnovetchi, Senior Expert, VItesco Technologies
Instructor/Speaker: Malgorzata Celuch PhD, President, QWED Sp. z o. o.
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - A Revealin
Monotonic Bend Characterization of Board-Level Solder Interconnects with Finite Element Analyses