Search

Instructor/Speaker(s): 121 - 130 of 223
Instructor/Speaker
Karl Sauter
Oracle America, Inc.
Bio Available Soon
Katherine Ducharme
Director
General Dynamics Missions Systems
Katie Ducharme is director of Procurement Management for General Dynamics Mission Systems.
Katie is responsible for the subcontract management and procurement of all materials, services and support to the Maritime & Strategic Systems Line of Business....
Kevin Knadle
TTM Technologies
Kevin has 35 years’ experience in reliability engineering of all levels of electronic packaging, authored a number of technical papers, and is an inventor on 14 US patents. Kevin earned a BS in ...
Kunal Shah, Ph.D.
President
LiloTree
Kunal Shah, PhD. is a President and chief Scientist at LiloTree. Dr. Shah leads efforts of advanced engineered materials development and product improvement solutions at LiloTree for electronics industry including aviation-aerospace, medical electronics, semiconductors, etc....
Lan Tran
Bonbouton Inc.
Lan is graduated from the School of Electronics and Telecommunication at Ha Noi University of Science and Technology. He is working as a Research Assistant at Ha Noi University of Science and Technology and a hardware/software engineer at Bonbonton Inc., Viet Nam....
Lance Auer
Conductor Analysis Technologies, Inc.
Bio Available Soon
Lance Brack
Sr. Electrical Engineer
Raytheon Missile Systems
Bio Available Soon
Lenora Clark
ESI Automotive
Lenora is the Director of Autonomous Driving and Safety Technology for the ESI Automotive Team.  She leads the team in understanding all systems involved in advanced safety on the path to full autonomy....
Leonard Allison
Engineered Materials Systems, Inc.
Bio Available Soon
Maarten Cauwe
imec-CMST
Dr. Cauwe (M) received a Degree in electronics engineering from Ghent University, Ghent, Belgium, and a Ph.D. degree from the Center for Microsystems Technology (CMST), Ghent University. He is currently leading the Flexible Microsystems for Health team at CMST, and is involved in several projects concerning substrate technologies, chip assembly, medical packaging, and chip embedding....