Senior Appication Engineer

Flexible Circuit Technologies, Inc.

Mark Finstad is the senior application engineer at Flexible Circuit Technologies and has more than 30 years’ experience designing and building flex circuits. He co-chairs IPC-2223 Flexible Circuit Design committee and sits on IPC-6013, IPC 4202, IPC-4203, and IPC-4204 committees....

Texas Instruments Inc.

Description Coming Soon

President

Ventec International Group

STI Electronics, Inc.

Sr. Manager

Northrop Grumman Corporation

Martin is a department manager within hardware engineering at Northrop Grumman Mission Systems, located outside Baltimore, MD. His organization is responsible for various aspects of design, engineering, components, reliability, materials and processes, and represents the sector for Counterfeit Parts compliance per DFARS 252 246 7007 requirements....

IBM Corporation

Description Coming Soon

INGUN USA, Inc.

Matthias is the CTO of INGUN USA, Inc. and has been with the INGUN group for more than ten years....

AIM Solder

VP Technology & Business Development

RBP Chemical Technology, Inc.

Michael V. Carano is Vice President of Technology & Business Development at RBP Chemical Technology, Inc. A winner of IPC’s Hall of Fame award and many other awards for his leadership in the industry, he is a regular speaker at industry events....