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Presenter/Committee Chair
John Fisher Interconnect Technology Anlysis Inc. Description Coming Soon
John Lau, Ph.D. Sr. Technical Advisor ASM Assembly Materials Ltd. John H. Lau has been a senior technical advisor of ASM since 2014. Before that he was a Senior Scientist/MTS at HPLab/Agilent in California for more than 25 years. With more than 39 years of R&D and manufacturing experience in semiconductor packaging, he has published more than 460 peer-reviewed papers, 30 issued and pending US patents, and 18 textbooks on flip chip technologies, WLCSP, and FOWLP....
John Mastorides Honeywell Aerospace Description Coming Soon
John Perry Director, Printed Board Standards & Technology IPC
John Timmerman, Ph.D. Henkel John Timmerman is a principal scientist with Henkel, whose main focus is high performance thermal interface materials, thermally conductive adhesives, and EMI absorbing materials....
John VanNewkirk CheckSum Since 2003, John VanNewkirk has served as President and CEO of CheckSum. Earlier, VanNewkirk led a successful turnaround of a steel service center in southern China. Prior, VanNewkirk served as a management consultant with Bain & Company in Hong Kong and San Francisco....
Jon Bengston Uyemura International Corporation Jon Bengston has been with Uyemura for the past 12 years and currently holds the position of Chief Research Scientist with UIC America. Jon holds a BS in Chemistry and his primary focus at Uyemura has been the development and enhancement of Final Finish product performance....
Jose Servin Olivares Continental Temic SA deCV Description Coming Soon
Joseph Kane BAE Systems Description Coming Soon
Joseph Russeau Precision Analytical Laboratory, Inc. Description Coming Soon

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