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	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD19: Design for Excellence: DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) and More - Part 2 Presenter/Committee Chair: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 6C PD19 Instructor - DaleLee
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD20: Assembly: Best Practices for Improving Manufacturing Productivity - Part 2 Presenter/Committee Chair: W. James Hall, Principal Consultant, ITM Consulting Inc. Presenter/Committee Chair: Phil Zarrow, President and Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 6D PD20 Presentation - Hall and Zarrow
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD21: Reliability Physics Introduction and DfX Applications Presenter/Committee Chair: Dock Brown, Senior Technical Staff, DfR Solutions Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Basic - broad foundation Location: Room 1A PD21 Presentation - Dock Brown
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD22: Reflow Soldering Process and Influence on Defects - An In-Depth Look Presenter/Committee Chair: S. Manian Ramkumar, Ph.D., Interim Dean, Rochester Institute of Technology Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 3 PD22 Presentation - Manian Ramkumar
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD23: Troubleshooting Printed Circuit Board Related Defects. Root Cause and Prevention - Part 2 Presenter/Committee Chair: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Intermediate - student should have some knowledge of the topic Location: Room 2 PD23 Presentation - Mike Carano
	Mon, Jan 28, 2019 - 2:00 PM to 5:00 PM PD24: Continuous Improvement Through Lean Practices Presenter/Committee Chair: Steven Williams, President, TRA Consulting Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate - student should have some knowledge of the topic Location: Room 1B PD24 Presentation - Steve Williams
	Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM 3-12E: Base Materials Roundtable Task Group Presenter/Committee Chair: Terry Fischer, Hitachi Chemical Co. America, Ltd. Seminar Type: Standard Development Committee Track: PCB Fabrication and Materials General Committee: Base Materials Location: 8
	Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM 5-32B: SIR and Electrochemical Migration Task Group Seminar Type: Standard Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 10
	Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM 5-33g Low Pressure Molding Task Group Presenter/Committee Chair: Russell Steiner, Casco Products Seminar Type: Standard Development Committee Track: Cleaning/Coating/Contamination General Committee: Cleaning and Coating Location: 9
	Mon, Jan 28, 2019 - 3:15 PM to 5:00 PM B-10A/JEDEC: Joint Meeting: Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1 Presenter/Committee Chair: Stephen Tisdale, Tisdale Environmental Consulting LLC Presenter/Committee Chair: Steven Martell Seminar Type: Standard Development Committee Track: Quality, Reliability and Test General Committee: Packaged Electronic Components Location: 12

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