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	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD26: Thermal Management Solutions using PCB's Presenter/Committee Chair: Mike Tucker, Field Applications Engineering Manager, Kinwong Electronics Corporation Seminar Type: Professional Development Track: PCB Fabrication and Materials Level: Basic - broad foundation Location: Room 11A PD26 Presentation - Mike Tucker
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD27: Ask the Flexperts - Lessons Learned Presenter/Committee Chair: Mark Finstad, Senior Appication Engineer, Flexible Circuit Technologies, Inc. Presenter/Committee Chair: Nick Koop, Sr. Field Application Engineering - Flex Technology, TTM Technologies Seminar Type: Professional Development Track: Design Level: Intermediate - student should have some knowledge of the topic Location: Room 10 PD27 Presentation - Finstad and Koop
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD28: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration Presenter/Committee Chair: Ning-Cheng Lee, Ph.D., VP of Technology, Indium Corporation Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 9 PD28 Presentation - Ning-Cheng Lee
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD29: Selective Soldering of Challenging Components Presenter/Committee Chair: Bob Klenke, Principal Consultant, ITM Consulting Inc. Seminar Type: Professional Development Track: Assembly Processes for Lead-Free and Tin Lead Level: Intermediate - student should have some knowledge of the topic Location: Room 8 PD29 Presentation - Bob Klenke
	Thu, Jan 31, 2019 - 9:00 AM to 12:00 PM PD30: Electrostatic Discharge (ESD) " Sources of Electrostatic Charge in a Production Line (SMT) " Robotic as a Source of Electrostatic Charge in the Future Presenter/Committee Chair: Hartmut Berndt, B.E.STAT European ESD Competence Centre Seminar Type: Professional Development Track: Quality, Reliability and Test Level: Intermediate - student should have some knowledge of the topic Location: Room 7B PD30 Presentation - Hartmut Berndt
	Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S27: High Speed/High Frequency I Presenter/Committee Chair: David Hoover, Sr Field Application Engineer, TTM Technologies Seminar Type: Technical Conference Session Track: PCB Fabrication/ Plating/Reliability Track Location: D S27: High Speed/High Frequency I
	Thu, Jan 31, 2019 - 9:00 AM to 10:00 AM S28: Environmental Presenter/Committee Chair: Julie Silk, Reliability Program Manager, Keysight Technologies Seminar Type: Technical Conference Session Track: PCB Assembly, Inspection and Reliability Track 1 Location: C S28: Environmental
	Thu, Jan 31, 2019 - 10:00 AM to 11:00 AM PCB Suppliers Council Steering Committee Meeting(By Invitation) Seminar Type: Standard Development Committee Track: Environmental Issues and Compliance Location: 14A
	Thu, Jan 31, 2019 - 10:00 AM to 2:00 PM UL STP Committee (By invitation only) Presenter/Committee Chair: Bradley Schmidt, UL LLC Seminar Type: Standard Development Committee Track: Quality, Reliability and Test General Committee: Testing Location: 16B
	Thu, Jan 31, 2019 - 10:30 AM to 12:00 PM S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools Presenter/Committee Chair: Steve Butkovich, Test Innovation, LLC Seminar Type: Technical Conference Session Track: Manufacturing Software Track Location: ROOM 1B S35: Smart Manufacturing/ Industry 4.0/ Software Manufacturing Tools

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