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Sat, Jan 26, 2019 - 8:00 AM to 5:00 PM
Seminar Type: Standard Development Committee
Track: Quality, Reliability and Test
General Committee: Product Assurance
Location: 15A
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Sun, Jan 27, 2019 - 8:00 AM to 3:00 PM
Seminar Type: Standard Development Committee
Track: Assembly Processes for Lead Free and Tin-Lead
General Committee: Assembly and Joining
Location: 15A
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Sun, Jan 27, 2019 - 8:00 AM to 4:30 PM
Seminar Type: Standard Development Committee
Track: PCB Fabrication and Materials
General Committee: Rigid Printed Circuit Boards
Location: 6F
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Sun, Jan 27, 2019 - 9:00 AM to 4:00 PM
Seminar Type: Standard Development Committee
General Committee: Printed Electronics
Location: 14B
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Basic - broad foundation
Location: Room 6C
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 6D
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: PCB Fabrication and Materials
Level: Basic - broad foundation
Location: Room 3
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Advanced - detailed content, high-level discussion
Location: Room 2
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Assembly Processes for Lead-Free and Tin Lead
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1B
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Sun, Jan 27, 2019 - 9:00 AM to 12:00 PM
Seminar Type: Professional Development
Track: Cleaning/Coating/Contamination
Level: Intermediate - student should have some knowledge of the topic
Location: Room 1A
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