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Programs: 6

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	Tue, Jan 29, 2019 - 1:30 PM to 3:00 PM BZ1: E-Textiles – The Fourth Industrial Revolution Presenter/Committee Chair: Stephanie Rogers, Apex Mills, Inc. Seminar Type: Buzz Session Location: Room 4 BZ1 - MaryAlice Gill BZ1 - Stephanie Rodgers BZ1 - Len Allison - EMS
	Tue, Jan 29, 2019 - 3:30 PM to 5:00 PM BZ2: How IPC-2581 Enables Industry 4.0 Presenter/Committee Chair: Ed Acheson, Cadence Design Systems Inc. Presenter/Committee Chair: Terry Hoffman, Cisco Systems Inc. Presenter/Committee Chair: Hemant Shah, Cadence Design Systems Inc. Speaker: Michael Ford, Aegis Software Presenter/Committee Chair: Gary Carter, ThingWeaver Solutions, LLC Seminar Type: Buzz Session Location: Room 4 BZ2: How IPC-2581 Enables Industry 4.0
	Wed, Jan 30, 2019 - 9:00 AM to 10:00 AM BZ3: The Future of Pb-free in High Reliability Applications – Results of an Industry Survey Presenter/Committee Chair: David A Pinsky, Raytheon Company Presenter/Committee Chair: Paul Zutter, US Army Aviation & Missile Command Speaker: Linda Woody, LWC Consulting Speaker: David Hillman, Rockwell Collins Seminar Type: Buzz Session Location: Room 5A BZ3: The Future of Pb-free in High Reliability Applications – Results of an Industry Survey
	Wed, Jan 30, 2019 - 10:30 AM to 12:00 PM BZ4: Impacts of Warpage on SMT Processes Presenter/Committee Chair: Brook Sandy-Smith, Technical Support Engineer, IPC Seminar Type: Buzz Session Location: Room 4 Impacts of Warpage on SMT Processes
	Wed, Jan 30, 2019 - 3:30 PM to 4:30 PM BZ5: Findings from IPC's PCB Technology Trends Presenter/Committee Chair: Sharon Starr, Director of Market Research, IPC Speaker: Michael Carano, VP Technology & Business Development, RBP Chemical Technology, Inc. Seminar Type: Buzz Session Location: Room 4
	Thu, Jan 31, 2019 - 8:00 AM to 2:00 PM BZ6: iNemi NEXT GENERATION SOLDER MATERIALS WORKSHOP Speaker: Dr. Haley Fu, iNEMI Seminar Type: Buzz Session Location: Room 4