Jan 26, 2019 - Jan 31, 2019
San Diego Convention Center
Zymet, Inc.
Booth: 1350
Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACPs and NCPs, UV curable glob top encapsulants, and underfill and reworkable underfill encapsulants for flip chips,... (more)