Taconic excels in RF laminates, high speed digital and flexible interconnect materials. Taconic's multilayer materials enable manufacture of 20+ layer PCBs w/reduction of board thickness. Unique materials include EZ-IO-F Spread Weave Next Generation Laminate, fastRise EZ low temp. curing/low loss flexible prepreg for manufacture of rigid/flex PWBs containing polyimide, LCP or PTFE cores, fastRise multilayer, non-reinforced prepreg designed to eliminate skew in differential transmission lines and DK fluctuations in filter and coupler applications and fastRise EZ pure low temp curing adhesive. (less)