Sustainability Engineer

Makersite

A pivotal figure in sustainability and climate solutions, he has a background that intersects leadership, technological innovation, and strategic development for environmental stewardship. His roles include Principal Sustainability Engineer at Makersite, where he integrates technology to reduce environmental impacts, & positions at South Pole and UBIRCH GmbH, focusing on climate neutrality and ESG data integrity....

Product Manager

LPKF Laser & Electronics SE

Studied business administration and mechanical engineering with a focus on production technology, strategy development and technical sales. He has been a product manager at LPKF since 2019 and is responsible for the technical and strategic alignment of electronics manufacturing solutions for the SMT industry....

Director of Application Engineering

AGC

Paul Cooke has more than 30 years of experience in printed board (PWB) design and manufacturing. He has held senior positions in operations, quality, process engineering and field application engineering, at some of the top North American PCB manufacturers....

President

ITM Consulting

Phil Zarrow has been involved with PCB fabrication and assembly for more than 45 years. His expertise includes the manufacturing of equipment for circuit board fabrication and assembly of through hole and surface mount technologies....

Professor

Technical University of Denmark

Dr. Rajan Ambat is Professor of Corrosion and Surface Engineering at Technical University of Denmark and Manager of CELCORR/CreCon Industrial Consortium on climatic reliability of electronics and Center for Climate Robust Electronics (CRED) at DTU....

Professor

Auburn University

Robert L. Jackson is a Professor of Mechanical Engineering at Auburn University. He received his BS, MS and PhD degrees from the Georgia Institute of Technology. After completing his PhD in 2004, he joined the faculty of Auburn University....

Northrop Grumman Space Systems

Bio Coming Soon

GreenSoft Technology Inc.

Bio Coming Soon

President

Ray Prasad Consultancy Group

Author of textbook SMT Principles and Practice, an inductee to IPC Hall of Fame, recipient of multiple industry awards, chaired multiple IPC standards committees on BGA, BTC, Reflow, Land Patter, Package Cracking for decades....

Platform Hardware Design Engineer

Intel Corporation

With over 10 years of printed circuit manufacturing experience, Reginald is responsible for development and validation of new PCB technologies to enable Intel’s next generation of product requirements...