Tue, Mar 18, 2025 - 3:30 PM to 4:30 PM
S14: PCB Fabrication and Materials 4: Additive, Semi-additive, and Novel Build-Up Technologies
Instructor/Speaker: Mr. Joe Dickson, SVP Product Innovation and Technology, Wus Int.
Instructor/Speaker: Mr. Roger Massey, Technical Marketing Manager, MKS Atotech
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 304AB
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
Capabilities and Challenges in Taking The Step From HDI to Advanced HDI