Sat, Mar 15, 2025 - 8:00 AM to 5:00 PM
5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Instructor/Speaker: Tiberiu Baranyi, Flextronics Romania SRL
Instructor/Speaker: Mr. Jarrod Webb, Manufacturing Robotics Engineering, Lockheed Martin Missiles & Fire Control
Instructor/Speaker: Milea Kammer, Honeywell International
Instructor/Speaker: Mr. Symon Franklin, Senior Production Engineer, Custom Interconnect Ltd
Focus: PCB FABRICATION AND MATERIALS
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Mar 16, 2025 - 8:00 AM to 5:00 PM
5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Instructor/Speaker: Tiberiu Baranyi, Flextronics Romania SRL
Instructor/Speaker: Mr. Jarrod Webb, Manufacturing Robotics Engineering, Lockheed Martin Missiles & Fire Control
Instructor/Speaker: Milea Kammer, Honeywell International
Instructor/Speaker: Mr. Symon Franklin, Senior Production Engineer, Custom Interconnect Ltd
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Mar 16, 2025 - 8:00 AM to 5:00 PM
7-31A AND D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Instructor/Speaker: Scott Bowles, Lockheed Martin Corporation
Instructor/Speaker: Gerry Partida, Vice President of Technology, Summit Interconnect
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 207CD
Sun, Mar 16, 2025 - 9:00 AM to 12:00 PM
PD01:Field Reliability of Microelectronics - Perspectives and Approaches using Physics of Failure and Risk Based Decision Making, Part One
Instructor/Speaker: Dr. Bhanu Sood, Deputy Center Chief Technologist, NASA Goddard Space Flight Center
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 303A
PD01 - part 1
Sun, Mar 16, 2025 - 9:00 AM to 12:00 PM
PD03: Counterfeit Electronics: Comprehensive Strategies for Prevention, Mitigation, and Disposal
Instructor/Speaker: Anthony Bryant, Manufacturing Industry Specialist, Kixx Faxx Research Analysis and Testing (KRAFT)
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 303C
PD03
Sun, Mar 16, 2025 - 9:00 AM to 12:00 PM
PD04: The Impact of Silicon Geometry Reduction on Signal Integrity and PCB Performance
Instructor/Speaker: Kristopher S. Moyer, Instructor, IPC
Focus: DESIGN
Event Type: Professional Development
Location: 303D
PD04
Sun, Mar 16, 2025 - 9:00 AM to 12:00 PM
PD06: Introduction to Machine Data Analytics in the EMS Industry
Instructor/Speaker: Dr. Tim Burke, Cofounder and CTO, Arch Systems
Focus: FACTORY OF THE FUTURE
Event Type: Professional Development
Location: 304C
PD06
Sun, Mar 16, 2025 - 9:00 AM to 12:00 PM
PD07: High Reliability Electronics for Harsh Environments
Instructor/Speaker: Dr. Jennie Hwang, CEO, H-Technologies Group
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 304AB
PD07
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM

PD09: Flex Circuit ‘Design for Manufacturing Principles’ Circuit Design: Fabrication and SMT Assembly Processing

Instructor/Speaker: Mr. Joe Fjelstad, Founder, Verdant Electronics
Focus: Design
Event Type: Professional Development
Location: 303B
PD09
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD08: Field Reliability of Microelectronics - Perspectives and Approaches using Physics of Failure and Risk Based Decision Making, Part Two
Instructor/Speaker: Dr. Bhanu Sood, Deputy Center Chief Technologist, NASA Goddard Space Flight Center
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 303A
PD08
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD10: PCB design for High reliability
Instructor/Speaker: Paul Cooke, Director of Application Engineering, AGC
Focus: PCB FABRICATION AND MATERIALS
Event Type: Professional Development
Location: 303C
PD10
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD11: Achieving Excellence in Electronics Manufacturing through Industry 4.0
Instructor/Speaker: Dr. Jose Servin, Material Expert, Vitesco
Focus: FACTORY OF THE FUTURE
Event Type: Professional Development
Location: 303D
PD11
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD12: ESD Control Program to Reduce Electrostatic Charges in Manufacturing Processes " From ESD Workstation to the Requirement for Automated Processes and Machines
Instructor/Speaker: Hartmut Berndt, President, B.E.STAT European ESD competence centre
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 304D
PD12
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD13: Troubleshooting SMT Yield Problems and Failure Analysis
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 304C
PD13
Sun, Mar 16, 2025 - 1:30 PM to 4:30 PM
PD14: Artificial Intelligence – Opportunities, Challenges & Possibilities
Instructor/Speaker: Dr. Jennie Hwang, CEO, H-Technologies Group
Focus: Emerging Technologies
Event Type: Professional Development
Location: 304AB
PD14
Sun, Mar 16, 2025 - 5:00 PM to 6:00 PM
Committee Appreciation Reception
Event Type: Special Event/Networking
Location: California Terrace
Mon, Mar 17, 2025 - 8:00 AM to 5:00 PM
2-18: Supplier Declaration Subcommittee Task Groups
Instructor/Speaker: Randall Flinders, GreenSoft Technology Inc.
Instructor/Speaker: Walter Jager, ECD Compliance
Instructor/Speaker: Chuck LePard, DXC Technology
General Committee: Data Generation and Transfer Documentation
Event Type: Standards Development Meeting
Location: Room 212A
Mon, Mar 17, 2025 - 8:00 AM to 12:00 PM
3-11A: IPC-4101 Task Group
Jr Albert Block, National Instruments
Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: Room 207B
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
5-21H: Bottom Termination Components (BTC) Task Group
Instructor/Speaker: Timothy Pearson, Collins Aerospace
Instructor/Speaker: Udo Welzel, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 208B
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
5-21Q: Requirements and Acceptance of Wire Bonding Task Group
Instructor/Speaker: Jianqiang Luo, Southwest China Research Inst. of Electronic Equipment
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211B
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Instructor/Speaker: Ernst Eggelaar, Microtronic M. V. GmbH
Instructor/Speaker: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 207A
Mon, Mar 17, 2025 - 8:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Instructor/Speaker: Eric Camden, Lead Investigator, Foresite
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 210C
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
7-31A AND D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Instructor/Speaker: Scott Bowles, Lockheed Martin Corporation
Instructor/Speaker: Gerry Partida, Vice President of Technology, Summit Interconnect
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 207CD
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Instructor/Speaker: Benoit Dagenais, TTI Inc.
Instructor/Speaker: Tyler Siebert, Lockheed Martin Missiles & Fire Control
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 209B
Mon, Mar 17, 2025 - 8:00 AM to 12:00 PM
7-31J AND 7-31X: IPC-A-630 Box Build and IPC-A-630 HDBK Task Group Joint Meeting
Instructor/Speaker: Eddie Hofer, Collins Aerospace
Instructor/Speaker: Richard Rumas, Honeywell Canada
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Mon, Mar 17, 2025 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Instructor/Speaker: Robert Cooke, NASA Johnson Space Center
General Committee: Process Control
Event Type: Standards Development Meeting
Location: Room 209A
Mon, Mar 17, 2025 - 8:00 AM to 10:00 AM
7-32C: Electrical Continuity Task Group
Instructor/Speaker: Max Clark, Mentor Graphics Corporation
Instructor/Speaker: Dana Korf, Sr. Director Technology/FAE, Victory Giant Technology
General Committee: Testing
Event Type: Standards Development Meeting
Location: Room 210B
Mon, Mar 17, 2025 - 8:00 AM to 5:00 PM
IPC EMS Leadership Summit: EMS Leaders of Today and Tomorrow Helping Each Other and the Industry to Prosper
Instructor/Speaker: Allison Budvarson, Out of the Box Manufacturing and IPC EMS Steering Committee Chair
Instructor/Speaker: Joe O'Neil, Principal, OAA Ventures
Instructor/Speaker: Mark Wolfe, Executive EMS Advisor, IPC
Instructor/Speaker: Dr. Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Technology Solution, IPC
Instructor/Speaker: Chintan Sutaria, Vice President, New Ventures, Elisa IndustrIQ
Instructor/Speaker: Mark Besser, General Manager, Symphony Industrial AI
Instructor/Speaker: Timon Ruban, Founder, Product & Engineering, Luminovo
Instructor/Speaker: Jack Calderon, Senior Director, Technology, Lincoln International
Instructor/Speaker: Audrey McGuckin, CEP, McGuckin Group
Instructor/Speaker: Richared Cappetto, North American Government Relations
Instructor/Speaker: Mike Buseman, President & CEO, SMTC
Instructor/Speaker: Garret Maxson, Vice President of Operations, ACDi
Instructor/Speaker: Xaver Feiner, Vice President, Marketing & Sales
Instructor/Speaker: Chaim Lubin, Managing Director, Technology, Lincoln International
Instructor/Speaker: Frank Crocker, Vice President, Technology, Lincoln International
Event Type: Management
Location: Ballroom A
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD15: Ask the Flexperts Design through Test with Lessons Learned, Part One
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 303A
Pd15
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD16: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk' Part One
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303B
PD16
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD17: Cleaning and Cleanliness Quantification Bootcamp
Instructor/Speaker: Mike Konrad, Founder / CEO, Aqueous Technologies
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 303C
PD17
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD18: Designing for Reliability: Preventing Leakage Currents and ECM on the High-Reliability Assemblies Exposed to Harsh Environmental Conditions, Part One
Instructor/Speaker: Dr. Mike Bixenman, President, Magnalytix, LLC
Instructor/Speaker: Mr. Vladimir Sítko, Founder and Mentor, PBT Works s.r.o.
Instructor/Speaker: Dr. Adam Klett, Director of Science, KYZEN Corporation
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 303D
PD18
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD19: Proactive Design Methods for Approaching Zero Field Failures
Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 304D
PD19
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD20: Flip Chip Package Technology and Assembly Processes
Instructor/Speaker: Dr. Tom Dory, Principal Consultant, ITM Consulting
Focus: ELECTRONIC ASSEMBLY MATERIALS
Event Type: Professional Development
Location: 304C
PD20
Mon, Mar 17, 2025 - 9:00 AM to 12:00 PM
PD21: Polymers in Advanced Packaging, Part One
Instructor/Speaker: Dr. Jeffrey Gotro, President, InnoCentrix, LLC
Focus: PCB FABRICATION AND MATERIALS
Event Type: Professional Development
Location: 304AB
PD21
Mon, Mar 17, 2025 - 10:00 AM to 5:00 PM
2-40: Electronic Documentation Technology Committee
Instructor/Speaker: Steven Roy, Roy Design and Manufacturing Service
General Committee: Electronic Documentation Technology
Event Type: Standards Development Meeting
Location: Room 210A
Mon, Mar 17, 2025 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 209B
Mon, Mar 17, 2025 - 10:00 AM to 11:00 AM
Unlocking Workforce Potential: Supporting IPC's Registered Apprenticeship Programs in California
Event Type: Special Event
Location: Room 210B
Mon, Mar 17, 2025 - 10:15 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Instructor/Speaker: Dr. Tim Burke, Cofounder and CTO, Arch Systems
Instructor/Speaker: Dr. Thomas Marktscheffel, Director Product Management Software Solutions, ASMPT
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Mon, Mar 17, 2025 - 10:15 AM to 12:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Instructor/Speaker: Ernst Eggelaar, Microtronic M. V. GmbH
Instructor/Speaker: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 207A
Mon, Mar 17, 2025 - 10:15 AM to 12:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Instructor/Speaker: Jan Pedersen, NCAB Group AB
Instructor/Speaker: Herb Snogren, Bristlecone LLC
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: Room 207CD
Mon, Mar 17, 2025 - 12:00 PM to 1:30 PM
Networking Luncheon
Event Type: Special Event/Networking
Location: Ballroom D
Mon, Mar 17, 2025 - 1:30 PM to 5:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Instructor/Speaker: Terry Hoffman, Cisco Systems Inc.
Instructor/Speaker: Chris Shaw, Fujitsu Network Communications
Instructor/Speaker: Anne Mason, Apple Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 210B
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
2-17B: IPC-HERMES-9852 Standard Task Group
Instructor/Speaker: Oliver Koehler, Vitesco Technologies
Instructor/Speaker: Dr. Thomas Marktscheffel, Director Product Management Software Solutions, ASMPT
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Instructor/Speaker: III Thomas Keily, JPS Composite Materials Corp.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: Room 207B
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
4-14F: Final Finishes for Printed Boards " ENEPIG Task Group
Instructor/Speaker: Jose Rios, Raytheon
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 207A
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
5-21F: Ball Grid Array Task Group
Instructor/Speaker: Robert Rowland, Axiom Electronics, LLC
Focus: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211B
Mon, Mar 17, 2025 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Instructor/Speaker: Brian Chislea, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 210C
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Instructor/Speaker: Debbie McDade, Advanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 208B
Mon, Mar 17, 2025 - 1:30 PM to 5:00 PM
7-34C: 7712 Task Group
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
D-55 AND D55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Instructor/Speaker: Raj Kumar, Northrop Grumman Space Systems
Instructor/Speaker: Dr. Bhanu Sood, Deputy Center Chief Technologist, NASA Goddard Space Flight Center
Instructor/Speaker: Jeff Seekatz, TTM Technologies - Stafford
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: Room 207CD
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD22: Ask the Flexperts Design through Test with Lessons Learned, Part Two
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Event Type: Professional Development
Location: 303A
Focus: PCB Fabrications and Materials
PD22
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD23: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk' Part Two
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303B
PD23
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD24: Adapting and Engineering Model-based PCB Design in Step with Sustainability and Digital Twins
Instructor/Speaker: Filbert S Arzola, Senior Principal Electrical Engineer, Raytheon
Focus: DESIGN
Event Type: Professional Development
Location: 303C
PD24
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD25: Designing for Reliability: Preventing Leakage Currents and ECM on the High-Reliability Assemblies Exposed to Harsh Environmental Conditions, Part Two
Instructor/Speaker: Dr. Mike Bixenman, President, Magnalytix, LLC
Instructor/Speaker: Mr. Vladimir Sítko, Founder and Mentor, PBT Works s.r.o.
Instructor/Speaker: Dr. Adam Klett, Director of Science, KYZEN Corporation
Focus: Quality & Reliability
Event Type: Professional Development
Location: 303D
PD25
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD26: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D and 3D System-in-Packaging and Ultra High-Density Interposer Development
Instructor/Speaker: Mr. Joe Fjelstad, Founder, Verdant Electronics
Focus: Advanced Packaging/Components
Event Type: Professional Development
Location: 304D
PD26
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD27: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 304C
PD27
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD28: Polymers in Advanced Packaging, Part Two
Instructor/Speaker: Dr. Jeffrey Gotro, President, InnoCentrix, LLC
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 304AB
PD28
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
2-17C: IPC-2592 DCX
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
2-30: Terms and Definitions Committee
Instructor/Speaker: David Caputa, Lockheed Martin Corporation
Instructor/Speaker: Aaron Kennedy, Summit Interconnect - Anaheim
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: Room 207CD
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable Task Group
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: Room 207B
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
4-14B: Final Finishes for Printed Boards " ENIG Task Group
Instructor/Speaker: Ingrid Swenson, TTM Technologies - Stafford
General Committee: Fabrication Processes
Event Type: Standards Development Meeting
Location: Room 207A
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
5-21G: Flip Chip Mounting Task Group
Instructor/Speaker: Ife Hsu, Intel Corporation
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211B
Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: Room 209A
Mon, Mar 17, 2025 - 5:00 PM to 6:00 PM
Newcomers Welcome Reception
Event Type: Special Event/Networking
Location: California Terrace
Tue, Mar 18, 2025 - 8:30 AM to 9:30 AM
Opening Keynote: AI, Automation, and the Digital Transformation
Instructor/Speaker: Kevin Surace, Internationally Recognized Futurist/Visionary/Inventor of Disruptive Innovation & Generative AI
Event Type: Special Event/Keynotes
Location: Ballroom D
Tue, Mar 18, 2025 - 9:30 AM to 12:00 PM
iNEMI Roadmap Readout and Future Planning Session: PCB and Laminates
Instructor/Speaker: Grace O'Malley, CTO, iNemi
Instructor/Speaker: Emma Hudson, Project Manager, iNemi
Instructor/Speaker: Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Mr. Joe Fuller, Manufacturing Engineering Technologist, Intel Corp
Instructor/Speaker: Alun Morgan, Technology Ambassador, Ventec
Instructor/Speaker: Ms. Emma Quinn, PCB Qualification Engineer, IBM
Instructor/Speaker: Tony Senese, Manager, R&D, Mobile and Aerospace, Panasonic
Instructor/Speaker: Sarah Czaplewski, Materials & Reliability Engineer, IBM
Instructor/Speaker: Mr. Ed Kelley, CEO, Four Peaks Innovation
Event Type: Special Event
Location: Room 210A
Tue, Mar 18, 2025 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Event Type: Special Event/Networking
Tue, Mar 18, 2025 - 10:00 AM to 5:00 PM
2-18: Supplier Declaration Subcommittee Task Groups
Instructor/Speaker: Randall Flinders, GreenSoft Technology Inc.
Instructor/Speaker: Walter Jager, ECD Compliance
Instructor/Speaker: Chuck LePard, DXC Technology
General Committee: Data Generation and Transfer Documentation
Event Type: Standards Development Meeting
Location: Room 208B
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Instructor/Speaker: Richard Snogren, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 209A
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Instructor/Speaker: Michael Coll, Denkai America Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: Room 208A
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Instructor/Speaker: Fonda Wu, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 210C
Tue, Mar 18, 2025 - 10:00 AM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Instructor/Speaker: Jason Keeping, Celestica International L.P.
Instructor/Speaker: Fonda Wu, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 207CD
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Instructor/Speaker: Zhiman Chen, Senior Engineer, CRRC TEC
Instructor/Speaker: Milea Kammer, Honeywell International
General Committee: Process Control
Event Type: Standards Development Meeting
Location: Room 210B
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Instructor/Speaker: Marie Parliman, BAE Systems
Instructor/Speaker: Helena Pasquito, EPTAC LLC
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Instructor/Speaker: Joseph Kane, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 209B
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: Room 207A
Tue, Mar 18, 2025 - 10:00 AM to 11:30 AM
S01: Quality and Reliability 1: High Voltage & Harsh Environment Reliability
Instructor/Speaker: Dr. Lothar Henneken, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Ms. Jyothsna Murli Rao, PhD student, Center for Electronic Corrosion, DTU
Instructor/Speaker: Dr. Walter Olbrich, Director Field Application Engineering, TTM Technologies
General Committee: Quality and Reliability
Event Type: Technical Conference Session
Location: 303C
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of A PCB
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms
Understanding PCB Failure Mechanisms Under High Voltage and Condensing Conditions
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
S02: Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness
Instructor/Speaker: Dr. Mike Bixenman, President, Magnalytix, LLC
Instructor/Speaker: Dr. Kapil Kumar Gupta, Postdoc Fellow, Centre for Climate Robust Electronics design (CRED) DTU Construct, Technical University of Denmark
Instructor/Speaker: Prof. Rajan Ambat, PhD, Professor, Technical University of Denmark
Instructor/Speaker: Dr. Anish Rao Lakkaraju, Post-Doctoral Researcher, Center for Electronic Corrosion (CELCORR)
General Committee: Quality and Reliability
Event Type: Technical Conference Session
Location: 303A
Methods Used to Qualify Soldering and Cleaning Materials and Processes
From the Corrosion to Short Circuiting in Electronics
Enhancing Humidity Robustness of Electronics
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design
Tue, Mar 18, 2025 - 10:00 AM to 11:30 AM
S03: Factory of the Future 1: AI for Test and Inspection
Instructor/Speaker: Mr. Stephan Pirner, Principal Software Engineer, Nordson Corp
Instructor/Speaker: Dr. Eyal Weiss, CTO and Founder, Cybord
Instructor/Speaker: Mr. Shobhit Agrawal, Customer Success Manager, Keysight Technologies
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 303B
Universal AI-Powered Segmentation of PCBA and Semi-Conductor
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI
Unlocking the Promise of AI in Electronic Manufacturing
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
S04: PCB Fabrication and Materials 1: Platings and Surface Finishes
Instructor/Speaker: Mr. Joe McGurran, Technology Specialist and Product Marketing Manager, MKS-Atotech
Instructor/Speaker: Mr. Kuldip Johal, CTO/ VP Business Development, MKS Instruments Material Solutions Division (Atotech)
Instructor/Speaker: Dr. Frank Xu, Global Product Manager, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Mr. Anil Kher, Managing Director, Micro Interconnexion Pvt. Ltd.
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 304AB
Pure Palladium Plating for ENEPIG – How Bath Properties Impact Process Handling and Final Finish
A Review of Current and Future PCB Final Finishes
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
S05: Assembly Processes and Testing 1: Component & Assembly Characterization
Instructor/Speaker: Mr. Neil Hubble, President, Akrometrix
Instructor/Speaker: Dr. Jose Servin, Material Expert, Vitesco
Instructor/Speaker: Dr. Reza Ghaffarian, Principal Engineer, JPL
Instructor/Speaker: Prof. Sebastian Fischmeister, PhD, Co-founder and CEO, Palitronica
General Committee: Assembly Processes and Testing
Event Type: Technical Conference Session
Location: 304C
Detection of HiP of Burn-in FCBGA by Thermal Cycle
Solder Graping Issue Analysis
Alternative Methods in Measuring BGAs for Thermal Warpage
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
Tue, Mar 18, 2025 - 11:00 AM to 12:00 PM
Designing Effective Training for the Electronics Manufacturing Industry
Instructor/Speaker: Carlos Plaza, Senior Director of Education, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Tue, Mar 18, 2025 - 12:00 PM to 1:30 PM
Luncheon | IPC Annual Meeting
Event Type: Special Event/Networking
Location: Ballroom D
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 209A
Tue, Mar 18, 2025 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Instructor/Speaker: John Mastorides, Honeywell Aerospace
Instructor/Speaker: Scott Meyer, Collins Aerospace
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 209B
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Instructor/Speaker: Karl Sauter, High Density Packaging User Group International, Inc.
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: Room 208A
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Instructor/Speaker: Julie Silk, Keysight Technologies
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: Room 210C
Tue, Mar 18, 2025 - 1:30 PM to 2:30 PM
Building Regional Workforce Ecosystems in Electronics Manufacturing: Integrating Education, Industry, and Workforce Development
Instructor/Speaker: Victoria Hawkins, Director of Grants and Proposals, IPC
Charlene Gunter, Sr Director of IPC Education Foundation, IPC
Instructor/Speaker: Coreen Blaylock, Director Workforce Partnerships, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Tue, Mar 18, 2025 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Instructor/Speaker: Michael Creeden, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: Room 207A
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
D-33AA: IPC-6012 Automotive Addendum Task Group
Instructor/Speaker: Mr. Todd MacFadden, Senior Technology Development Engineer, Bose Corporation
Instructor/Speaker: Jan Pedersen, NCAB Group AB
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: Room 210A
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
D-67A AND D-67B: Acceptability of Additively Manufactured Electronics Specification and Additively Manufactured Electronics Performance Specification Joint Task Group Meeting
Instructor/Speaker: Dana Korf, Sr. Director Technology/FAE, Victory Giant Technology
Instructor/Speaker: Mr. Leo Lambert, Vice President, Technical Director, EPTAC LLC
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: Room 210B
Tue, Mar 18, 2025 - 1:30 PM to 3:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: Room 207B
Tue, Mar 18, 2025 - 2:00 PM to 3:00 PM
S06: Solder Processes & Reliability
Instructor/Speaker: Mr. David Bedner, Research Chemist, Indium
Instructor/Speaker: Mr. Vladimir Sítko, Founder and Mentor, PBT Works s.r.o.
General Committee: Solder Processes & Reliability
Event Type: Technical Conference Session
Location: 303C
Influence of Cleaner Saturation on the Wash Efficiency under Bottom Terminated Components
Achieving Lower Voids in Solder Assemblies
Tue, Mar 18, 2025 - 2:00 PM to 3:00 PM
S07: Assembly Processes and Testing 2: Component Reuse and Repair
Instructor/Speaker: Mr. Jeff Ferry, President, Circuit Technology Center, Inc.
Instructor/Speaker: Mr. Shavi Spinzi, Vice President PCB and AME Technology, Essemtec AG
General Committee: Assembly Processes and Testing
Event Type: Technical Conference Session
Location: 303A
Robotic Process for Fast and Reliable BGA Reballing
The Economics of Component Salvage and Reuse
Tue, Mar 18, 2025 - 2:00 PM to 3:00 PM
S08: PCB Fabrication and Materials 2: Flex, Hybrid 1
Instructor/Speaker: Mr. Kenji Koike, Principal Engineer, JX Advanced Metals Corporation
Instructor/Speaker: Ms. Lu Xiao, RD Manager, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Mr. Terry Wright, CTO SYE USA, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 303B
Fatigue Evaluation of FPC under Torsional Bending for Wearable Devices
Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex Board
Tue, Mar 18, 2025 - 2:00 PM to 3:00 PM
S09: Factory of the Future 2: Traceability
Instructor/Speaker: Mr. Craig Lax, Head of Product, Paravela
Instructor/Speaker: Mr. Ian Orpwood, Direct of Sales - Tools Division, Kurtz Ersa
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 304AB
Process Traceability in Hand Soldering, Rework and Repair – The Missing Link
Implementing IPC-1782 External Traceability for Trusted Material Provenance across the Supply Chain
Tue, Mar 18, 2025 - 2:00 PM to 3:00 PM
S10: High-Density Substrates
Instructor/Speaker: Mr. Lars Böttcher, Group Manager, Fraunhofer IZM Berlin
Instructor/Speaker: Mr. Jayson Sergo, Director of Technology, Flexible Circuits
General Committee: High-Density Substrates
Event Type: Technical Conference Session
Location: 304C
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
High Density Substrates for Chiplet Technologies
Tue, Mar 18, 2025 - 3:00 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Instructor/Speaker: Frank Honyotski, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210B
Tue, Mar 18, 2025 - 3:00 PM to 4:00 PM
What Math is Required for 75% Hole Fill?
Instructor/Speaker: Mr. Ben Gumpert, Manufacturing Engineer, Lockheed Martin
Instructor/Speaker: Mr. Symon Franklin, Senior Production Engineer, Custom Interconnect Ltd
Instructor/Speaker: Mr. Jeff Black, Quality Control Manager, Intervala, LLC
Instructor/Speaker: Mr. Jonathon Vermillion, Principal M&P Engineer, BAE Systems
Instructor/Speaker: Mr. Jarrod Webb, Manufacturing Robotics Engineering, Lockheed Martin Missiles & Fire Control
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Tue, Mar 18, 2025 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Instructor/Speaker: Shuming Gao, Zhejiang University
Instructor/Speaker: Victor Xu, Huawei Technologies Co. Ltd
Instructor/Speaker: Zhiqian Sang, Hangzhou Dianzi University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 209A
Tue, Mar 18, 2025 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Instructor/Speaker: Milea Kammer, Honeywell International
Instructor/Speaker: Timothy Pearson, Collins Aerospace
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 208A
Tue, Mar 18, 2025 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Instructor/Speaker: Brian Chislea, Dow Corporation
Instructor/Speaker: Torrey Clark, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 207CD
Tue, Mar 18, 2025 - 3:15 PM to 5:00 PM
7-24A: Printed Board Process Effects Handbook Task Group
Instructor/Speaker: Zhiman Chen, Senior Engineer, CRRC TEC
Instructor/Speaker: Milea Kammer, Honeywell International
General Committee: Process Control
Event Type: Standards Development Meeting
Location: Room 210A
Tue, Mar 18, 2025 - 3:30 PM to 5:00 PM
S11: PCB Fabrication and Materials 3: Laminate Materials
Instructor/Speaker: Ms. Crystal Vanderpan, Director, Principal Engineering, UL
Instructor/Speaker: Mr. Fortune Xiao, Technical Marketing Project Manager, Shengyi Technology Co., Ltd. (SYTECH)
Instructor/Speaker: Mr. Patrick Stockbruegger, Product Manager, LPKF Laser & Electronics SE
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 303C
Design and Performance Study of Low ?Carbon Footprint Bio-based Copper Clad Laminates
Extended Analysis of Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
Glass Type Comparison
Tue, Mar 18, 2025 - 3:30 PM to 4:30 PM
S12: High-Frequency, 5G and 6G Applications
Instructor/Speaker: Mr. Benny Gustafson, Senior Specialist SMA & Interconnect, Ericsson AB
Instructor/Speaker: Dr. Ayman Isaac, Sr. Signal Integrity Engineer, Isola Group
Instructor/Speaker: Ms. Emma Quinn, PCB Qualification Engineer, IBM
General Committee: High-Frequency, 5G and 6G Applications
Event Type: Technical Conference Session
Location: 303A
Warpage Mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
Tue, Mar 18, 2025 - 3:30 PM to 5:00 PM
S13: Factory of the Future 3: Smart Manufacturing Applications
Instructor/Speaker: Mr. Feng Xue, Senior Technical Staff Member, IBM
Instructor/Speaker: Mr. Robert Miklosey, VP-Product Management, Aegis Software
Instructor/Speaker: Mrs. Szu Yu Lin, Product Manager, Delta Electronics
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 303B
Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization
CFX Drives the Digital Strength of the Industry and Leads the New Era of Intelligent Manufacturing
The Human Edge in Digital Manufacturing - Beyond Automation the Role of People in Industry 4.0
Tue, Mar 18, 2025 - 3:30 PM to 4:30 PM
S14: PCB Fabrication and Materials 4: Additive, Semi-additive, and Novel Build-Up Technologies
Instructor/Speaker: Mr. Joe Dickson, SVP Product Innovation and Technology, Wus Int.
Instructor/Speaker: Mr. Roger Massey, Technical Marketing Manager, MKS Atotech
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 304AB
Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing
Capabilities and Challenges in Taking The Step From HDI to Advanced HDI
Tue, Mar 18, 2025 - 3:30 PM to 5:00 PM
S15: Assembly Processes and Testing 3: Advancements in Printing and Deposition
Instructor/Speaker: Mr. Miguel Colomer, Process Application Manager, Yamaha Motor Corp., USA
Instructor/Speaker: Mr. Edward Nauss, Sr. Applications Engineer, ITWEAE
Instructor/Speaker: Mr. Anthony Lentz, Chemist & Field Application, FCT Assembly
Instructor/Speaker: Mrs. Debbie Carboni, Global Product Line Manager, Electronics, KYZEN Corp
General Committee: Assembly Processes and Testing
Event Type: Technical Conference Session
Location: 304C
Benefits and Advantages of a Variable Angle Screen Printer Head/Squeegee
Optimization of Solder Paste Printing for Ultra-High-Density-Interconnec t (UHDI) Applications
Optimizing SMT Printing: The Impact of Contact Time and Fluid Dynamics on Yield Enhancement
Tue, Mar 18, 2025 - 5:00 PM to 6:00 PM
Networking with Poster Presenters on the Show Floor
Event Type: Posters
Location: Exhibit Hall: Behind Aisle 4100
Tue, Mar 18, 2025 - 5:00 PM to 6:00 PM
Show Floor Welcome Reception
Event Type: Special Event/Networking
Location: Exhibit Hall
Wed, Mar 19, 2025 - 8:00 AM to 9:00 AM
2-15F: Obsolete and Discontinued Product Task Group
Instructor/Speaker: Curtis Grosskopf, IBM Corporation
Instructor/Speaker: Adam Wheeler, Anthesis
General Committee: Data Generation and Transfer Documentation
Event Type: Standards Development Meeting
Location: Room 208A
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
2-16D: IPC-2581 Users Task Group
Instructor/Speaker: Kevin Kusiak, Lockheed Martin Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 208B
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
2-19A: Critical Components Traceability Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 212A
Wed, Mar 19, 2025 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Instructor/Speaker: Erika Crandall, TE Connectivity, NC
Instructor/Speaker: Udo Welzel, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211B
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
5-22BT: J-STD-001 Training Committee
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Instructor/Speaker: Beverley Christian, HDP User Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 209A
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Instructor/Speaker: Garry McGuire, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 211A
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Instructor/Speaker: Russell Shepherd, Element Materials Technology Anaheim
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Instructor/Speaker: Jan Pedersen, NCAB Group AB
Instructor/Speaker: Herb Snogren, Bristlecone LLC
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: Room 207B
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
ESDS Control Plan
Event Type: Standards Development Meeting
Location: Room 210D
Wed, Mar 19, 2025 - 8:00 AM to 10:00 AM
iNEMI Roadmap Readout and Future Planning Session: Board Assembly
Instructor/Speaker: Dr. Francis Mullany, iNEMI Director of Roadmapping, iNemi
Instructor/Speaker: Dr. Paul Wang, Vice President of Technology Engineering and Global Quality, MiTAC
Instructor/Speaker: Srinivasa Aravamudhan, Principal Engineer in Board Assembly Technology Development, Intel
Event Type: Special Event
Location: Room 209B
Wed, Mar 19, 2025 - 8:00 AM to 9:00 AM
Keynote Session: 3D Integration and Chiplets: An Edge AI perspective 
Instructor/Speaker: Dr. Ahmad Bahai, Senior VP & CTO, Texas Instruments
Event Type: Special Event/Keynotes
Location: Ballroom D
Wed, Mar 19, 2025 - 9:00 AM to 5:00 PM
2-18: Supplier Declaration Subcommittee Task Groups
Instructor/Speaker: Randall Flinders, GreenSoft Technology Inc.
Instructor/Speaker: Walter Jager, ECD Compliance
Instructor/Speaker: Chuck LePard, DXC Technology
General Committee: Data Generation and Transfer Documentation
Event Type: Standards Development Meeting
Location: Room 208A
Wed, Mar 19, 2025 - 9:30 AM to 11:30 AM
S16: Protective Coatings
Instructor/Speaker: Dr. Aysegul K. Nebioglu, Senior R&D Team Manager, Global, Dymax
Instructor/Speaker: Ms. Beth Turner, Technical Manager, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Dr. Rakesh Kumar, Vice President of Technology, Specialty Coating Systems
General Committee: Protective Coatings
Event Type: Technical Conference Session
Location: 304C
Advanced Corrosion Protection for Electronics Using ALD + Parylene Multilayer Nanocoatings
Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating
Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions
Wed, Mar 19, 2025 - 9:30 AM to 11:30 AM
S17: Soldering Materials and Processes Technologies
Instructor/Speaker: Mrs. Thuy Nguyen, Technical Support Engineer, Indium Corporation
Instructor/Speaker: Mrs. Gayle Towell, Content Specialist, AIM Solder
Instructor/Speaker: Dr. Ian Tevis, R&D Manager - SAFI-Tech Group, Indium Corporation
Instructor/Speaker: Mrs. Anna Lifton, R&D Director, Macdermid Alpha
General Committee: Soldering Materials and Processes Technologies
Event Type: Technical Conference Session
Location: 303A
Exploring the Feasibility and Challenges of a Low Temperature Alloy in Wave Soldering Applications
Evaluating the Enhancements in Reliability Achieved Through Integration of Polymer Reinforcement
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed Alloy Solder Paste
Wed, Mar 19, 2025 - 9:30 AM to 11:30 AM
S18: Sustainability for Electronics: PCB Materials and Processes
Instructor/Speaker: Dr. Maarten Cauwe, R&D Team Leader, imec
Instructor/Speaker: Mr. Stephen Driver, CEO, Jiva Materials Limited
Instructor/Speaker: Ms. Elise Baker, Sustainability Specialist - Electronics, MacDermid Alpha Electronics Solutions
General Committee: Sustainability for Electronics
Event Type: Technical Conference Session
Location: 303B
Design Considerations for Sustainable Printed Circuit Boards
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint
A Comprehensive Sustainability Comparison of Primary Metallization Processes
Wed, Mar 19, 2025 - 9:30 AM to 11:30 AM
S19: Quality & Reliability 3: Assembly and Test Processes
Instructor/Speaker: Dr. Reza Ghaffarian, Principal Engineer, JPL
Instructor/Speaker: Mr. Dushsyant Rajamohan, Product Manager, Keysight Technologies
Instructor/Speaker: Mr. Matthias Zapatka, Technical Service and Support /Field Applications Engineer, INGUN USA, Inc.
Instructor/Speaker: Ms. Alyssa Berding, Solutions Engineer, Keysight Technologies
General Committee: Quality & Reliability
Event Type: Technical Conference Session
Location: 303C
Spring-Probe Technologies for End-of-Line Test, History, Design and Latest Trends and Applications
Conformally Coated QFN Assemblies Under TC and a New HALT
Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time
3D X-ray of CTBGA228 Assembly from -105℃ to 105℃
Wed, Mar 19, 2025 - 9:30 AM to 11:30 AM
S20: Power Electronics
Instructor/Speaker: Ms. Batcheva Dominguez Tellez, International Application Engineer, Stannol GmbH & Co. KG
Instructor/Speaker: Mr. Shantanu Joshi, Support Advisory Engineer, Koki Solder America
Instructor/Speaker: Mr. Takenori Kakutani, Marketing Leader, Business Development Dept., Taiyo Ink Mfg. Co., Ltd.
Instructor/Speaker: Dr. Stefan Behrendt, Senior Research Engineer, Semikron Danfoss GmbH
General Committee: Power Electronics
Event Type: Technical Conference Session
Location: 304AB
Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions
Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability
Flux Technology Development for Solder Paste Compatible w/ Formic Acid Reflow Oven for Power Devices
Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material
Wed, Mar 19, 2025 - 9:30 AM to 10:30 AM
What Assurance and Challenges Do Vintage IPC Test Methods Such As ROSE Pose For New Technology?
Instructor/Speaker: Eric Camden, Lead Investigator, Foresite
Instructor/Speaker: Mike Konrad, Founder / CEO, Aqueous Technologies
Instructor/Speaker: Jason Fullerton, Principal Manufacturing Engineer, CAES by Honeywell
Instructor/Speaker: Graham Naisbitt, President, Gen 3
Instructor/Speaker: Sharissa Johns, Associate Fellow, Lockheed Martin
Instructor/Speaker: Christina Landon, Materials Engineer, Naval Surface Warfare Ctr
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Wed, Mar 19, 2025 - 10:00 AM to 3:00 PM
1-14: DFX Standards Subcommittee
Instructor/Speaker: Kevin Kusiak, Lockheed Martin Corporation
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: Room 208B
Wed, Mar 19, 2025 - 10:00 AM to 12:00 PM
5-24A: Flux Specifications Task Group
Instructor/Speaker: Mr. Anthony Lentz, Chemist & Field Application, FCT Assembly
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 209A
Wed, Mar 19, 2025 - 10:00 AM to 12:00 PM
e-Mobility Quality & Reliability Advisory Group (EVQR)
Brian Chislea, Dow Corporation
Brent Frizzell
Event Type: Special Event
Location: Room 207A
Wed, Mar 19, 2025 - 10:15 AM to 12:00 PM
2-12C: Cybersecurity Protection Standard Task Group
Instructor/Speaker: Hiroyuki Watanabe, NEC Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Wed, Mar 19, 2025 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Instructor/Speaker: Minsu Lee, Korea Packaging Integration Association
Event Type: Standards Development Meeting
Location: Room 207B
Wed, Mar 19, 2025 - 10:15 AM to 3:00 PM
7-12: Microsection Subcommittee
Instructor/Speaker: Allen Keeney, Johns Hopkins University
General Committee: Testing
Event Type: Standards Development Meeting
Location: Room 212A (10:15-12), Room 212B (1:30-3)
Wed, Mar 19, 2025 - 10:15 AM to 12:00 PM
7-31AT AND D-33AT: IPC-A-600 and IPC-6012 Training Joint Meeting
Instructor/Speaker: Mr. Leo Lambert, Vice President, Technical Director, EPTAC LLC
Instructor/Speaker: Jamie Noland, Blackfox Training Institute
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 10:15 AM to 12:00 PM
7-31K AND 7-31H: Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting
Instructor/Speaker: Robert Cooke, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Wed, Mar 19, 2025 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 11:00 AM to 12:00 PM
The Ultimate PCB Design, Fabrication and Manufacturing Masterclass: Expert Insights and Strategies from an All-Star Panel
Instructor/Speaker: Coreen Blaylock, Director Workforce Partnerships, IPC
Instructor/Speaker: Gerry Partida, Vice President of Technology, Summit Interconnect
Instructor/Speaker: Kristopher S. Moyer, Instructor, IPC
Instructor/Speaker: Dana Korf, Sr. Director Technology/FAE, Victory Giant Technology
Instructor/Speaker: Kelly Allen, Online Instructor-Led Training Manager, IPC
Event Type: Learning Lounge
Location: Exhibit Hall
Wed, Mar 19, 2025 - 12:00 PM to 1:30 PM
Luncheon Keynote: Electronics: the Resource Transforming the Global Economy
Instructor/Speaker: Dr. John W. Mitchell, IPC President and CEO, IPC
Event Type: Special Event/Keynotes
Location: Ballroom D
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
2-19E Data Collection and Reporting for Sustainability Compliance Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212A
Wed, Mar 19, 2025 - 1:30 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Instructor/Speaker: Erika Crandall, TE Connectivity, NC
Instructor/Speaker: Udo Welzel, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211B
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
5-22AS: Space and Military Electronic Assemblies Task Group
Instructor/Speaker: Garry McGuire, NASA Marshall Space Flight Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 211A
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
Instructor/Speaker: Robert Rowland, Axiom Electronics, LLC
Location: Room 209A
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
5-24G: Polymerics Standard Task Group
Instructor/Speaker: Robert Cooke, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 210D
Wed, Mar 19, 2025 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Instructor/Speaker: Brian Chislea, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 207CD
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
7-25A: Automated Optical Inspection Process Control Standard Task Group
Instructor/Speaker: Mr. Feng Xue, Senior Technical Staff Member, IBM
Event Type: Standards Development Meeting
Location: Room 207B
Wed, Mar 19, 2025 - 1:30 PM to 5:00 PM
7-34B: IPC-7731 Task Group
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210A
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Focus: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: Room 209B
Wed, Mar 19, 2025 - 1:30 PM to 3:30 PM
Design Town Hall Meeting
Event Type: Special Event
Location: 304AB
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S21: Quality and Reliability 4: Microvia and Embedded PCBs
Instructor/Speaker: Mr. Robin Wieland, Reliability- and Product Quality Engineer, Dyconex
Instructor/Speaker: Mr. Todd MacFadden, Senior Technology Development Engineer, Bose Corporation
General Committee: Quality & Reliability
Event Type: Technical Conference Session
Location: 303A
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
Reliability of Micro Vias
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S22: Novel Thermal Interface Materials (TIMs)
Instructor/Speaker: Mr. Milos Lazic, Senior Product Specialist, Indium Corporation
Instructor/Speaker: Mr. Sunny Agarwal, Senior Applications Engineer, ITW
General Committee: Novel Thermal Interface Materials (TIMs)
Event Type: Technical Conference Session
Location: 303B
High-Performance Phase Change Metal TIMs - Part II
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S23: PCB Fabrication and Materials 5:
Flex and Flex Hybrid Technologies
Instructor/Speaker: Mr. Attila Rektor, Graduate Research Assistant, Micron School of Materials Science and Engineering
Instructor/Speaker: Ms. Lu Xiao, RD Manager, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Mr. Terry Wright, CTO SYE USA, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 303C
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S24: Assembly Process and Testing 4:
Thermal Profiling
Instructor/Speaker: Dr. Samuel McMaster, R&D Specialist, Pillarhouse International
Instructor/Speaker: Mr. Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
General Committee: Assembly Processes and Testing
Event Type: Technical Conference Session
Location: 304C
Influence of Accurate Thermal Profiling on Reflow Process Control
Thermal Profiling of Pre-Heater Configurations w Added Convection to Determine Heating Effectiveness
Wed, Mar 19, 2025 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Event Type: Special Event/Networking
Location: Exhibit Hall
Wed, Mar 19, 2025 - 2:30 PM to 3:30 PM
Network with Poster Presenters on the Show Floor
Event Type: Posters
Location: Exhibit Hall: Behind Aisle 4100
Wed, Mar 19, 2025 - 3:00 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Michelle Gleason, Plexus Corporation
Event Type: Standards Development Meeting
Location: Room 209A
Wed, Mar 19, 2025 - 3:00 PM to 4:00 PM
Maximizing Returns: The ROI of Training in Electronics Manufacturing
Instructor/Speaker: Carlos Plaza, Senior Director of Education, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
1-10D: Material Selection for Design Task Group
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: Room 209B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
5-24A, 5-24B AND 5-24C Joint Meeting
Instructor/Speaker: Beverley Christian, HDP User Group
Instructor/Speaker: Timothy Pearson, Collins Aerospace
Instructor/Speaker: Mr. Anthony Lentz, Chemist & Field Application, FCT Assembly
Instructor/Speaker: Milea Kammer, Honeywell International
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
7-25B: AOI Process Control for IC Substrates Standard Task Group
Instructor/Speaker: Mr. Feng Xue, Senior Technical Staff Member, IBM
Event Type: Standards Development Meeting
Location: Room 207B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Instructor/Speaker: Mr. Leo Lambert, Vice President, Technical Director, EPTAC LLC
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Instructor/Speaker: Christina Landon, Materials Engineer, Naval Surface Warfare Ctr
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: Room 212B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Instructor/Speaker: Richard Wessel, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S25: Additively Manufactured Electronics and Plastronics
Instructor/Speaker: Dr. Kenneth Church, CEO & Founder, Sciperio Inc.
Instructor/Speaker: Mr. Stephan Schmidt, Technical Sales Consultant 3D MID - North America, HARTING AG
Instructor/Speaker: Dr. Lina Kadura, Project Leader/prototype engineer, CEA
General Committee: Additively Manufactured Electronics and Plastronics
Event Type: Technical Conference Session
Location: 303A
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Enhancing Component Density in PCBs A Study on Molded Interconnect Device Integration
Additive Printed PCB Manufacturing for More Sustainable Electronics
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S26: Factory of the Future 4: Simulation and Modeling
Instructor/Speaker: Mr. Lukasz Nowicki, Project Engineer, QWED Sp. z o. o.
Instructor/Speaker: Mr. Ben Rachinger, Research Associate, Friedrich-Alexander-Universit t Erlangen-Nürnberg
Instructor/Speaker: Dr. Mehdi Hamid, Senior Hardware Architect, IBM
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 303B
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Improving THT-AOI Image Classification through Federated Learning A Study on Model Performance
Applying Pre-trained ViT Model for PCB & Components Image Recognition at Scale
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S27: Quality and Reliability 5: PCB Fabrication and Materials
Instructor/Speaker: Mr. Ian Lung, Manager, ASK PCB (Aoshikang Technology)
Instructor/Speaker: Mr. Reginald Lai, Platform Hardware Design Engineer, Intel Corporation
Instructor/Speaker: Mr. Kevin Bivona, R&D Manager, AGC Multi Material America
General Committee: Quality & Reliability
Event Type: Technical Conference Session
Location: 303C
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
Plated Through Hole Via Stub Length Reduction and Control in PBC
The Mechanism of Fill Voiding in Resin Plugged Back-Drilled Hole
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S28: Design for High Speed, High Bandwidth and Reliability
Instructor/Speaker: Mr. Amit Bahl, Chief Revenue Officer, Sierra Circuits
Instructor/Speaker: Mr. Reginald Lai, Platform Hardware Design Engineer, Intel Corporation
Instructor/Speaker: Mr. Brett Grossman, Sr Staff Engineer, Intel Corporation
Instructor/Speaker: Mr. Joe Fuller, Manufacturing Engineering Technologist, Intel Corp
General Committee: Design for High Speed, High Bandwidth and Reliability
Event Type: Technical Conference Session
Location: 304C
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Evaluating PCB Fabrication Capabilities for Compliance with SFF TA-1002 and CEM Connector Specificat
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gbs and Beyond
Wed, Mar 19, 2025 - 6:00 PM to 7:30 PM
Women in Electronics Reception 
Presentation: Eagerly Empowering Worn-Out Professionals with Humor, Hindsight and Hallelujahs
Instructor/Speaker: Jody Urquhart, Author and Motivational Speaker
Event Type: Special Event/Networking
Location: 304D
Thu, Mar 20, 2025 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Instructor/Speaker: Beverley Christian, HDP User Group
Instructor/Speaker: Christina Landon, Materials Engineer, Naval Surface Warfare Ctr
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: Room 207A
Thu, Mar 20, 2025 - 8:00 AM to 12:00 PM
5-21R: Die Attach and Wire Bond for Automotive Applications
Instructor/Speaker: Gaston Hidalgo, Toyota Motor North America
Event Type: Standards Development Meeting
Location: Room 208A
Thu, Mar 20, 2025 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Instructor/Speaker: Tyler Siebert, Lockheed Martin Missiles & Fire Control
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 207CD
Thu, Mar 20, 2025 - 8:00 AM to 12:00 PM
8-80: Lead Free Electronics Risk Management (PERM) Council
Instructor/Speaker: Mr. Ben Gumpert, Manufacturing Engineer, Lockheed Martin
Event Type: Standards Development Meeting
Location: Room 208B
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD29: Técnicas de Soldadura, Producción y Reparacion (course taught in Spanish)
Instructor/Speaker: Cecilia Rios, Engineering Technician and Rework and Repair, Reliance CM
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303A
Pd29
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD30: Sustainable Surface Finishes for UHDI PCBs
Instructor/Speaker: Dr. Kunal Shah, President, LILOTREE
Focus: HDI, µHDI AND SUBSTRATES
Event Type: Professional Development
Location: 303B
PD30
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD31: Harnessing Additive Manufacturing of Solder Mask with Inkjet Technology: Benefits and Implementation
Instructor/Speaker: Dr. Luca Gautero, Product Manager, SUSS MicroTec
Focus: PCB FABRICATION AND MATERIALS
Event Type: Professional Development
Location: 303C
PD 31
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD33: Fundamentals of Electrical Contact
Instructor/Speaker: Professor Robert Jackson, PhD, Professor, Auburn University
Focus: QUALITY & RELIABILITY
Event Type: Professional Development
Location: 304D
PD33
Thu, Mar 20, 2025 - 8:00 AM to 5:00 PM
V-UL
Event Type: Standards Development Meeting
Thu, Mar 20, 2025 - 8:30 AM to 11:00 AM
S29: Special Session: Advanced Packaging for High Performance Computing and AI/Data Center Applications
Instructor/Speaker: Dr. Jung H. Yoon, Distinguished Engineer & CTO Supplier Technology & Quality,, IBM
Instructor/Speaker: Mr. Mark Gerber, Senior Director of Engineering and Technical Marketing, ASE (US) Inc.
Instructor/Speaker: Dr. Patrick Thompson, Distinguished Member Technical Staff,, Texas Instruments
Instructor/Speaker: Mr. Vivek Raghuraman, CEO/Co-founder, Mixx Technologies Inc
Instructor/Speaker: Mr. Matt Kelly, CTO & VP Technology Solutions, IPC
Instructor/Speaker: Dr. Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Technology Solution, IPC
Event Type: Technical Conference Session
Location: 304AB
Thu, Mar 20, 2025 - 9:30 AM to 5:00 PM
2-18: Supplier Declaration Subcommittee Task Groups
Instructor/Speaker: Randall Flinders, GreenSoft Technology Inc.
Instructor/Speaker: Walter Jager, ECD Compliance
Instructor/Speaker: Chuck LePard, DXC Technology
General Committee: Data Generation and Transfer Documentation
Event Type: Standards Development Meeting
Location: Room 210A
Thu, Mar 20, 2025 - 9:30 AM to 10:30 AM
Designing Effective Training for the Electronics Manufacturing Industry
Instructor/Speaker: Carlos Plaza, Senior Director of Education, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Thu, Mar 20, 2025 - 10:00 AM to 12:00 PM
5-31D: Cleaning Handbook Task Group
Instructor/Speaker: Dr. Adam Klett, Director of Science, KYZEN Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 207A
Thu, Mar 20, 2025 - 10:30 AM to 11:30 AM
Implementing and Funding Regional Workforce Ecosystems in Electronics Manufacturing
Instructor/Speaker: Charlene Gunter, Sr Director of IPC Education Foundation, IPC
Instructor/Speaker: Victoria Hawkins, Director of Grants and Proposals, IPC
Instructor/Speaker: Coreen Blaylock, Director Workforce Partnerships, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Thu, Mar 20, 2025 - 11:30 AM to 2:00 PM
S30: Special Session: Advanced Packaging for EV Power Electronics
Instructor/Speaker: Mr. Lars Böttcher, Group Manager, Fraunhofer IZM Berlin
Instructor/Speaker: Mr. Frank Heidemann, Vice President and Technology Leader, Emerson’s Test and Measurement Business
Instructor/Speaker: Dr. Stefan Behrendt, Senior Research Engineer, Semikron Danfoss GmbH
Instructor/Speaker: Dr. Olaf Schoenfeld, Sales Manager, ZESTRON
Instructor/Speaker: Mr. Jason Schwartz, Global Product Line Manager for Evolving Technology, KYZEN
Event Type: Technical Conference Session
Location: 304AB