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Programs: 71 - 80 of 188
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Instructor/Speaker: Michael Coll, Denkai America Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: Room 208A
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Instructor/Speaker: Fonda Wu, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 210C
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Instructor/Speaker: Jason Keeping, Celestica International L.P.
Instructor/Speaker: Fonda Wu, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: Room 207CD
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Instructor/Speaker: Zhiman Chen, Senior Engineer, CRRC TEC
Instructor/Speaker: Milea Kammer, Honeywell International
General Committee: Process Control
Event Type: Standards Development Meeting
Location: Room 210B
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Instructor/Speaker: Marie Parliman, BAE Systems
Instructor/Speaker: Helena Pasquito, EPTAC LLC
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Instructor/Speaker: Joseph Kane, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 209B
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: Room 207A
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 11:30 AM
S01: Quality and Reliability 1: High Voltage & Harsh Environment Reliability
Instructor/Speaker: Dr. Lothar Henneken, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Ms. Jyothsna Murli Rao, PhD student, Center for Electronic Corrosion, DTU
Instructor/Speaker: Dr. Walter Olbrich, Director Field Application Engineering, TTM Technologies
General Committee: Quality and Reliability
Event Type: Technical Conference Session
Location: 303C
High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of A PCB
An Industry Survey to Report and Compare the Understanding of Failure Mechanisms
Understanding PCB Failure Mechanisms Under High Voltage and Condensing Conditions
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 12:00 PM
S02: Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness
Instructor/Speaker: Dr. Mike Bixenman, President, Magnalytix, LLC
Instructor/Speaker: Dr. Kapil Kumar Gupta, Postdoc Fellow, Centre for Climate Robust Electronics design (CRED) DTU Construct, Technical University of Denmark
Instructor/Speaker: Prof. Rajan Ambat, PhD, Professor, Technical University of Denmark
Instructor/Speaker: Dr. Anish Rao Lakkaraju, Post-Doctoral Researcher, Center for Electronic Corrosion (CELCORR)
General Committee: Quality and Reliability
Event Type: Technical Conference Session
Location: 303A
Methods Used to Qualify Soldering and Cleaning Materials and Processes
From the Corrosion to Short Circuiting in Electronics
Enhancing Humidity Robustness of Electronics
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design
IPC APEX EXPO 2025
Tue, Mar 18, 2025 - 10:00 AM to 11:30 AM
S03: Factory of the Future 1: AI for Test and Inspection
Instructor/Speaker: Mr. Stephan Pirner, Principal Software Engineer, Nordson Corp
Instructor/Speaker: Dr. Eyal Weiss, CTO and Founder, Cybord
Instructor/Speaker: Mr. Shobhit Agrawal, Customer Success Manager, Keysight Technologies
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 303B
Universal AI-Powered Segmentation of PCBA and Semi-Conductor
A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI
Unlocking the Promise of AI in Electronic Manufacturing