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Programs: 51 - 60 of 164
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Instructor/Speaker: Brian Chislea, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Instructor/Speaker: Debbie McDade, Advanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 5:00 PM
7-34C: 7712 Task Group
General Committee: Product Assurance
Event Type: Standards Development Meeting
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
D-55 AND D55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Instructor/Speaker: Dr. Bhanu Sood Ph.D., Deputy Center Chief Technologist, NASA Goddard Space Flight Center
Instructor/Speaker: Jeff Seekatz, TTM Technologies - Stafford
Instructor/Speaker: Raj Kumar, Northrop Grumman Space Systems
General Committee: Embedded Devices
Event Type: Standards Development Meeting
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD22: Ask the Flexperts Design through Test with Lessons Learned, Part Two
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Instructor/Speaker: Mark Finstead, Director of Engineering , Flexible Circuit Technologies
Event Type: Professional Development
Location: 303-A
Focus: PCB Fabrications and Materials
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD23: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk' Part Two
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303-B
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD24: Adapting and Engineering Model-based PCB Design in Step with Sustainability and Digital Twins
Instructor/Speaker: Filbert S Arzola, Senior Principal Electrical Engineer, Raytheon
Focus: DESIGN
Event Type: Professional Development
Location: 303-C
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD25: Designing for Reliability: Preventing Leakage Currents and ECM on the High-Reliability Assemblies Exposed to Harsh Environmental Conditions, Part Two
Instructor/Speaker: Dr. Mike Bixenman Ph.D., President, Magnalytix
Focus: Quality & Reliability
Event Type: Professional Development
Location: 303-D
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD26: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D and 3D System-in-Packaging and Ultra High-Density Interposer Development
Instructor/Speaker: Vern Solberg, Technical Consultant, STC
Focus: Advanced Packaging/Components
Event Type: Professional Development
Location: 304-D
IPC APEX EXPO 2024
Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD27: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 304-C