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Programs: 51 - 60 of 188
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 3:00 PM
D-55 AND D55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Instructor/Speaker: Raj Kumar, Northrop Grumman Space Systems
Instructor/Speaker: Dr. Bhanu Sood, Deputy Center Chief Technologist, NASA Goddard Space Flight Center
Instructor/Speaker: Jeff Seekatz, TTM Technologies - Stafford
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: Room 207CD
Description
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD22: Ask the Flexperts Design through Test with Lessons Learned, Part Two
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Event Type: Professional Development
Location: 303A
Focus: PCB Fabrications and Materials
Description
PD22
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD23: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk' Part Two
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303B
Description
PD23
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD24: Adapting and Engineering Model-based PCB Design in Step with Sustainability and Digital Twins
Instructor/Speaker: Filbert S Arzola, Senior Principal Electrical Engineer, Raytheon
Focus: DESIGN
Event Type: Professional Development
Location: 303C
Description
PD24
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD25: Designing for Reliability: Preventing Leakage Currents and ECM on the High-Reliability Assemblies Exposed to Harsh Environmental Conditions, Part Two
Instructor/Speaker: Dr. Mike Bixenman, President, Magnalytix, LLC
Instructor/Speaker: Mr. Vladimir Sítko, Founder and Mentor, PBT Works s.r.o.
Instructor/Speaker: Dr. Adam Klett, Director of Science, KYZEN Corporation
Focus: Quality & Reliability
Event Type: Professional Development
Location: 303D
Description
PD25
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD26: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D and 3D System-in-Packaging and Ultra High-Density Interposer Development
Instructor/Speaker: Mr. Joe Fjelstad, Founder, Verdant Electronics
Focus: Advanced Packaging/Components
Event Type: Professional Development
Location: 304D
Description
PD26
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD27: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 304C
Description
PD27
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 1:30 PM to 4:30 PM
PD28: Polymers in Advanced Packaging, Part Two
Instructor/Speaker: Dr. Jeffrey Gotro, President, InnoCentrix, LLC
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 304AB
Description
PD28
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
2-17C: IPC-2592 DCX
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: Room 212B
Description
IPC APEX EXPO 2025
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Mon, Mar 17, 2025 - 3:15 PM to 5:00 PM
2-30: Terms and Definitions Committee
Instructor/Speaker: David Caputa, Lockheed Martin Corporation
Instructor/Speaker: Aaron Kennedy, Summit Interconnect - Anaheim
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: Room 207CD
Description