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Date
Sat, Mar 15th, 2025
Sun, Mar 16th, 2025
Mon, Mar 17th, 2025
Tue, Mar 18th, 2025
Wed, Mar 19th, 2025
Thu, Mar 20th, 2025
Event Type
Learning Lounge
Management
Professional Development
Special Event
Standards Development Meeting
Technical Conference Session
Focus
ASSEMBLY & TEST PROCESSES
Advanced Packaging/Components
Assembly and Joining
DESIGN
ELECTRONIC ASSEMBLY MATERIALS
Emerging Technologies
FACTORY OF THE FUTURE
HDI, µHDI AND SUBSTRATES
PCB FABRICATION AND MATERIALS
Product Assurance
QUALITY & RELIABILITY
SUSTAINABILITY FOR ELECTRONICS
General Committee
Additively Manufactured Electronics and Plastronics
Assembly Processes and Testing
Assembly and Joining
Base Materials
Cleaning and Coating
Data Generation and Transfer Documentation
Design for High Speed, High Bandwidth and Reliability
Electronic Product Data Description
Embedded Devices
Fabrication Processes
Factory of the Future
Flexible and Rigid-Flex Printed Board
High Speed/High Frequency Interconnections
High-Density Substrates
High-Frequency, 5G and 6G Applications
Novel Thermal Interface Materials (TIMs)
PCB Fabrication and Materials
Packaged Electronic Components
Power Electronics
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Protective Coatings
Quality & Reliability
Quality and Reliability
Rigid Printed Boards
Solder Processes & Reliability
Soldering Materials and Processes Technologies
Sustainability for Electronics
Terms and Definitions
Testing
Speaker
Aaron Kennedy, Summit Interconnect - Anaheim
Adam Wheeler, Anthesis
Allen Keeney, Johns Hopkins University
Anne Mason, Apple Inc.
Anthony Bryant, Kixx Faxx Research Analysis and Testing (KRAFT)
Batcheva Dominguez Tellez, Stannol GmbH & Co. KG
Ben Gumpert, Lockheed Martin-Missiles & Fire Control
Benoit Dagenais, TTI Inc.
Beverley Christian, HDP User Group
Brenda Baney, BCubed Consulting
Brian Chislea, Dow Corporation
Carlos Plaza, IPC
Cecilia Rios, Reliance CM
Charlene Gunter, IPC
Chris Shaw, Fujitsu Network Communications
Christina Landon, Naval Surface Warfare Ctr
Chuck LePard, DXC Technology
Coreen Blaylock, IPC
Curtis Grosskopf, IBM Corporation
Dale Lee
Dana Korf, Nano Dimension
Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
David Caputa, Lockheed Martin Corporation
Debbie Carboni, KYZEN Corp
Debbie McDade, Advanced Rework Technology
Dr. Adam Klett, KYZEN Corporation
Dr. Ahmad Bahai, Texas Instruments
Dr. Anish Rao Lakkaraju, Center for Electronic Corrosion (CELCORR)
Dr. Aysegul K. Nebioglu, Dymax
Dr. Bhanu Sood Ph.D., NASA Goddard Space Flight Center
Dr. Britta Schafsteller, MKS Atotech
Dr. Charlie Zhu, Nordson Corp
Dr. Eyal Weiss, Cybord
Dr. Feng Li, Centre for Climate Robust Electronics design (CRED) DTU Construct, Technical
Dr. Frank Xu, MacDermid Alpha Electronics Solutions
Dr. Ian Tevis, Indium Corporation
Dr. Jeffrey Gotro Ph.D., InnoCentrix, LLC
Dr. Jennie Hwang Ph.D., H-Technologies Group
Dr. John W. Mitchell, IPC
Dr. Jose Servin Ph.D., Vitesco
Dr. Jose Servin, Vitesco
Dr. Kunal Shah Ph.D., LILOTREE
Dr. Lina Kadura, CEA
Dr. Lothar Henneken, Robert Bosch GmbH
Dr. Luca Gautero Ph.D., SUSS MicroTec
Dr. Maarten Cauwe, imec
Dr. Mehdi Hamid, IBM
Dr. Mike Bixenman Ph.D., Magnalytix
Dr. Mike Bixenman, Magnalytix, LLC
Dr. Olaf Schoenfeld, ZESTRON
Dr. Rakesh Kumar, Specialty Coating Systems
Dr. Reza Ghaffarian, JPL
Dr. Samuel McMaster, Pillarhouse International
Dr. Stefan Behrendt, Semikron Danfoss GmbH
Dr. Thomas Marktscheffel, ASMPT
Dr. Tim Burke Ph.D., Arch Systems
Dr. Tom Dory Ph.D., ITM Consulting
Dr. Walter Olbrich, TTM Technologies
Eddie Hofer, Collins Aerospace
Eric Camden, Foresite
Erika Crandall, TE Connectivity, NC
Ernst Eggelaar, Microtronic M. V. GmbH
Filbert S Arzola, Raytheon
Fonda Wu, Raytheon Company
Francis Mullany, iNemi
Frank Honyotski, STI Electronics, Inc.
Garry McGuire, NASA Marshall Space Flight Center
Gaston Hidalgo, Toyota Motor North America
Gerard O'Brien, Solderability Testing & Solutions, Inc.
Gerry Partida, Summit Interconnect
Grace O'Malley, iNemi
Graham Naisbitt, Gen 3
Hartmut Berndt, B.E.STAT European ESD competence centre
Helena Pasquito, EPTAC LLC
Herb Snogren, Bristlecone LLC
Hiroyuki Watanabe, NEC Corporation
III Thomas Keily, JPS Composite Materials Corp.
Ife Hsu, Intel Corporation
Ingrid Swenson, TTM Technologies - Stafford
Jamie Noland, Blackfox Training Institute
Jan Pedersen, NCAB Group AB
Jarrod Webb, Lockheed Martin Missiles & Fire Control
Jason Fullerton, CAES
Jason Keeping, Celestica International L.P.
Jeff Seekatz, TTM Technologies - Stafford
Jerry Magera, PWBmaster
Jianqiang Luo, Southwest China Research Inst. of Electronic Equipment
Jim Hall, ITM Consulting
Jody Urquhart
Joe Russeau, Precision Analytical Laboratory
John Mastorides, Honeywell Aerospace
Jose Rios, Raytheon
Joseph Kane, BAE Systems
Jr Albert Block, National Instruments
Julie Silk, Keysight Technologies
Karl Sauter, High Density Packaging User Group International, Inc.
Kenji Koike, JX Advanced Metals Corporation
Kevin Kusiak, Lockheed Martin Corporation
Kevin Surace
Kristopher S. Moyer, IPC
Leo Lambert, EPTAC LLC
Louis Ungar, A.T.E. Solutions
Marie Parliman, BAE Systems
Mark Finstead, Flexible Circuit Technologies
Max Clark, Mentor Graphics Corporation
Michael Coll, Denkai America Inc.
Michael Creeden, Insulectro
Michelle Gleason, Plexus Corporation
Mike Konrad, Aqueous Technologies
Milea Kammer, Honeywell International
Minsu Lee, Korea Packaging Integration Association
Mr. Amit Bahl, Sierra Circuits
Mr. Anil Kher, Micro Interconnexion Pvt. Ltd.
Mr. Anthony Lentz, FCT Assembly
Mr. Attila Rektor, Micron School of Materials Science and Engineering
Mr. BRETT GROSSMAN, Intel Corporation
Mr. Ben Rachinger, Friedrich-Alexander-Universit
Mr. Benny Gustafson, Ericsson AB
Mr. Craig Lax, Paravela
Mr. David Bedner, Indium
Mr. David Cormier, Circuit Technology Center, Inc.
Mr. Dirk Ruess, MKS Atotech
Mr. Dushsyant Rajamohan, Keysight Technologies
Mr. Ed Kelley, Four Peaks Innovation
Mr. Fan Hong, ASKPCB
Mr. Feng Xue, IBM
Mr. Frank Heidemann, Emerson’s Test and Measurement Business
Mr. Gerjan Diepstraten, ITWEAE
Mr. Ian Orpwood, Kurtz Ersa
Mr. Jasbir Bath, Koki Solder America
Mr. Jason Benoit, nScrypt
Mr. Jayson Sergo, Flexible Circuits
Mr. Joe Dickson, Wus Int.
Mr. Joe Fuller, Intel Corp
Mr. Kevin Bivona, AGC Multi Material America
Mr. Lars Böttcher, Fraunhofer IZM Berlin
Mr. Lukasz Nowicki, QWED Sp. z o. o.
Mr. Matthias Zapatka, INGUN USA, Inc.
Mr. Miguel Colomer, Yamaha Motor Corp., USA
Mr. Milos Lazic, Indium Corporation
Mr. Neil Hubble, Akrometrix
Mr. Patrick Stockbruegger, LPKF Laser & Electronics SE
Mr. Reginald Lai, Intel Corporation
Mr. Robert Miklosey, Aegis Software
Mr. Robin Wieland, Dyconex
Mr. Roger Massey, MKS Atotech
Mr. Shavi Spinzi, Essemtec AG
Mr. Shobhit Agrawal, Keysight Technologies
Mr. Stephan Schmidt, HARTING AG
Mr. Stephen Driver, Jiva Materials Limited
Mr. Sunny Agarwal, ITW
Mr. Todd MacFadden, Bose Corporation
Mr. Vladimir Sítko, PBT Works s.r.o.
Mr. Wei Lin, National Engineering Research Center of Electronic Circuits Base Materials
Mr. ZHU Yuan, SHENGYI ELECTRONICS CO.,LTD.
Mrs. Anna Lifton, Macdermid Alpha
Mrs. Gayle Towell, AIM Solder
Mrs. Thuy Nguyen, Indium Corporation
Ms. Beth Turner, MacDermid Alpha Electronics Solutions
Ms. Crystal Vanderpan, UL
Ms. Elise Baker, MacDermid Alpha Electronics Solutions
Ms. Jyothsna Murli Rao, Center for Electronic Corrosion, DTU
Nick Koop, TTM Technologies
Oliver Koehler, Vitesco Technologies
Pablo Paster, Makersite
Paul Cooke, AGC
Phil Zarrow, ITM Consulting
Prof. Sebastian Fischmeister, Palitronica
Professor Rajan Ambat, Technical University of Denmark
Professor Robert Jackson, Auburn University
Raj Kumar, Northrop Grumman Space Systems
Randall Flinders, GreenSoft Technology Inc.
Ray Prasad, Ray Prasad Consultancy Group
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Richard Wessel, DuPont Electronics & Imaging
Robert Cooke, NASA Johnson Space Center
Robert Rowland, Axiom Electronics, LLC
Russell Shepherd, Element Materials Technology Anaheim
Scott Bowles, Lockheed Martin Corporation
Scott Meyer, Collins Aerospace
Scott Stephan, ELANTAS PDG
Shuming Gao, Zhejiang University
Steve Williams, TRA Consulting
Symon Franklin, Custom Interconnect Ltd
Szu Yu Lin, Delta Electronics
Takenori Kakutani, Taiyo Ink Mfg. Co., Ltd.
Terry Hoffman, Cisco Systems Inc.
Tiberiu Baranyi, Flextronics Romania SRL
Timothy Pearson, Collins Aerospace
Torrey Clark, Dow Corporation
Tyler Siebert, Lockheed Martin Missiles & Fire Control
Udo Welzel, Robert Bosch GmbH
Vern Solberg, STC
Victor Xu, Huawei Technologies Co. Ltd
Victoria Hawkins, IPC
Walter Jager, ECD Compliance
Zhiman Chen, CRRC TEC
Zhiqian Sang, Hangzhou Dianzi University
Location
209B
210A
210B
303-A
303-B
303-C
303-D
304-C
304-D
304AB
Ballroom A
Ballroom D
California Terrace
Exhibit Hall
Exhibit Hall: Behind Aisle 4100
Room 207A
Room 207B
Room 207CD
Room 208A
Room 208B
Room 208B (10-12), Room 209A (1:30-5)
Room 209A
Room 209B
Room 210A
Room 210B
Room 210C
Room 210D
Room 211A
Room 211B
Room 212A
Room 212A (10:15-12), Room 212B (1:30-3)
Room 212B
Show Floor in Hall C Behind the 3500 Aisle
Programs: 191 - 192 of 192
Programs per Page
5
10
20
30
50
100
500
1000
All
IPC APEX EXPO 2025
Thu, Mar 20, 2025 - 10:30 AM to 11:30 AM
Implementing and Funding Regional Workforce Ecosystems in Electronics Manufacturing
Instructor/Speaker: Charlene Gunter, Sr Director of IPC Education Foundation, IPC
Instructor/Speaker: Victoria Hawkins, Director of Grants and Proposals, IPC
Instructor/Speaker: Coreen Blaylock, Director Workforce Partnerships, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
IPC APEX EXPO 2025
Thu, Mar 20, 2025 - 11:30 AM to 2:00 PM
Special Session: Advanced Packaging for EV Power Electronics"
Instructor/Speaker: Mr. Lars Böttcher, Group Manager, Fraunhofer IZM Berlin
Instructor/Speaker: Dr. Stefan Behrendt, Senior Research Engineer, Semikron Danfoss GmbH
Instructor/Speaker: Dr. Olaf Schoenfeld, Sales Manager, ZESTRON
Instructor/Speaker: Mr. Frank Heidemann, Vice President and Technology Leader, Emerson’s Test and Measurement Business
Event Type: Technical Conference Session
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