Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S27: Quality and Reliability 5: PCB Fabrication and Materials
Instructor/Speaker: Mr. Ian Lung, Manager, ASK PCB (Aoshikang Technology)
Instructor/Speaker: Mr. Reginald Lai, Platform Hardware Design Engineer, Intel Corporation
Instructor/Speaker: Mr. Kevin Bivona, R&D Manager, AGC Multi Material America
General Committee: Quality & Reliability
Event Type: Technical Conference Session
Location: 303C
Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features
Plated Through Hole Via Stub Length Reduction and Control in PBC
The Mechanism of Fill Voiding in Resin Plugged Back-Drilled Hole
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S28: Design for High Speed, High Bandwidth and Reliability
Instructor/Speaker: Mr. Amit Bahl, Chief Revenue Officer, Sierra Circuits
Instructor/Speaker: Mr. Reginald Lai, Platform Hardware Design Engineer, Intel Corporation
Instructor/Speaker: Mr. Brett Grossman, Sr Staff Engineer, Intel Corporation
Instructor/Speaker: Mr. Joe Fuller, Manufacturing Engineering Technologist, Intel Corp
General Committee: Design for High Speed, High Bandwidth and Reliability
Event Type: Technical Conference Session
Location: 304C
Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects
Evaluating PCB Fabrication Capabilities for Compliance with SFF TA-1002 and CEM Connector Specificat
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gbs and Beyond
Wed, Mar 19, 2025 - 6:00 PM to 7:30 PM
Women in Electronics Reception 
Presentation: Eagerly Empowering Worn-Out Professionals with Humor, Hindsight and Hallelujahs
Instructor/Speaker: Jody Urquhart, Author and Motivational Speaker
Event Type: Special Event/Networking
Location: 304D
Thu, Mar 20, 2025 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Instructor/Speaker: Beverley Christian, HDP User Group
Instructor/Speaker: Christina Landon, Materials Engineer, Naval Surface Warfare Ctr
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: Room 207A
Thu, Mar 20, 2025 - 8:00 AM to 12:00 PM
5-21R: Die Attach and Wire Bond for Automotive Applications
Instructor/Speaker: Gaston Hidalgo, Toyota Motor North America
Event Type: Standards Development Meeting
Location: Room 208A
Thu, Mar 20, 2025 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Instructor/Speaker: Tyler Siebert, Lockheed Martin Missiles & Fire Control
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 207CD
Thu, Mar 20, 2025 - 8:00 AM to 12:00 PM
8-80: Lead Free Electronics Risk Management (PERM) Council
Instructor/Speaker: Mr. Ben Gumpert, Manufacturing Engineer, Lockheed Martin
Event Type: Standards Development Meeting
Location: Room 208B
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD29: Técnicas de Soldadura, Producción y Reparacion (course taught in Spanish)
Instructor/Speaker: Cecilia Rios, Engineering Technician and Rework and Repair, Reliance CM
Focus: ASSEMBLY & TEST PROCESSES
Event Type: Professional Development
Location: 303A
Pd29
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD30: Sustainable Surface Finishes for UHDI PCBs
Instructor/Speaker: Dr. Kunal Shah, President, LILOTREE
Focus: HDI, µHDI AND SUBSTRATES
Event Type: Professional Development
Location: 303B
PD30
Thu, Mar 20, 2025 - 8:00 AM to 11:00 AM
PD31: Harnessing Additive Manufacturing of Solder Mask with Inkjet Technology: Benefits and Implementation
Instructor/Speaker: Dr. Luca Gautero, Product Manager, SUSS MicroTec
Focus: PCB FABRICATION AND MATERIALS
Event Type: Professional Development
Location: 303C
PD 31