Wed, Mar 19, 2025 - 3:00 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Michelle Gleason, Plexus Corporation
Event Type: Standards Development Meeting
Location: Room 209A
Wed, Mar 19, 2025 - 3:00 PM to 4:00 PM
Maximizing Returns: The ROI of Training in Electronics Manufacturing
Instructor/Speaker: Carlos Plaza, Senior Director of Education, IPC
Event Type: Learning Lounge
Location: Show Floor in Hall C Behind the 3500 Aisle
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
1-10D: Material Selection for Design Task Group
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: Room 209B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
5-24A, 5-24B AND 5-24C Joint Meeting
Instructor/Speaker: Beverley Christian, HDP User Group
Instructor/Speaker: Timothy Pearson, Collins Aerospace
Instructor/Speaker: Mr. Anthony Lentz, Chemist & Field Application, FCT Assembly
Instructor/Speaker: Milea Kammer, Honeywell International
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
7-25B: AOI Process Control for IC Substrates Standard Task Group
Instructor/Speaker: Mr. Feng Xue, Senior Technical Staff Member, IBM
Event Type: Standards Development Meeting
Location: Room 207B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Instructor/Speaker: Mr. Leo Lambert, Vice President, Technical Director, EPTAC LLC
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210D
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Instructor/Speaker: Christina Landon, Materials Engineer, Naval Surface Warfare Ctr
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: Room 212B
Wed, Mar 19, 2025 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Instructor/Speaker: Richard Wessel, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S25: Additively Manufactured Electronics and Plastronics
Instructor/Speaker: Dr. Kenneth Church, CEO & Founder, Sciperio Inc.
Instructor/Speaker: Mr. Stephan Schmidt, Technical Sales Consultant 3D MID - North America, HARTING AG
Instructor/Speaker: Dr. Lina Kadura, Project Leader/prototype engineer, CEA
General Committee: Additively Manufactured Electronics and Plastronics
Event Type: Technical Conference Session
Location: 303A
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Enhancing Component Density in PCBs A Study on Molded Interconnect Device Integration
Additive Printed PCB Manufacturing for More Sustainable Electronics
Wed, Mar 19, 2025 - 3:30 PM to 5:00 PM
S26: Factory of the Future 4: Simulation and Modeling
Instructor/Speaker: Mr. Lukasz Nowicki, Project Engineer, QWED Sp. z o. o.
Instructor/Speaker: Mr. Ben Rachinger, Research Associate, Friedrich-Alexander-Universit t Erlangen-Nürnberg
Instructor/Speaker: Dr. Mehdi Hamid, Senior Hardware Architect, IBM
General Committee: Factory of the Future
Event Type: Technical Conference Session
Location: 303B
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment
Improving THT-AOI Image Classification through Federated Learning A Study on Model Performance
Applying Pre-trained ViT Model for PCB & Components Image Recognition at Scale