Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Focus: Product Assurance
Event Type: Standards Development Meeting
Location: Room 210C
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies
General Committee: Flexible and Rigid-Flex Printed Board
Event Type: Standards Development Meeting
Location: Room 210B
Wed, Mar 19, 2025 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: Room 209B
Wed, Mar 19, 2025 - 1:30 PM to 3:30 PM
Design Town Hall Meeting
Event Type: Special Event
Location: 304AB
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S21: Quality and Reliability 4: Microvia and Embedded PCBs
Instructor/Speaker: Mr. Robin Wieland, Reliability- and Product Quality Engineer, Dyconex
Instructor/Speaker: Mr. Todd MacFadden, Senior Technology Development Engineer, Bose Corporation
General Committee: Quality & Reliability
Event Type: Technical Conference Session
Location: 303A
Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications
Reliability of Micro Vias
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S22: Novel Thermal Interface Materials (TIMs)
Instructor/Speaker: Mr. Milos Lazic, Senior Product Specialist, Indium Corporation
Instructor/Speaker: Mr. Sunny Agarwal, Senior Applications Engineer, ITW
General Committee: Novel Thermal Interface Materials (TIMs)
Event Type: Technical Conference Session
Location: 303B
High-Performance Phase Change Metal TIMs - Part II
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S23: PCB Fabrication and Materials 5:
Flex and Flex Hybrid Technologies
Instructor/Speaker: Mr. Attila Rektor, Graduate Research Assistant, Micron School of Materials Science and Engineering
Instructor/Speaker: Ms. Lu Xiao, RD Manager, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Mr. Terry Wright, CTO SYE USA, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
General Committee: PCB Fabrication and Materials
Event Type: Technical Conference Session
Location: 303C
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper
Wed, Mar 19, 2025 - 2:00 PM to 3:00 PM
S24: Assembly Process and Testing 4:
Thermal Profiling
Instructor/Speaker: Dr. Samuel McMaster, R&D Specialist, Pillarhouse International
Instructor/Speaker: Mr. Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
General Committee: Assembly Processes and Testing
Event Type: Technical Conference Session
Location: 304C
Influence of Accurate Thermal Profiling on Reflow Process Control
Thermal Profiling of Pre-Heater Configurations w Added Convection to Determine Heating Effectiveness
Wed, Mar 19, 2025 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Event Type: Special Event/Networking
Location: Exhibit Hall
Wed, Mar 19, 2025 - 2:30 PM to 3:30 PM
Network with Poster Presenters on the Show Floor
Event Type: Posters
Location: Exhibit Hall: Behind Aisle 4100