We are a solutions provider for the PCB UHDI, HDBU and substrate markets. To the challenges of sub-50 micron attributes, we offer amSAP and SAP process flows utilizing both horizontal and vertical plating technologies in order to achieve the customers desired results. We have SOTA equipment...
(more)We are a solutions provider for the PCB UHDI, HDBU and substrate markets. To the challenges of sub-50 micron attributes, we offer amSAP and SAP process flows utilizing both horizontal and vertical plating technologies in order to achieve the customers desired results. We have SOTA equipment throughout our processes. Not just one or two pieces, all our equipment is the latest generation. We are also the first truly “green” PCB fabrication facility in North America using our proprietary ZLD technology.
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