Sat, Apr 6, 2024 - 8:00 AM to 5:00 PM
Saturday: 5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Apr 7, 2024 - 8:00 AM to 5:00 PM
5-22A/7-31B: IPC-J-STD-001 and IPC-A-610 Joint Task Group Meeting
Committee Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
Committee Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: Ballroom A
Sun, Apr 7, 2024 - 8:00 AM to 4:45 PM
7-31A/D-33A: IPC-A-600 and IPC-6012 Joint Task Group Meeting
Committee Chair: Gerry Partida, Dir. Of Technology, Summit Interconnect - Anaheim
Committee Chair: Scott Bowles, Electronic PMP Materials Engineer, Sr. Staff, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210CD
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD01: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part 1
Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Focus: Design
Event Type: Professional Development
Location: 303A
PD01: Design for Excellence: Part 1
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD02: Developing a Qualified Manufacturing Package per IPC J-STD-001H ~ Section 8: Cleanliness - Part 1
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD02: Developing a Qualified Manufacturing Package per IPC J-STD-001H ~ Section 8: Cleanliness Part1
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD03: Develop a Robust Selective Soldering Process
Instructor/Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303C
PD03: Develop a Robust Selective Soldering Process
PD03: Develop a Robust Selective Soldering Process (2)
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD04: PWB Design Engineering – Let’s Get Constrained and Engineer That Board Design!
Instructor/Speaker: Fil Arzola, Senior Principal Electrical Engineer, Raytheon Intelligence & Space
Focus: Design
Event Type: Professional Development
Location: 303D
PD04: PWB Design Engineering – Let’s Get Constrained and Engineer That Board Design!
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD05: Material Compliance Reporting - Internal Needs and Customer Formats
Instructor/Speaker: Brenda Baney, CEO, BCubed Consulting
Focus: Sustainability for Electronics
Event Type: Professional Development
Location: 304D
PD05: Material Compliance Reporting - Internal Needs and Customer Formats
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD06: Intro to 3D Printing, Part 1: Harnessing the Language of Additive Manufacturing
Instructor/Speaker: Kat Ermant, Additive Manufacturing Consultant, Lead AM Prototype Engineer, Peloton
Focus: Emerging Technologies
Event Type: Professional Development
Location: 304C
PD06: Intro to 3D Printing, Part 1: Harnessing the Language of Additive Manufacturing
Sun, Apr 7, 2024 - 9:00 AM to 12:00 PM
PD07: High Reliability Electronics for Harsh Environments
Instructor/Speaker: Jennie Hwang PhD, CEO, H-Technologies Group
Focus: High Reliability
Event Type: Professional Development
Location: 304AB
PD07: High Reliability Electronics for Harsh Environments
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD08: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part 2
Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Focus: Design
Event Type: Professional Development
Location: 303A
PD08: Design for Excellence: Part 2
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD09: Developing a Qualified Manufacturing Package per IPC J-STD-001H ~ Section 8: Cleanliness - Part 2
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD09: Developing a Qualified Manufacturing Package per IPC J-STD-001H~ Section 8: Cleanliness-Part2
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD10: The Impact of Silicon Geometry Reduction on Signal Integrity and PCB Performance
Instructor/Speaker: Kristopher S. Moyer, BS-CPE, CID+, Instructor, IPC and CSUS
Focus: Design
Event Type: Professional Development
Location: 303C
PD10: The Impact of Silicon Geometry Reduction on Signal Integrity and PCB Performance
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD11: How to Setup, Organize and Engineer a Mixed-Signal Wire-Bond Board Design
Instructor/Speaker: Fil Arzola, Senior Principal Electrical Engineer, Raytheon Intelligence & Space
Focus: Design
Event Type: Professional Development
Location: 303D
PD11: How to Setup, Organize and Engineer a Mixed-Signal Wire-Bond Board Design
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD12: Design and Fabrication for High Reliability
Instructor/Speaker: Paul Cooke, Consultant, Ventec
Focus: High Reliability
Event Type: Professional Development
Location: 304D
PD12: Design and Fabrication for High Reliability
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD13: Intro to 3D Printing, Part 2: Prototype Applications for Product Development
Instructor/Speaker: Kat Ermant, Additive Manufacturing Consultant, Lead AM Prototype Engineer, Peloton
Focus: Emerging Technologies
Event Type: Professional Development
Location: 304C
PD13: Intro to 3D Printing, Part 2: Prototype Applications for Product Development
Sun, Apr 7, 2024 - 1:30 PM to 4:30 PM
PD14: Troubleshooting SMT Yield Problems and Failure Analysis
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: Quality, Reliability, Test and Inspection
Event Type: Professional Development
Location: 304AB
PD14: Troubleshooting SMT Yield Problems and Failure Analysis
Sun, Apr 7, 2024 - 5:00 PM to 6:30 PM
Committee Member Appreciation that includes TAEC, CCC and MIT and MIT Meet and Greet
Event Type: Special Event
Location: California Terrace
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
3-11A: Base Materials Committee
Committee Chair: Albert Block, Chief Manufacturing Strategist, National Instruments
Committee Chair: Darren Hitchcock, OEM Business Development Manager, Panasonic Industrial Devices Sales Company of America
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
5-21H: Bottom Termination Components (BTC) Task Group
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210B
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Committee Chair: Ernst Eggelaar, CEO, Microtronic
Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Committee Chair: Eric Camden, Lead Investigator, Foresite, Inc.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Committee Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Committee Chair: Tyler Siebert, Lockheed Martin Missiles & Fire Control
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 209B
Mon, Apr 8, 2024 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Committee Chair: Eddie Hofer, M&P Engineer, Collins Aerospace
Committee Chair: Richard Rumas, Technical Manager - Materials Engineering, Honeywell Canada
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 213C
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 8:00 AM to 10:00 PM
7-32C Electrical Continuity Task Group
General Committee: Product Assurance
Location: 207B
Mon, Apr 8, 2024 - 8:00 AM to 10:00 AM
D-33: Performance Standards Subcommittee
Committee Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 8:00 AM to 12:00 PM
E-31: Supplier Declaration Subcommittee
Committee Chair: Chuck LePard, DXC Technology
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
Committee Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 209A
Mon, Apr 8, 2024 - 8:00 AM to 5:00 PM
IPC EMS Leadership Summit
Instructor/Speaker: Chris Mitchell, Vice President of Global Government Relations, IPC
Instructor/Speaker: Randall Sherman, President & CEO, New Venture Research
Instructor/Speaker: Victoria Hawkins, Director of Workforce Grants and Proposals, IPC
Instructor/Speaker: Joe O'Neil
Instructor/Speaker: Harmut Liebel
Instructor/Speaker: Dieter Weiss, in4ma
Instructor/Speaker: David Hollingsworth, Ascentron (an Emerald EMS company)
Instructor/Speaker: Mark Pollard, President & COO, Astute
Instructor/Speaker: Mark Wolfe, Executive EMS Advisor, IPC
Instructor/Speaker: Carlos Plaza, Senior Director of Education at IPC, IPC
Instructor/Speaker: Cory Blaylock, Director, Workforce Partnerships, IPC
Event Type: Management
Location: Ballroom A
Blaylock Plaza Hawkins - Apprenticeship
CMitchell - Advocacy
EMS Resource Handbook
Hollingsworth - KPIs
Kelly - Solutions
O'Neil Hollingsworth Liebel - M&A
Pollard - Supply Chain
Weiss - Market Data
Wolfe - Community
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD15: Ask the Flexperts Design Through Test with Lessons Learned, Part 1
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 303A
PD15: Ask the Flexperts Design Through Test with Lessons Learned, Part 1
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Board Talk Part 1
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Bo
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards
Instructor/Speaker: Philippe Jaeckle PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Corina Stocker, Senior Expert, Continental
Instructor/Speaker: Heike Woldt, Head of Product Development Press-fit Technology, Diehl Metal Applications
Instructor/Speaker: Frank Uibel, CEO, Uibel Consulting
Instructor/Speaker: Hermann Eicher, Project Manager R&D, EPT GmbH
Instructor/Speaker: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303C
PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303D
PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN,
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD19: Chiplet Design and Heterogeneous Integration (SiP)
Instructor/Speaker: John Lau PhD, Sr. Special Project Assistant, Unimicron
Focus: Design
Event Type: Professional Development
Location: 304D
PD19: Chiplet Design and Heterogeneous Integration (SiP)
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD20: Flex Circuit ‘Design for Manufacturing Principles’ Circuit Design, Fabrication and SMT Assembly Processing
Instructor/Speaker: Vern Solberg, Design Engineer, STC
Focus: Design
Event Type: Professional Development
Location: 304C
PD20: Flex Circuit ‘Design for Manufacturing Principles’
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM
PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities
Instructor/Speaker: Jennie Hwang PhD, CEO, H-Technologies Group
Focus: Factory of the Future
Event Type: Professional Development
Location: 304AB
PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities
Mon, Apr 8, 2024 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Committee Chair: Thomas Marktscheffel, Director of R&D, ASMPT GmbH & Co. KG
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 208A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
5-23A: Printed Board Solderability
Committee Chair: Ernst Eggelaar, CEO, Microtronic
Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group
Committee Chair: Bhanu Sood PhD, Deputy Chief Technologist, Office of the Director, NASA Goddard Space Flight Center
Committee Chair: Raj Kumar, Northrop Grumman Space Systems
General Committee: Embedded Devices
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM
IPC-V-TSL-MVIA-EU: Micro Via Task Group
Committee Chair: Maarten Cauwe PhD, R&D Team Leader, imec
Committee Chair: Stan Heltzel, Materials Engineer at European Space Agency-ESA, European Space Agency-ESA
Event Type: Standards Development Meeting
Location: 207B
Mon, Apr 8, 2024 - 12:00 PM to 1:30 PM
Monday Networking Luncheon
Event Type: Special Event
Location: Ballroom D
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Committee Chair: Chris Shaw, Fujitsu Network Communications
Committee Chair: Terry Hoffman, Technical Leader, Cisco Systems Inc.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 208A
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
2-17B: IPC-HERMES-9852 Standard Task Group
Location: 209B
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
2-30: Terms and Definitions Committee
Committee Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Committee Chair: David Caputa, Electronics Engineer, Lockheed Martin Corporation
General Committee: Terms and Definitions
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
3-12D: Woven Glass
Committee Chair: Thomas Keily, General Manager, JPS Composite Materials Corp.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
4-14F: ENEPIG Task Group
Committee Chair: Jose Rios, Senior Principal Quality Engineer/Supplier Quality Manage, Raytheon
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
5-21F: Ball Grid Array Task Group
Committee Chair: Robert Rowland, Engineering Manager, Axiom Electronics, LLC
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Committee Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technology
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM
D-61B/D-64B: Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification joint meeting
Committee Chair: Jeff Shubrooks, Raytheon Company
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 207C
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM
E-31A Generic Requirements for Declaration Process Management Task Group
Committee Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc.
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Materials and Supplier Declarations Committee
Location: 209A
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD22: Ask the Flexperts Design through Test with Lessons Learned, Part 2
Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Focus: PCB Fabrication and Materials
Event Type: Professional Development
Location: 303A
PD22: Ask the Flexperts Design through Test with Lessons Learned, Part 2
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD23: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Board Talk Part 2
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303B
PD23: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Bo
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD24: Basics of Ultrasonic Metal Welding and its Applications 
Instructor/Speaker: Greg Ruscak, Application and Engineering Manager, Telsonic
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303C
PD24: Basics of Ultrasonic Metal Welding and its Applications
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD25: Introduction to Machine Data Analytics in the EMS Industry
Instructor/Speaker: Tim Burke PhD, Chief Technology Officer, Arch Systems Inc
Focus: Factory of the Future
Event Type: Professional Development
Location: 303D
PD25: Introduction to Machine Data Analytics in the EMS Industry
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD26: 3D Package Technology and Assembly Processes
Instructor/Speaker: Tom Dory PhD, Consultant and (Retired) R&D Manager, Fujifilm Electronic Materials USA
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 304D
PD26: 3D Package Technology and Assembly Processes
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD27: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D and 3D System-in-Packaging and Ultra High-Density Interposer Development
Instructor/Speaker: Vern Solberg, Design Engineer, STC
Focus: Design
Event Type: Professional Development
Location: 304C
PD27: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM
PD28: Fundamentals of Thermal Interface Material
Instructor/Speaker: Rita Mohanty PhD, Senior Scientific Principal, Henkel
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 304AB
PD28: Fundamentals of Thermal Interface Material-1
PD28: Fundamentals of Thermal Interface Material-2
PD28: Fundamentals of Thermal Interface Material-3
PD28: Fundamentals of Thermal Interface Material-4
PD28: Fundamentals of Thermal Interface Material-5
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
2-19A: Critical Components Traceability Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
3-12E:Base Materials Roundtable Task Group
Committee Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 213D
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Committee Chair: Ingrid Swenson, Inner layer engineering manager, TTM Technologies, Inc.
General Committee: PCB Fabrication and Materials
Event Type: Standards Development Meeting
Location: 207A
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
5-21G: Flip Chip Mounting Task Group
Committee Chair: Ife Hsu, Technology & Standards Development Lead, Intel Corporation
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 207D
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM
Faces of the Future
Event Type: Standards Development Meeting
Location: 209B
Mon, Apr 8, 2024 - 5:00 PM to 6:30 PM
ECWC Welcome Reception
Event Type: Special Event
Location: California Terrace
Mon, Apr 8, 2024 - 5:00 PM to 6:00 PM
Newcomers Welcome Reception
Event Type: Special Event
Location: Pacific Terrace
Tue, Apr 9, 2024 - 7:00 AM to 5:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
Tue, Apr 9, 2024 - 8:00 AM to 9:30 AM
Opening Keynote: “The Art of the Impossible” Paul Bailey, former Principal Concept Technical Director for Walt Disney Imagineering
Event Type: Special Event
Location: Ballroom D
Tue, Apr 9, 2024 - 9:45 AM to 12:15 PM
Bridging the Gap: Ultra HDI Challenges
Instructor/Speaker: Tony Senese, Manager, R&D and Business Development, NA, Panasonic
Instructor/Speaker: Hannes Voraberger PhD, Vice President Corporate R&D, AT&S
Instructor/Speaker: Shekhar Chandrashekhar, CEO, iNEMI
Instructor/Speaker: Julie Mouzan, R&D Director, Circuit Foil
Instructor/Speaker: Ed Kelley, Founder/Principal, Four Peaks Innovation
Event Type: Special Event
Location: 303C
Tue, Apr 9, 2024 - 9:45 AM to 10:00 AM
Ribbon Cutting
Event Type: Special Event
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Committee Chair: Richard Snogren, President, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 10:00 AM to 5:00 PM
3-14A: IC substrate Task Group
Committee Chair: Gang Liu, Shennan Circuits Co. Ltd.
Event Type: Standards Development Meeting
Location: 210B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 10:00 AM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Committee Chair: Zhiman Susann Chen, Senior Engineer, ZhuZhou CRRC Times Electric Co., Ltd.
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Committee Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Committee Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 213D
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
Committee Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 207A
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-25A: Design and Test Requirements for High Speed Connectors in High Reliability Applications
Committee Chair: Hermann Eicher, Project Manager R&D, EPT GmbH
Committee Chair: Robert Kinyanjui, John Deere Electronic Solutions
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S01: Sustainability for Electronics 1: Materials
Instructor/Speaker: Scarlet Yi Wang, Technical Marketing Director, Shengyi Technology Co., LTD.
Instructor/Speaker: Andreas Karch, Technical Manager (Germany, Austria, Switzerland) / Technologist – Advanced Applications, Indium Advanced Material, Indium Corporation
Instructor/Speaker: Jennifer Fijalkowski, Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions
Instructor/Speaker: Yuntao Li PhD, Lead Scientist, SABIC
Instructor/Speaker: Daniel Hamann, Sales Manager Europe and Key Accounts, SMT Thermal Discoveries
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve Up
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S02: Design
Instructor/Speaker: Savita Ganjigatti, Vice President, SiennaECAD
Instructor/Speaker: Chiew Yee Ho, Hardware Engineer, Intel Microelectronics Asia LLC
Instructor/Speaker: Meijuan Sarah Kuang, Tech. Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd.
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Ryan Chang, Engineer, Intel
Focus: Design
Event Type: Technical Conference
Location: 303B
Innovative Hybrid Solder Mask for Coupling Reduction in High-Speed Application
Impact of CPU Pin Pattern Orientation to High-Speed Interconnect Data Center Board Designs With Inte
Latest PCIe Generation PCB Design and simulations: Overcoming Design, Cost, Yield, Technology Tradeo
Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S03: Factory of the Future 1: AI & Machine Learning
Instructor/Speaker: Wei Ken Hee, Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd
Instructor/Speaker: Ryusuke Ueki, Leader of the AI Research Lab, Qualtec Co., Ltd.
Instructor/Speaker: Reinhardt Seidel PhD, Research Assistant, Friedrich-Alexander-Universit
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Machine-Learning Based Solderability Check of THT Solder Joints
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
S04: PCB Fab 1: Flex, Hybrid
Instructor/Speaker: Kaspar Tsang, Senior Development Manager of Infrastructure Solutions Group, Lenovo
Instructor/Speaker: Lu Xiao, Senior Chief Engineer, Shengyi Electronics Co.,Ltd
Instructor/Speaker: Terry Wright, CTO, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China
Instructor/Speaker: Gause Hu, Manager, Lenovo
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
The Improvement of Warp in Rigid-Flex Board
The Study of Resin Flow Indentation for Rigid-Flex PCB
Study on the Influencing Factors of Interlayer Reliability of Rigid-Flex Board with Multiple Air-Gap
Asymmetric Hybrid Printed Circuit Board Design and Flexibility Study for High-speed Data Center Plat
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Committee Chair: Michael Carano, VP Technology and Bus. Dev, IPC
Event Type: Standards Development Meeting
Location: 209A
Tue, Apr 9, 2024 - 12:00 PM to 1:30 PM
Tuesday Luncheon | IPC Annual Meeting and Awards
Event Type: Special Event
Location: Ballroom D
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
2-12D: Digital Sustainability Credentials Standard Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Committee Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace
Committee Chair: Scott Meyer, Collins Aerospace
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207B
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc.
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Michael Creeden, Technical Director Design Education, Insulectro
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
Committee Chair: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 213C
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
D-67A, D-67B and D-67C: Joint Task Group Meeting
Committee Chair: Dana Korf, Nano Dimension
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Printed Electronics
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM
E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney
Committee Chair: Walter Jager, Principal Consultant, ECD Compliance
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Tue, Apr 9, 2024 - 1:30 PM to 4:00 PM
iNEMI Roadmap Workshop: Future Evolution of PCB Design-for-X
Instructor/Speaker: Francis Mullany, Director of Roadmapping, iNEMI
Instructor/Speaker: Jasbir Bath, Owner, Bath Consultancy
Instructor/Speaker: Tarja Rapala, Technology Director, EIPC
Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation
Event Type: Special Event
Location: 303C
Tue, Apr 9, 2024 - 1:30 PM to 6:00 PM
IPC Design Competition Finals
Event Type: Standards Development Meeting
Location: 213B
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S05: QRTI 1: Inspection and Test 1
Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions, Inc.
Instructor/Speaker: Yu Hsuan Chen, Hardware Engineer, Intel Corporation
Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Matthias Zapatka Dipl.-Ing. (FH), CIS, CTO+FAE, INGUN USA, Inc.
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Modular RF Test Enclosure / Test Fixture Combinations: Design, Innovations and Characterization
Statistical Analysis of Full-scope In-board Electrical Characterization for Partial Plane-on-Outer-L
Automatic Testing of High-Speed I/O in Manufacturing
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S06: High Reliability for Extreme Requirements
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Thomas Sanders PhD, Parts Failure Engineer, Jet Propulsion Laboratory
Instructor/Speaker: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory
Focus: High Reliability
Event Type: Technical Conference
Location: 304AB
Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist
QFN Assembly Reliability Under a New HALT Test Method
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM
S07: PCB Fab 2: Laminate Materials 1
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: Neil Hubble, President, Akrometrix
Instructor/Speaker: Mandy Krott, Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH
Instructor/Speaker: Tony Senese, Manager, R&D and Business Development, NA, Panasonic
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs
HDP Users Group Thermal Analysis Methodology Assessment
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Tue, Apr 9, 2024 - 2:00 PM to 3:00 PM
Make Workforce Training Your Competitive EDGE
Event Type: Special Event
Location: 209A
Tue, Apr 9, 2024 - 3:00 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Committee Chair: Shuming Gao, Professor, Zhejiang University
Committee Chair: Victor Xu, Huawei Technologies Co. Ltdol
Committee Chair: Zhiqian Sang, Hangzhou Dianzi University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
Committee Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S08: Sustainability for Electronics 2: Life Cycle Assessment
Instructor/Speaker: Outi Rusanen MSc, LicSc, DSc (Tech.), Principal Interconnection Specialist, TactoTek
Instructor/Speaker: Maarten Cauwe PhD, R&D Team Leader, imec
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Sustainable Smart Surfaces
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S09: QRTI 2: Inspection and Test 2
Instructor/Speaker: Marius Tarnovetchi, Senior Expert, VItesco Technologies
Instructor/Speaker: Malgorzata Celuch PhD, President, QWED Sp. z o. o.
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - A Revealin
Monotonic Bend Characterization of Board-Level Solder Interconnects with Finite Element Analyses
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S10: PCB Fab 3: Laminate Materials 2
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: JingHui Peng, Manager, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: CanJun Xiang, Senior Engineer, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: Kevin Bivona, R&D Lab Manager, AGC Multi Material America
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Managing Backdrill Stub Length Variations due to Innerlayer Core Deformation
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Research on High-Speed Material Insertion Loss in Server Platform
Tue, Apr 9, 2024 - 5:00 PM to 6:00 PM
Network with Poster Presenters on the Show Floor(During Show Floor Reception)
Event Type: Poster Presentations
Location: Exhibit Halls C & D-Aisle 700
Tue, Apr 9, 2024 - 5:00 PM to 6:00 PM
Show Floor Welcome Reception
Event Type: Special Event
Location: Exhibit Halls C & D
Tue, Apr 9, 2024 - 6:00 PM to 7:30 PM
Women in Electronics Reception
Instructor/Speaker: Karen McConnell, Northrop Grumman
Event Type: Special Event
Location: 304CD
Wed, Apr 10, 2024 - 7:00 AM to 8:00 AM
Hall of Fame Breakfast(By Invitation)
Event Type: Special Event
Location: 210A
Wed, Apr 10, 2024 - 7:00 AM to 5:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
2-12C: Cybersecurity Protection Standard Task Group
Committee Chair: Hiroyuki Watanabe, CO, NEC Platforms Ltd.
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213B
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
2-16D: IPC-2581 Users Task Group
Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-21E: Solder Stencil Task Group
Committee Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213C
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-22BT: J-STD-001 Training Committee
Committee Chair: George Tristan, Process Control Engineer, Ball Aerospace & Technologies Corp.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Committee Chair: Beverley Christian, Project Facilitator, HDP User Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 304CD
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Committee Chair: Russell Shepherd, General Manager - Anaheim, NTS - Anaheim
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Committee Chair: Herb Snogren, Consultant, Bristlecone LLC
Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS
General Committee: Rigid Printed Boards
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 8:00 AM to 5:00 PM
E-31B: Materials Declaration Task Group
Committee Chair: Jason Gooden, Executive Director, Anthesis
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 207B
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S11: QRTI3 : Quality and Reliability 1
 
Instructor/Speaker: Zook Kim, Engineer, Package Solution Team, Samsung Electro-Mechanics
Instructor/Speaker: Mike Bixenman DBA, President, Magnalytix, LLC
Instructor/Speaker: Hanui Kim PhD, Senior Engineer, Samsung Electro-Mechanics
Instructor/Speaker: Irene Hou, Business Development & Marketing Director, AOSHIKANG TECHNOLOGY / ASK PCB
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303A
Research on High Potential Capability of Energy PCB
Does Functional Circuitry Drift as Leakage Currents Form?
Investigation of Factors Influencing SR/Cu Interface Adhesion
Substrate Warpage Incurred from Panel grab at PCB Manufacturing
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S12: Assembly Processes 1
Instructor/Speaker: Edward Nauss, Sr. Applications Engineer, ITW/EAE
Instructor/Speaker: Ram Wissel, Vice President of Global Technology, KYZEN Corporation
Instructor/Speaker: Evan Griffith, Product Specialist, Indium Corporation
Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation
Instructor/Speaker: Kalyan Nukala, Application Engineer, ZESTRON Americas
Instructor/Speaker: Patrick Stockbruegger, Product Manager, LPKF Laser & Electronics SE
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303B
Sealed Versus Exposed Atmosphere Solder Printing Comparison for Type-6 Powder Solder Paste
Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Prin
Strategies for Enhanced Reliability in the Cleaning of Vented Components
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S13: PCB Fab 4: RF Materials, Low Loss Materials
Instructor/Speaker: Tomoaki Nakanishi, Scientist, AGC Multi Material America
Instructor/Speaker: Eillie Chiang, Master's Degree Student, Yuan Ze University
Instructor/Speaker: Min Park PhD, Haesung DS, Haesung DS
Instructor/Speaker: Britta Schafsteller PhD, Global Product Manager, MKS Instrumentsnts
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
The Impact of Final Finishes and Thermal Aging on Insertion Loss at Frequencies Up to 150 GHz
The Formulating Technology of Extremely Low Loss PCB Material for 112/224 Gbps Without Sacrificing R
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graph
High-frequency Signal Characteristics of Differential Striplines with Different Cu-Foil Roughness
Wed, Apr 10, 2024 - 8:00 AM to 10:00 AM
S14: Factory of the Future 2: Additive Manufacturing
Instructor/Speaker: Emily Lamport, PhD Student, University of Massachusetts Lowell
Instructor/Speaker: Jason Benoit, Mechanical Engineer, Sciperio
Instructor/Speaker: Michael Dickey PhD, Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering, NC State University
Instructor/Speaker: Tom Rovere, Research Scientist, Associate Fellow, Lockheed Martin
Instructor/Speaker: Dr. Kenneth Church, CEO & Founder, Sciperio Inc.
Focus: Factory of the Future
Event Type: Technical Conference
Location: 304AB
Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Liquid Metal Patterning for Electronic Circuits and Thermal Management
Reliability Validation of Direct-Write Printed RF Devices
Wed, Apr 10, 2024 - 9:00 AM to 11:00 AM
IPC Global Update
Event Type: Special Event
Location: 210A
Wed, Apr 10, 2024 - 9:15 AM to 4:15 PM
Taiwan High-Tech Forum
Committee Chair: Jimmy Hsu, Principal Engineer, Intel Corporation
Instructor/Speaker: Scott Chen, Vice Chairman, TPCA
Instructor/Speaker: Kathy Yan PhD, Director, TSMC
Instructor/Speaker: Nicholas Kao, Department Manager, SPIL
Committee Chair: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions
Instructor/Speaker: Matt Kelly, CTO & VP Technology Solutions, IPC
Instructor/Speaker: Chi-Ho Kuan PhD, Sr. Dir. Business Development, Unimicron
Instructor/Speaker: Ting-Hao Lin, Senior Director, Kinsus
Instructor/Speaker: Jhih-Hong Cheng PhD, Project Leader Engineer, CHPT
Instructor/Speaker: Randy Wu PhD, Manager, ITRI EOSL
Instructor/Speaker: Gary Cheng, Assistant Manager, EMC
Instructor/Speaker: Mark Shields, USA Marketing Director, Nan Ya Plastics Corporation
Instructor/Speaker: Chiou Kuo-Chan PhD, Deputy General Director, ITRI MCL
Instructor/Speaker: Chung Chih-Yeh PhD, Senior Specialist, Nanya PCB
Instructor/Speaker: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions
Event Type: Special Event
Location: Ballroom A
Taiwan High-Tech Forum1
Taiwan High-Tech Forum2
Taiwan High-Tech Forum3
Wed, Apr 10, 2024 - 9:30 AM to 11:30 AM
mmWave Material and Test Roadmap and Standard Development 
Instructor/Speaker: Urmi Ray, mmWave Project Lead, iNEMI
Instructor/Speaker: Lucas Enright, PhD Student, Professional Research Experience Program (PREP) Associate, National Institute of Standards and Technology (NIST)
Instructor/Speaker: Marzena Olszewska-Placha, Vice President for Research and Development, QWED
Instructor/Speaker: Shekhar Chandrashekhar, CEO, iNEMI
Event Type: Special Event
Location: 209B
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
1-14: DFX Standards Subcommittee
Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation
Committee Chair: Pietro Vergine, President, Advanced Rework Technology
Committee Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc.
General Committee: Printed Board Design Technology
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Committee Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc.
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Committee Chair: Minsu Lee, Manager, Korea Packaging Integration Association
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-12: Microsection Subcommittee
Committee Chair: Allen Keeney, Johns Hopkins University
General Committee: Testing
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31AT & D-33AT: IPC-A-600 and IPC-6012 Training Joint Meeting
Committee Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
7-31K/7-31H: Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207D
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S15: QRTI 4: Quality and Reliability 2
Instructor/Speaker: KyoungSoo Kim, SI Engineer in ISU Petasys, ISU Petasys
Instructor/Speaker: Mr. Jefferson Leach, Application Development Engineer, Momentive Technologies
Instructor/Speaker: Matt Gallaugher PhD, Material Science Engineer, Momentive Technologies
Instructor/Speaker: Yang-Hung Cheng, Section Manager, MPI Corpoation
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303A
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for P
Experimental Verification of Optimized Signal Integrity Test Coupon to Achieve Accurate Measurements
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S16: Assembly Processes 2
Instructor/Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE
Instructor/Speaker: Miloš Lazic, Product Development Specialist, Indium Corporation
Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation
Instructor/Speaker: Sunny Agarwal, Sr. Applications Engineer, ITWEAE
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303B
Reflow Soldering of PCB Components With Mixed Thermal Mass
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S17: PCB Fab 5
Instructor/Speaker: Saminda Dharmarathna PhD, Principal Research Scientist, Macdermid Alpha Electronics Solutions
Instructor/Speaker: Zhi Chao Zhang, Senior engineer, Delton Technology (Guang Zhou) Inc.
Instructor/Speaker: Kunal Shah PhD, President, LILOTREE
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Advancing Copper Electroplating Processes: Innovative Solutions for Excellent Via Fill and V-Pit Res
A Novel Ni Free Surface Finish Capable of Resisting Copper Creep Corrosion for Better Solder Joint R
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM
S18: HDI, uHDI AND SUBSTRATES 1
Instructor/Speaker: Manuel Galvez, Product Marketing Manager, MKS Instruments, Inc.
Instructor/Speaker: Reginald Lai, Packaging R&D Engineer, Intel Corporation
Instructor/Speaker: Kyle Baker, Product Marketing Specialist, MKS Instruments
Instructor/Speaker: Samuel Oladji, Packaging RD Engineer, Intel Corporation
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Vacuum Etch Technology for Fine Line Width and Space in PCBs
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
Maximize Throughput With Innovative Laser/optics Configuration, Precision Pulse Shaping, and Steerin
Wed, Apr 10, 2024 - 12:00 PM to 1:30 PM
The Future of the Human Workforce: Maximizing Potential in an Automated World
Instructor/Speaker: Dr. John W. Mitchell, IPC President and CEO, IPC
Event Type: Special Event
Location: Ballroom D
Wed, Apr 10, 2024 - 1:30 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity
Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 213C
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-22AS: Space and Military Electronic Assemblies Task Group
Committee Chair: Garry McGuire, Mfg Processes Engineer, NASA Marshall Space Flight Center
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 210A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 208A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility
Committee Chair: William Capen, Senior Engineering Tech Specialist, Honeywell FM&T
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 1:30 PM to 5:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
6-10J: Design Guidelines for IoT-Based Products Task Group
Committee Chair: Savita Ganjigatti, Vice President, SiennaECAD
Location: 207D
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
7-25A: Automated Optical Inspection Process Control Standard Task Group
Committee Chair: Feng Xue, IBM Infrastructure
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc.
Committee Chair: Nichole Thilges, Sr. Training and Development Spc, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210B
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Committee Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 209B
Wed, Apr 10, 2024 - 1:30 PM to 3:30 PM
Design Community Townhall
Event Type: Special Event
Location: 304CD
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
ESDS Control Plan
Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S19: Factory of the Future 3: Digital Twin and Automation
Instructor/Speaker: Yu Xian Ang, Team Leader, camLine Sdn. Bhd.
Instructor/Speaker: Mohan Rangan Govindaraj, R&D Manager, Siemens EDA
Focus: Factory of the Future
Event Type: Technical Conference
Location: 303A
Achieving Equipment Orchestration Through Equipment Integration
Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S20: Assembly Materials 1
Instructor/Speaker: Ukai Ryuji, Researcher, Senju Metal Industry Co., LTD
Instructor/Speaker: Kazuya Kitazawa, Manager, Senju Metal Industry Co., LTD
Instructor/Speaker: Gayle Towell, Content Marketing Specialist, AIM Solder
Instructor/Speaker: Hongwen Zhang PhD, Principal Research Metallurgist, RnD Manager of Alloy Group, Indium Corporation
Instructor/Speaker: Timothy O'Neill, Director of Product Management, AIM Solder
Focus: Assembly Materials
Event Type: Technical Conference
Location: 303B
Development and Enhancement of Low Temperature Soldering Solution for SMT
Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Ass
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S21: HDI, uHDI AND SUBSTRATES 2
Instructor/Speaker: Chris Ryder, Director of Business Development, MKS Instruments
Instructor/Speaker: Henning Hübner, Global Product Manager PP, MKS Atotech
Instructor/Speaker: Xin Huang PhD, Manager, DELTON TECHNOLOGY (GUANGZHOU)INC.
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
CO2 Laser-Direct Drilling of Blind Via in Brown Oxidized Copper Clad Laminate
Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
New Solutions for Inclusion-Free Copper Filling of Through Vias for Latest Generation Substrate Desi
Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM
S22: PCB Fab 6: Printed Board Platings and Finishes 1
Instructor/Speaker: Rick Nichols, Technical Marketing Director, Greensource
Instructor/Speaker: Mike Feng, Technical Expert, Founder PCB
Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Study of Hole Wall Cracking Defects in Power Module Heavy Copper Printed Circuit Boards
Study on Carbon Removal of Shadow Residue from Flexible Plate Surface in Rigid-Flex PCB
A Study of the Impacts of Physical Parameters on Electrolytic Panel Plating
Wed, Apr 10, 2024 - 1:45 PM to 3:15 PM
Strategic Workforce Development: Navigating Apprenticeships and Beyond – Tailored Insights for California Employers
Event Type: Special Event
Location: 209A
Wed, Apr 10, 2024 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Event Type: Special Event
Location: Exhibit Halls C & D
Wed, Apr 10, 2024 - 2:30 PM to 3:30 PM
Network with Poster Presenters on the Show Floor(During Ice Cream Social)
Event Type: Poster Presentations
Location: Exhibit Halls C & D-Aisle 700
Wed, Apr 10, 2024 - 3:00 PM to 5:00 PM
7-25B AOI Process Control for IC Substrates Standard Task Group
Committee Chair: Botao Zhang
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 207A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
5-21JND Solder Paste Printing Task Group
Committee Chair: Henrik Blegvad Jensen, Gaasdal Bygningsindustri A/S
Committee Chair: Scott Pinney, Grundfos Holding A/S
Location: 209B
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Committee Chair: Leo Lambert, Vice President, EPTAC Corporation
Event Type: Standards Development Meeting
Location: 210A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
Committee Chair: Steve Martell, Nordson ASYMTEK
General Committee: Packaged Electronic Components
Event Type: Standards Development Meeting
Location: 213A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Committee Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging
General Committee: Flexible and Rigid-Flex Printed Boards
Event Type: Standards Development Meeting
Location: 213D
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM
D-21C: High Speed/High Frequency Controlled Impedance T.G
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 207C
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
1-13: Land Pattern Subcommittee
Committee Chair: Michelle Gleason, Staff DFX Engineer, Plexus Corp.
General Committee: Electronic Packaging Design
Event Type: Standards Development Meeting
Location: 207D
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S23: Assembly Processes 3
Instructor/Speaker: Samuel McMaster PhD, MInstP, MIMMM, MInstCT, Research & Development Specialist, Pillarhouse International
Instructor/Speaker: Paul Wang PhD, MBA, VP of Global Quality and Technology Engineering, Tyan Computer (a MiTAC company)
Instructor/Speaker: Ara Parsekian PhD, Senior Applications Engineer, PulseForge, Inc.
Focus: Assembly Processes
Event Type: Technical Conference
Location: 303A
Process Challenges for Selective Soldering: Examining Parameters for Optimal Processing
iNEMI 2023 Board Assembly-CPU Socket Interposer Technology Roadmap
Optimization of Photonic Soldering Processes for SIR Performance
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S24: Assembly Materials 2
Instructor/Speaker: Takahiro Matsufuji, Researcher, Senju Metal Industry Co., LTD
Instructor/Speaker: Tony Lentz, Chemist & Field Application, FCT Solder
Instructor/Speaker: Troy Diaz, Lead Mechanical Engineer, X2F
Focus: Assembly Materials
Event Type: Technical Conference
Location: 303B
Advanced Heat Removal, an Electronics Overmolding Advantage
Development and Enhancement for Low Temperature Wave Soldering Solution
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints.
Wed, Apr 10, 2024 - 3:30 PM to 5:30 PM
S25: HDI, uHDI AND SUBSTRATES 3
Instructor/Speaker: Enold Pierre-Louis, Technical Fellow, Aerospace Corp
Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd
Instructor/Speaker: Todd Harris, Packaging R&D Engineer, Intel
Instructor/Speaker: Caleb Ancharski, Research Chemist, AGC
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Microvia Fatigue Life Design Study Findings to Mitigate Functional Failures
Microvia Reliability Using a Simple Test Vehicle
Stacked Microvia Reliability and Test Methodology Evaluation
Research on Electroplating Capability of Multi-Layer Interconnected Deep Microvia PCB Based on Simul
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
S26: PCB Fab 7: Printed Board Platings and Finishes 2
Instructor/Speaker: Colin Poedtke, Technical Service Engineer, Uyemura International Corporation
Instructor/Speaker: Michael Orsini, Application Chemist, MacDermid Alpha Electronics Solutions
Instructor/Speaker: Junji Yoshikawa, Manager, OKUNO CHEMICAL INDUSTRIES CO.,LTD
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 303C
Next Generation Reduction Assisted Immersion Gold
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Achieving a Successful ENEPIG Finished PCB Under Revision A of IPC 4556
Wed, Apr 10, 2024 - 3:30 PM to 5:00 PM
Strategic Workforce Development: Navigating Apprenticeships and Beyond – Tailored Insights for Universal Employers
Event Type: Special Event
Location: 209A
Wed, Apr 10, 2024 - 5:00 PM to 6:00 PM
2-40 Electronic Documentation Technology Committee
Location: 208A
Thu, Apr 11, 2024 - 7:00 AM to 2:00 PM
Speaker Ready Room
Event Type: Technical Conference
Location: 303D
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
2-10 Electronic Product Data Description Committee
Location: 207B
Thu, Apr 11, 2024 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Committee Chair: Beverley Christian, Project Facilitator, HDP User Group
Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr
General Committee: Product Reliability
Event Type: Standards Development Meeting
Location: 207A
Thu, Apr 11, 2024 - 8:00 AM to 10:00 AM
5-21JND Solder Paste Printing Task Group
Committee Chair: Henrik Blegvad Jensen, Gaasdal Bygningsindustri A/S
Committee Chair: Scott Pinney, Grundfos Holding A/S
Location: 208B
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Committee Chair: Catherine Hanlin, General Manager / Quality Manager, Precision Manufacturing Company, Inc.
Committee Chair: George Millman, Quality Engineer, Raytheon Missile Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 210CD
Thu, Apr 11, 2024 - 8:00 AM to 12:00 PM
E-31J: Lab Report Declaration Task Group
Committee Chair: Jason Gooden, Executive Director, Anthesis
Committee Chair: JB Hollister, Environmental Engineer, Apple Inc.
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 208A
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
PD29: Solder Techniques
Instructor/Speaker: Cecilia Rios, GED, CIT, Rework and Repair Technician, Hi-Tek Electronics
Focus: Assembly Process and Materials
Event Type: Professional Development
Location: 303A
PD29: Solder Techniques
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
PD30: Comprehensive Introduction to Li-ion Battery Technology
Instructor/Speaker: Frank Richter PhD, CEO, Greenectra
Focus: Emerging Technologies
Event Type: Professional Development
Location: 303B
PD30: Comprehensive Introduction to Li-ion Battery Technology
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
PD31: Field Reliability of Microelectronics: A Physics of Failure Perspective
Instructor/Speaker: Bhanu Sood PhD, Deputy Chief Technologist, Office of the Director, NASA Goddard Space Flight Center
Focus: Quality, Reliability, Test and Inspection
Event Type: Professional Development
Location: 303C
PD31: Field Reliability of Microelectronics: A Physics of Failure Perspective
Thu, Apr 11, 2024 - 8:00 AM to 11:00 AM
PD32: Proactive Design Methods for Approaching Zero Field Failures
Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions, Inc.
Focus: Quality, Reliability, Test and Inspection
Event Type: Professional Development
Location: 304CD
PD32: Proactive Design Methods for Approaching Zero Field Failures
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
PERM 56
Event Type: Standards Development Meeting
Location: 207D
Thu, Apr 11, 2024 - 8:00 AM to 5:00 PM
UL Meeting
Event Type: Standards Development Meeting
Location: 213A
Thu, Apr 11, 2024 - 8:30 AM to 11:00 AM
Advanced Packaging Special Technical Session: Insights on NextGen Packaging: Needs for uHDI and IC Substrates
Instructor/Speaker: Hidenori Abe, Executive Director Electronics Business Headquarters, Resonac
Instructor/Speaker: Satoru Kuramochi, Executive Chief Researcher, Dia Nippon Printing
Instructor/Speaker: Hannes Voraberger PhD, Vice President Corporate R&D, AT&S
Instructor/Speaker: Matt Kelly, CTO & VP Technology Solutions, IPC
Instructor/Speaker: E. Jan Vardaman, President, TechSearch International, Inc.
Instructor/Speaker: Kuldip Johal, Global OEM Director, New Technology Pathfinding, Atotech Group
Instructor/Speaker: Sai Boyapati, Senior Director Advanced Packaging, AMD
Focus: HDI, uHDI and Substrates
Event Type: Technical Conference
Location: 304AB
Thu, Apr 11, 2024 - 11:30 AM to 2:00 PM
Special Technical Session:EV Electronics: Design, Manufacturing,and Reliability Challenges
Instructor/Speaker: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation
Instructor/Speaker: Zhiman Susann Chen, Senior Engineer, ZhuZhou CRRC Times Electric Co., Ltd.
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Instructor/Speaker: Bob Neves, Chairman and CTO, MicroTek
Instructor/Speaker: Dave Sbiroli, Principal Engineer, Indium
Instructor/Speaker: Michael Schleicher, PCB Designer, Semikron Danfoss
Instructor/Speaker: Olaf Schoenfeld PhD, European Sales Manager, Zestron
Instructor/Speaker: Thomas Gottwald, Vice President, Technology, Schweizer Electronic AG
Instructor/Speaker: Richard R. Davis, Head of North American Automotive Sales, TRUMPF
Committee Chair: Dr. Stanton Rak, SF Rak Company
Event Type: Technical Conference
Location: 304AB
Special Technical Session: EV Electronics: Design, Manufacturing, and Reliability Challenges
Thu, Apr 11, 2024 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Due Diligence Task Group Meeting
Committee Chair: Kazuko Andersen, Deputy Director, JEITA
Committee Chair: Nikki Johnson, Director Environmental Engineering, Source Intelligence
General Committee: Data Generation & Transfer/Documentation
Event Type: Standards Development Meeting
Location: 208A
Thu, Apr 11, 2024 - 2:00 PM to 3:00 PM
World Convention Closing Ceremony & Keynote: The Next Wave in Electronics: Trends Reshaping Our Industry
Instructor/Speaker: Shawn Dubravac, IPC Chief Economist, IPC
Event Type: Special Event
Location: Ballroom D
Fri, Apr 12, 2024 - 8:00 AM to 5:00 PM
PERM 56
Event Type: Standards Development Meeting
Location: 207D