Agenda Planner - Programs

Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM 6-10D: SMT Attachment Reliability Task Group Committee Chair: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory General Committee: Product Reliability Event Type: Standards Development Meeting Location: 210A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM D-31B: IPC-2221/2222 Task Group Committee Chair: Michael Creeden, Technical Director Design Education, Insulectro General Committee: Rigid Printed Boards Event Type: Standards Development Meeting Location: 213D
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM D-33AA: IPC-6012 Automotive Addendum Committee Chair: Jan Pedersen, Director of Technology, Elmatica AS Committee Chair: Todd MacFadden, Senior Technology Development Project Manager, Bose Corporation General Committee: Rigid Printed Boards Event Type: Standards Development Meeting Location: 213C
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM D-67A, D-67B and D-67C: Joint Task Group Meeting Committee Chair: Dana Korf, Nano Dimension Committee Chair: Leo Lambert, Vice President, EPTAC Corporation General Committee: Printed Electronics Event Type: Standards Development Meeting Location: 208B
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM E-31K: Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries Committee Chair: Rick Shanks, Manager Design for Sustainability, Pratt & Whitney Committee Chair: Walter Jager, Principal Consultant, ECD Compliance General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 207C
Tue, Apr 9, 2024 - 1:30 PM to 4:00 PM iNEMI Roadmap Workshop: Future Evolution of PCB Design-for-X Instructor/Speaker: Francis Mullany, Director of Roadmapping, iNEMI Instructor/Speaker: Jasbir Bath, Owner, Bath Consultancy Instructor/Speaker: Tarja Rapala, Technology Director, EIPC Instructor/Speaker: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation Event Type: Special Event Location: 303C
Tue, Apr 9, 2024 - 1:30 PM to 6:00 PM IPC Design Competition Finals Event Type: Standards Development Meeting Location: 213B
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM S05: QRTI 1: Inspection and Test 1 Instructor/Speaker: Louis Ungar, President, A.T.E. Solutions, Inc. Instructor/Speaker: Yu Hsuan Chen, Hardware Engineer, Intel Corporation Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation Instructor/Speaker: Matthias Zapatka Dipl.-Ing. (FH), CIS, CTO+FAE, INGUN USA, Inc. Focus: Quality, Reliability, Test and Inspection Event Type: Technical Conference Location: 303B Modular RF Test Enclosure / Test Fixture Combinations: Design, Innovations and Characterization Statistical Analysis of Full-scope In-board Electrical Characterization for Partial Plane-on-Outer-L Automatic Testing of High-Speed I/O in Manufacturing
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM S06: High Reliability for Extreme Requirements Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH Instructor/Speaker: Thomas Sanders PhD, Parts Failure Engineer, Jet Propulsion Laboratory Instructor/Speaker: Reza Ghaffarian PhD, Principal Engineer, Jet Propulsion Laboratory Focus: High Reliability Event Type: Technical Conference Location: 304AB Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist QFN Assembly Reliability Under a New HALT Test Method Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM S07: PCB Fab 2: Laminate Materials 1 Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group Instructor/Speaker: Neil Hubble, President, Akrometrix Instructor/Speaker: Mandy Krott, Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH Instructor/Speaker: Tony Senese, Manager, R&D and Business Development, NA, Panasonic Focus: PCB Fabrication Event Type: Technical Conference Location: 304CD Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs HDP Users Group Thermal Analysis Methodology Assessment Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage