Agenda Planner - Programs

Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM D-25A: Design and Test Requirements for High Speed Connectors in High Reliability Applications Committee Chair: Hermann Eicher, Project Manager R&D, EPT GmbH Committee Chair: Robert Kinyanjui, John Deere Electronic Solutions General Committee: High Speed/High Frequency Interconnections Event Type: Standards Development Meeting Location: 213A
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM S01: Sustainability for Electronics 1: Materials Instructor/Speaker: Scarlet Yi Wang, Technical Marketing Director, Shengyi Technology Co., LTD. Instructor/Speaker: Andreas Karch, Technical Manager (Germany, Austria, Switzerland) / Technologist – Advanced Applications, Indium Advanced Material, Indium Corporation Instructor/Speaker: Jennifer Fijalkowski, Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions Instructor/Speaker: Yuntao Li PhD, Lead Scientist, SABIC Instructor/Speaker: Daniel Hamann, Sales Manager Europe and Key Accounts, SMT Thermal Discoveries Focus: Sustainability for Electronics Event Type: Technical Conference Location: 303A Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve Up Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM S02: Design Instructor/Speaker: Savita Ganjigatti, Vice President, SiennaECAD Instructor/Speaker: Chiew Yee Ho, Hardware Engineer, Intel Microelectronics Asia LLC Instructor/Speaker: Meijuan Sarah Kuang, Tech. Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd. Instructor/Speaker: Jimmy Hsu, Principal Engineer, Intel Corporation Instructor/Speaker: Ryan Chang, Engineer, Intel Focus: Design Event Type: Technical Conference Location: 303B Innovative Hybrid Solder Mask for Coupling Reduction in High-Speed Application Impact of CPU Pin Pattern Orientation to High-Speed Interconnect Data Center Board Designs With Inte Latest PCIe Generation PCB Design and simulations: Overcoming Design, Cost, Yield, Technology Tradeo Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM S03: Factory of the Future 1: AI & Machine Learning Instructor/Speaker: Wei Ken Hee, Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd Instructor/Speaker: Ryusuke Ueki, Leader of the AI Research Lab, Qualtec Co., Ltd. Instructor/Speaker: Reinhardt Seidel PhD, Research Assistant, Friedrich-Alexander-Universit Focus: Factory of the Future Event Type: Technical Conference Location: 304AB Machine-Learning Based Solderability Check of THT Solder Joints Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM S04: PCB Fab 1: Flex, Hybrid Instructor/Speaker: Kaspar Tsang, Senior Development Manager of Infrastructure Solutions Group, Lenovo Instructor/Speaker: Lu Xiao, Senior Chief Engineer, Shengyi Electronics Co.,Ltd Instructor/Speaker: Terry Wright, CTO, SHENGYI ELECTRONICS CO., LTD., Dongguan, Guangzhou, China Instructor/Speaker: Gause Hu, Manager, Lenovo Focus: PCB Fabrication Event Type: Technical Conference Location: 304CD The Improvement of Warp in Rigid-Flex Board The Study of Resin Flow Indentation for Rigid-Flex PCB Study on the Influencing Factors of Interlayer Reliability of Rigid-Flex Board with Multiple Air-Gap Asymmetric Hybrid Printed Circuit Board Design and Flexibility Study for High-speed Data Center Plat
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM V-TSL: Technology Solutions Committee Committee Chair: Michael Carano, VP Technology and Bus. Dev, IPC Event Type: Standards Development Meeting Location: 209A
Tue, Apr 9, 2024 - 12:00 PM to 1:30 PM Tuesday Luncheon \| IPC Annual Meeting and Awards Event Type: Special Event Location: Ballroom D
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM 2-12D: Digital Sustainability Credentials Standard Task Group General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 213A
Tue, Apr 9, 2024 - 1:30 PM to 5:00 PM 5-22F: IPC-HDBK-001 Task Group Committee Chair: John Mastorides, Principle Product Design Engineer, Honeywell Aerospace Committee Chair: Scott Meyer, Collins Aerospace General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 207B
Tue, Apr 9, 2024 - 1:30 PM to 3:00 PM 5-32E: CAF Task Group Committee Chair: Karl Sauter, Principal Engineer, Oracle America, Inc. General Committee: Product Reliability Event Type: Standards Development Meeting Location: 207D