Tue, Apr 9, 2024 - 9:45 AM to 10:00 AM
Ribbon Cutting
Event Type: Special Event
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Committee Chair: Richard Snogren, President, Bristlecone LLC
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 207C
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
General Committee: Base Materials
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 10:00 AM to 5:00 PM
3-14A: IC substrate Task Group
Committee Chair: Gang Liu, Shennan Circuits Co. Ltd.
Event Type: Standards Development Meeting
Location: 210B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
5-33B: Solder Mask Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 10:00 AM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Committee Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Committee Chair: Jason Keeping, Project Manager, Ruggedized Electronics, Celestica International L.P.
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Committee Chair: Zhiman Susann Chen, Senior Engineer, ZhuZhou CRRC Times Electric Co., Ltd.
General Committee: Process Control
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-31BT: IPC-A-610 Training Committee
Committee Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Committee Chair: Marie Parliman, Technical Instructor, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 213D
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Committee Chair: Joseph Kane, Sr. Principal Engineer, BAE Systems
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 207B
Tue, Apr 9, 2024 - 10:00 AM to 12:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
Committee Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
General Committee: High Speed/High Frequency Interconnections
Event Type: Standards Development Meeting
Location: 207A