Agenda Planner - Programs

Mon, Apr 8, 2024 - 1:30 PM to 3:00 PM D-61B/D-64B: Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification joint meeting Committee Chair: Jeff Shubrooks, Raytheon Company General Committee: Printed Electronics Event Type: Standards Development Meeting Location: 207C
Mon, Apr 8, 2024 - 1:30 PM to 5:00 PM E-31A Generic Requirements for Declaration Process Management Task Group Committee Chair: Randall Flinders, Compliance Specialist, GreenSoft Technology Inc. Committee Chair: Walter Jager, Principal Consultant, ECD Compliance General Committee: Materials and Supplier Declarations Committee Location: 209A
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD22: Ask the Flexperts Design through Test with Lessons Learned, Part 2 Instructor/Speaker: Nick Koop, Director of Flex Technology, TTM Technologies Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc. Focus: PCB Fabrication and Materials Event Type: Professional Development Location: 303A PD22: Ask the Flexperts Design through Test with Lessons Learned, Part 2
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD23: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Board Talk Part 2 Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting Instructor/Speaker: Phil Zarrow, President, ITM Consulting Focus: Assembly Process and Materials Event Type: Professional Development Location: 303B PD23: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Bo
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD24: Basics of Ultrasonic Metal Welding and its Applications Instructor/Speaker: Greg Ruscak, Application and Engineering Manager, Telsonic Focus: Assembly Process and Materials Event Type: Professional Development Location: 303C PD24: Basics of Ultrasonic Metal Welding and its Applications
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD25: Introduction to Machine Data Analytics in the EMS Industry Instructor/Speaker: Tim Burke PhD, Chief Technology Officer, Arch Systems Inc Focus: Factory of the Future Event Type: Professional Development Location: 303D PD25: Introduction to Machine Data Analytics in the EMS Industry
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD26: 3D Package Technology and Assembly Processes Instructor/Speaker: Tom Dory PhD, Consultant and (Retired) R&D Manager, Fujifilm Electronic Materials USA Focus: Assembly Process and Materials Event Type: Professional Development Location: 304D PD26: 3D Package Technology and Assembly Processes
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD27: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D and 3D System-in-Packaging and Ultra High-Density Interposer Development Instructor/Speaker: Vern Solberg, Design Engineer, STC Focus: Design Event Type: Professional Development Location: 304C PD27: PCB Design Engineers Introduction to High Density Semiconductor Package Technologies- 2D, 2.5D
Mon, Apr 8, 2024 - 1:30 PM to 4:30 PM PD28: Fundamentals of Thermal Interface Material Instructor/Speaker: Rita Mohanty PhD, Senior Scientific Principal, Henkel Focus: Assembly Process and Materials Event Type: Professional Development Location: 304AB PD28: Fundamentals of Thermal Interface Material-1 PD28: Fundamentals of Thermal Interface Material-2 PD28: Fundamentals of Thermal Interface Material-3 PD28: Fundamentals of Thermal Interface Material-4 PD28: Fundamentals of Thermal Interface Material-5
Mon, Apr 8, 2024 - 3:15 PM to 5:00 PM 2-19A: Critical Components Traceability Task Group General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 207C