Agenda Planner - Programs

Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Board Talk Part 1 Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting Instructor/Speaker: Phil Zarrow, President, ITM Consulting Focus: Assembly Process and Materials Event Type: Professional Development Location: 303B PD16: Troubleshooting and Process Optimization: Lessons Learned from the Trenches and a Decade of Bo
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards Instructor/Speaker: Philippe Jaeckle PhD, Senior Expert, Robert Bosch GmbH Instructor/Speaker: Corina Stocker, Senior Expert, Continental Instructor/Speaker: Heike Woldt, Head of Product Development Press-fit Technology, Diehl Metal Applications Instructor/Speaker: Frank Uibel, CEO, Uibel Consulting Instructor/Speaker: Hermann Eicher, Project Manager R&D, EPT GmbH Instructor/Speaker: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity Focus: Assembly Process and Materials Event Type: Professional Development Location: 303C PD17: Press-fit Technology Value Chain, Design, Physics, Process and Standards
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Instructor/Speaker: Ray Prasad, President, Ray Prasad Consultancy Group Focus: Assembly Process and Materials Event Type: Professional Development Location: 303D PD18: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN,
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD19: Chiplet Design and Heterogeneous Integration (SiP) Instructor/Speaker: John Lau PhD, Sr. Special Project Assistant, Unimicron Focus: Design Event Type: Professional Development Location: 304D PD19: Chiplet Design and Heterogeneous Integration (SiP)
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD20: Flex Circuit ‘Design for Manufacturing Principles’ Circuit Design, Fabrication and SMT Assembly Processing Instructor/Speaker: Vern Solberg, Design Engineer, STC Focus: Design Event Type: Professional Development Location: 304C PD20: Flex Circuit ‘Design for Manufacturing Principles’
Mon, Apr 8, 2024 - 9:00 AM to 12:00 PM PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities Instructor/Speaker: Jennie Hwang PhD, CEO, H-Technologies Group Focus: Factory of the Future Event Type: Professional Development Location: 304AB PD21: Artificial Intelligence Era: Opportunities, Challenges, Possibilities
Mon, Apr 8, 2024 - 10:00 AM to 5:00 PM 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 213A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM 2-17A: IPC-CFX Standard Task Group Committee Chair: Thomas Marktscheffel, Director of R&D, ASMPT GmbH & Co. KG General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 208A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM 5-23A: Printed Board Solderability Committee Chair: Ernst Eggelaar, CEO, Microtronic Committee Chair: Gerard O'Brien, Solderability Testing & Solutions, Inc. General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 207A
Mon, Apr 8, 2024 - 10:15 AM to 12:00 PM D-55/D-55A: Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group Committee Chair: Bhanu Sood PhD, Deputy Chief Technologist, Office of the Director, NASA Goddard Space Flight Center Committee Chair: Raj Kumar, Northrop Grumman Space Systems General Committee: Embedded Devices Event Type: Standards Development Meeting Location: 207D