Agenda Planner - Programs

Wed, Apr 10, 2024 - 1:30 PM to 3:00 PM S22: PCB Fab 6: Printed Board Platings and Finishes 1 Instructor/Speaker: Rick Nichols, Technical Marketing Director, Greensource Instructor/Speaker: Mike Feng, Technical Expert, Founder PCB Instructor/Speaker: Sean Shi, Global FAE Manager, Shennan Circuits Co., Ltd Focus: PCB Fabrication Event Type: Technical Conference Location: 303C Study of Hole Wall Cracking Defects in Power Module Heavy Copper Printed Circuit Boards Study on Carbon Removal of Shadow Residue from Flexible Plate Surface in Rigid-Flex PCB A Study of the Impacts of Physical Parameters on Electrolytic Panel Plating
Wed, Apr 10, 2024 - 1:45 PM to 3:15 PM Strategic Workforce Development: Navigating Apprenticeships and Beyond – Tailored Insights for California Employers Event Type: Special Event Location: 209A
Wed, Apr 10, 2024 - 2:30 PM to 3:30 PM Ice Cream Social on the Show Floor Event Type: Special Event Location: Exhibit Halls C & D
Wed, Apr 10, 2024 - 2:30 PM to 3:30 PM Network with Poster Presenters on the Show Floor(During Ice Cream Social) Event Type: Poster Presentations Location: Exhibit Halls C & D-Aisle 700
Wed, Apr 10, 2024 - 3:00 PM to 5:00 PM 7-25B AOI Process Control for IC Substrates Standard Task Group Committee Chair: Botao Zhang General Committee: Process Control Event Type: Standards Development Meeting Location: 207A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM 5-21JND Solder Paste Printing Task Group Committee Chair: Henrik Blegvad Jensen, Gaasdal Bygningsindustri A/S Committee Chair: Scott Pinney, Grundfos Holding A/S Location: 209B
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM 7-31N: Manual Magnification Aides Task Group Committee Chair: Leo Lambert, Vice President, EPTAC Corporation Event Type: Standards Development Meeting Location: 210A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM B-10A: Plastic Chip Carrier Cracking Task Group Committee Chair: Christina Landon, Engineer, Naval Surface Warfare Ctr Committee Chair: Steve Martell, Nordson ASYMTEK General Committee: Packaged Electronic Components Event Type: Standards Development Meeting Location: 213A
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM D-13: Flex Circuits Base Materials Committee Chair: Richard Wessel, Technical Supervisor, DuPont Electronics & Imaging General Committee: Flexible and Rigid-Flex Printed Boards Event Type: Standards Development Meeting Location: 213D
Wed, Apr 10, 2024 - 3:15 PM to 5:00 PM D-21C: High Speed/High Frequency Controlled Impedance T.G General Committee: High Speed/High Frequency Interconnections Event Type: Standards Development Meeting Location: 207C