Agenda Planner - Programs

Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM

Focus: Quality, Reliability, Test and Inspection

Event Type: Technical Conference

Location: 303A

Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for P

Experimental Verification of Optimized Signal Integrity Test Coupon to Achieve Accurate Measurements

Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM

S16: Assembly Processes 2

Instructor/Speaker: Gerjan Diepstraten, Advanced Technology Manager, ITWEAE

Instructor/Speaker: Miloš Lazic, Product Development Specialist, Indium Corporation

Instructor/Speaker: Adam Klett PhD, Director of Science, KYZEN Corporation

Instructor/Speaker: Sunny Agarwal, Sr. Applications Engineer, ITWEAE

Focus: Assembly Processes

Event Type: Technical Conference

Location: 303B

Reflow Soldering of PCB Components With Mixed Thermal Mass

Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing

Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications

Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM

S17: PCB Fab 5

Instructor/Speaker: Saminda Dharmarathna PhD, Principal Research Scientist, Macdermid Alpha Electronics Solutions

Instructor/Speaker: Zhi Chao Zhang, Senior engineer, Delton Technology (Guang Zhou) Inc.

Instructor/Speaker: Kunal Shah PhD, President, LILOTREE

Focus: PCB Fabrication

Event Type: Technical Conference

Location: 303C

Advancing Copper Electroplating Processes: Innovative Solutions for Excellent Via Fill and V-Pit Res

A Novel Ni Free Surface Finish Capable of Resisting Copper Creep Corrosion for Better Solder Joint R

High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard

Wed, Apr 10, 2024 - 10:30 AM to 12:00 PM

S18: HDI, uHDI AND SUBSTRATES 1

Instructor/Speaker: Manuel Galvez, Product Marketing Manager, MKS Instruments, Inc.

Instructor/Speaker: Reginald Lai, Packaging R&D Engineer, Intel Corporation

Instructor/Speaker: Kyle Baker, Product Marketing Specialist, MKS Instruments

Instructor/Speaker: Samuel Oladji, Packaging RD Engineer, Intel Corporation

Focus: HDI, uHDI and Substrates

Event Type: Technical Conference

Location: 304AB

Vacuum Etch Technology for Fine Line Width and Space in PCBs

Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization

Maximize Throughput With Innovative Laser/optics Configuration, Precision Pulse Shaping, and Steerin

Wed, Apr 10, 2024 - 12:00 PM to 1:30 PM

The Future of the Human Workforce: Maximizing Potential in an Automated World

Instructor/Speaker: Dr. John W. Mitchell, IPC President and CEO, IPC

Event Type: Special Event

Location: Ballroom D

Wed, Apr 10, 2024 - 1:30 PM to 5:00 PM

5-21N: Cold Joining/Press-fit Handbook Task Group

Committee Chair: Erika Crandall PhD, Principal R&D Development Engineer, TE Connectivity

Committee Chair: Udo Welzel PhD, Senior Expert, Robert Bosch GmbH

General Committee: Assembly and Joining