Agenda Planner - Programs

Wed, Apr 10, 2024 - 9:15 AM to 4:15 PM Taiwan High-Tech Forum Committee Chair: Jimmy Hsu, Principal Engineer, Intel Corporation Instructor/Speaker: Scott Chen, Vice Chairman, TPCA Instructor/Speaker: Kathy Yan PhD, Director, TSMC Instructor/Speaker: Nicholas Kao, Department Manager, SPIL Committee Chair: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions Instructor/Speaker: Matt Kelly, CTO & VP Technology Solutions, IPC Instructor/Speaker: Chi-Ho Kuan PhD, Sr. Dir. Business Development, Unimicron Instructor/Speaker: Ting-Hao Lin, Senior Director, Kinsus Instructor/Speaker: Jhih-Hong Cheng PhD, Project Leader Engineer, CHPT Instructor/Speaker: Randy Wu PhD, Manager, ITRI EOSL Instructor/Speaker: Gary Cheng, Assistant Manager, EMC Instructor/Speaker: Mark Shields, USA Marketing Director, Nan Ya Plastics Corporation Instructor/Speaker: Chiou Kuo-Chan PhD, Deputy General Director, ITRI MCL Instructor/Speaker: Chung Chih-Yeh PhD, Senior Specialist, Nanya PCB Instructor/Speaker: Harry Yang PhD, General Manager, MacDermid Alpha Electronic Solutions Event Type: Special Event Location: Ballroom A Taiwan High-Tech Forum1 Taiwan High-Tech Forum2 Taiwan High-Tech Forum3
Wed, Apr 10, 2024 - 9:30 AM to 11:30 AM mmWave Material and Test Roadmap and Standard Development Instructor/Speaker: Urmi Ray, mmWave Project Lead, iNEMI Instructor/Speaker: Lucas Enright, PhD Student, Professional Research Experience Program (PREP) Associate, National Institute of Standards and Technology (NIST) Instructor/Speaker: Marzena Olszewska-Placha, Vice President for Research and Development, QWED Instructor/Speaker: Shekhar Chandrashekhar, CEO, iNEMI Event Type: Special Event Location: 209B
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM 1-14: DFX Standards Subcommittee Committee Chair: Kevin Kusiak, LM Associate Fellow, Lockheed Martin Corporation Committee Chair: Pietro Vergine, President, Advanced Rework Technology Committee Chair: Stephen Golemme, Manufacturing Engineer, ITX Inc. General Committee: Printed Board Design Technology Event Type: Standards Development Meeting Location: 207C
Wed, Apr 10, 2024 - 10:00 AM to 12:00 PM 5-24A: Flux Specification Task Group Committee Chair: Anthony Lentz, Chemist / Field Application, FCT Assembly, Inc. General Committee: Assembly and Joining Event Type: Standards Development Meeting Location: 208A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM 2-12A: Generic Requirements for Digital Twin Task Group General Committee: Electronic Product Data Description Event Type: Standards Development Meeting Location: 213B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM 3-11J: Metal Based Laminates for Printed Boards Committee Chair: Minsu Lee, Manager, Korea Packaging Integration Association General Committee: Base Materials Event Type: Standards Development Meeting Location: 207A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM 7-12: Microsection Subcommittee Committee Chair: Allen Keeney, Johns Hopkins University General Committee: Testing Event Type: Standards Development Meeting Location: 213A
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM 7-31AT & D-33AT: IPC-A-600 and IPC-6012 Training Joint Meeting Committee Chair: Jamie Noland, Marketing Manager/MIT, Blackfox Training Institute Committee Chair: Leo Lambert, Vice President, EPTAC Corporation General Committee: Product Assurance Event Type: Standards Development Meeting Location: 210B
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM 7-31K/7-31H: Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting Committee Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center General Committee: Product Assurance Event Type: Standards Development Meeting Location: 207D
Wed, Apr 10, 2024 - 10:15 AM to 12:00 PM D-12: Flexible Printed Circuits Performance Subcommittee Committee Chair: Nick Koop, Director of Flex Technology, TTM Technologies General Committee: Flexible and Rigid-Flex Printed Boards Event Type: Standards Development Meeting Location: 213D