Tue, Apr 9, 2024 - 2:00 PM to 3:00 PM
Make Workforce Training Your Competitive EDGE
Event Type: Special Event
Location: 209A
Tue, Apr 9, 2024 - 3:00 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Committee Chair: Frank Honyotski, Instructor, STI Electronics, Inc.
General Committee: Product Assurance
Event Type: Standards Development Meeting
Location: 208B
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Committee Chair: Shuming Gao, Professor, Zhejiang University
Committee Chair: Victor Xu, Huawei Technologies Co. Ltdol
Committee Chair: Zhiqian Sang, Hangzhou Dianzi University
General Committee: Electronic Product Data Description
Event Type: Standards Development Meeting
Location: 213A
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Milea Kammer, Engineering Manager, Honeywell International
General Committee: Assembly and Joining
Event Type: Standards Development Meeting
Location: 207D
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Committee Chair: Brian Chislea, AETS, Dow Corning
Committee Chair: Torrey Clark, Technical Service and Development Engineer, Dow Corporation
General Committee: Cleaning and Coating
Event Type: Standards Development Meeting
Location: 210CD
Tue, Apr 9, 2024 - 3:15 PM to 5:00 PM
EMS Steering Committee
Event Type: Standards Development Meeting
Location: 210A
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S08: Sustainability for Electronics 2: Life Cycle Assessment
Instructor/Speaker: Outi Rusanen MSc, LicSc, DSc (Tech.), Principal Interconnection Specialist, TactoTek
Instructor/Speaker: Maarten Cauwe PhD, R&D Team Leader, imec
Focus: Sustainability for Electronics
Event Type: Technical Conference
Location: 303A
Sustainable Smart Surfaces
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S09: QRTI 2: Inspection and Test 2
Instructor/Speaker: Marius Tarnovetchi, Senior Expert, VItesco Technologies
Instructor/Speaker: Malgorzata Celuch PhD, President, QWED Sp. z o. o.
Instructor/Speaker: Lothar Henneken PhD, Senior Expert, Robert Bosch GmbH
Focus: Quality, Reliability, Test and Inspection
Event Type: Technical Conference
Location: 303B
Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - A Revealin
Monotonic Bend Characterization of Board-Level Solder Interconnects with Finite Element Analyses
Tue, Apr 9, 2024 - 3:30 PM to 5:00 PM
S10: PCB Fab 3: Laminate Materials 2
Instructor/Speaker: Gary Brist, Sr. Principal Engineer PCB Applications, Intel & Board of Directors Chair, HDP User Group
Instructor/Speaker: JingHui Peng, Manager, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: CanJun Xiang, Senior Engineer, Delton Technology(GuangZhou) Inc.
Instructor/Speaker: Kevin Bivona, R&D Lab Manager, AGC Multi Material America
Focus: PCB Fabrication
Event Type: Technical Conference
Location: 304CD
Managing Backdrill Stub Length Variations due to Innerlayer Core Deformation
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Research on High-Speed Material Insertion Loss in Server Platform
Tue, Apr 9, 2024 - 5:00 PM to 6:00 PM
Network with Poster Presenters on the Show Floor(During Show Floor Reception)
Event Type: Poster Presentations
Location: Exhibit Halls C & D-Aisle 700